Heat exchanger and method of repairing thereof

US9700967B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9700967-B2
Application numberUS-201414209892-A
CountryUS
Kind codeB2
Filing dateMar 13, 2014
Priority dateMar 13, 2014
Publication dateJul 11, 2017
Grant dateJul 11, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat exchanger includes a fluid circuit including a fluid inlet manifold, a fluid outlet manifold, and fluid heat exchange channels fluidly connected between the fluid inlet manifold and the fluid outlet manifold. Each channel has an interior, and walls with an inside surface. A method of repairing the heat exchanger includes pumping an epoxy varnish into the interior of at least one of the heat exchange channels; filling in at least one of a) one or more cracks in the walls of the at least one channel, b) one or more apertures in the walls of the at least one channel, or c) one or more spaces between the at least one channel and another component of the heat exchanger with the epoxy varnish; and heating the at least one channel to a temperature in an approved predetermined epoxy varnish temperature range.

First claim

Opening claim text (preview).

We claim: 1. A fluid circuit for a heat exchanger, comprising: a fluid inlet manifold; a fluid outlet manifold; at least one fluid channel fluidly connected between the fluid inlet manifold and the fluid outlet manifold, the at least one fluid channel including: at least one of an aperture and a crack, and an interior wall having an inside surface that extends beyond a perimeter of the at least one of the aperture and the crack; and a hardened epoxy varnish coating at least a portion of the inside surface that extends beyond the perimeter of the at least one of the aperture and the crack and filling in the at least one of the aperture and the crack; wherein the thickness of the hardened epoxy varnish is between 5 microns and 25 microns. 2. The fluid circuit for a heat exchanger of claim 1 , wherein the at least one fluid channel includes aluminum. 3. The fluid circuit for a heat exchanger of claim 1 , wherein the at least one fluid channel includes one or more cylindrically shaped tubes. 4. The fluid circuit for a heat exchanger of claim 1 , wherein the dried epoxy varnish coating includes a heat cured, water reducible, and heat resistant epoxy-phenolic varnish.

Assignees

Inventors

Classifications

  • by welding · CPC title

  • Arrangements for sealing leaky tubes and conduits (stopping flow from or in pipes in general F16L55/10) · CPC title

  • Repairing, converting, servicing or salvaging · CPC title

  • by using bonding or sealing substances, e.g. adhesives (F28F9/18 takes precedence) · CPC title

  • by using adhesives · CPC title

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Frequently asked questions

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What does patent US9700967B2 cover?
A heat exchanger includes a fluid circuit including a fluid inlet manifold, a fluid outlet manifold, and fluid heat exchange channels fluidly connected between the fluid inlet manifold and the fluid outlet manifold. Each channel has an interior, and walls with an inside surface. A method of repairing the heat exchanger includes pumping an epoxy varnish into the interior of at least one of the h…
Who is the assignee on this patent?
Honeywell Int Inc
What technology area does this patent fall under?
Primary CPC classification B23P6/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).