Power module packaging structure and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9698701-B2
Application number	US-201615168235-A
Country	US
Kind code	B2
Filing date	May 30, 2016
Priority date	Jun 1, 2015
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.

First claim

What is claimed is:

1. A power module packaging structure comprising:
a first conducting layer;
a first insulating layer disposed above the first conducting layer;
a second conducting layer disposed above the first insulating layer;
a first power device disposed on the first conducting layer; and
a first controlling device disposed on the second conducting layer and used for controlling the first power device;
wherein the first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop, a direction of a current that flows through the first conducting layer in the loop is opposite to a direction of a current that flow through the second conducting layer in the loop.

2. The power module packaging structure of claim 1 , wherein a thickness of the first insulating layer is 25 micrometers (um) to 1 millimeter (mm).

3. The power module packaging structure of claim 1 , wherein a ratio of an area of a vertical projection of the second conducting layer onto the first conducting layer to an area of the second conducting layer is greater than 50%.

4. The power module packaging structure of claim 1 , wherein the second conducting layer is coupled to the first conducting layer via a conducting member.

5. The power module packaging structure of claim 4 , wherein the first power device is coupled to the first conducting layer via a first connecting member;
wherein the power module packaging structure further comprises:
a second power device disposed on the first conducting layer, and coupled to the first conducting layer via a second connecting member.

6. The power module packaging structure of claim 5 , further comprising:
a first driving circuit and a second driving circuit disposed on the second conducting layer and being independent of the first controlling device.

7. The power module packaging structure of claim 4 , further comprising:
a second controlling device disposed on the second conducting layer and being coupled to the second conducting layer via a third connecting member.

8. The power module packaging structure of claim 1 , further comprising a substrate, the substrate comprising the first conducting layer, the first insulating layer, and the second conducting layer.

9. The power module packaging structure of claim 8 , wherein the substrate further comprises.
a third conducting layer; and
a second insulating layer disposed on the third conducting layer;
wherein the first conducting layer is disposed on the second insulating layer.

10. The power module packaging structure of claim 1 , further comprising a first substrate and a second substrate, wherein the second substrate is disposed above the first substrate, and the first substrate and the second substrate being connected via conductive connection material; wherein the first substrate comprises the first conducting layer, and the second substrate comprises the second conducting layer and the first insulating layer.

11. The power module packaging structure of claim 10 , wherein the first substrate further comprise:
a third conducting layer; and
a second insulating layer disposed on the third conducting layer, and the first conducting layer being disposed on the second insulating layer;
wherein the second substrate further comprises:
a fourth conducting layer, the first insulating layer being disposed on the fourth conducting layer, wherein the fourth conducting layer is connected to the first conducting layer via conductive connection material.

12. The power module packaging structure of claim 11 further comprising:
a third substrate and a fourth substrate, the fourth substrate being disposed above the third substrate, and the third substrate and the fourth substrate being connected via conductive connection material, wherein the third substrate has a same structure as the first substrate, and the fourth substrate has a same structure as the second substrate.

13. The power module packaging structure of claim 12 , further comprising a substrate carrier, the first substrate and the second substrate being disposed above the substrate carrier, the first substrate being connected to the substrate carrier via conductive connection material;
the third substrate and the fourth substrate being disposed above the substrate carrier, and the third substrate being connected to the substrate carrier via a conductive connection material;
wherein the first substrate and the third substrate are connected via conductive connection material.

14. A manufacturing method for a power module packaging structure comprising:
forming a first conducting layer;
forming a first insulating layer above the first conducting layer;
forming a second conducting layer above the first insulating layer;
forming a first power device on the first conducting layer;
forming a first controlling device on the second conducting layer, wherein the first controlling device is used for controlling the first power device; and
making the first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop, wherein a direction of a current that flows through the first conducting layer in the loop is opposite to a direction of a current that flows through the second conducting layer in the loop.

15. The manufacturing method for the power module packaging structure of claim 14 , wherein a thickness of the first insulating layer is 25 micrometers (um) to 1 millimeter (mm).

16. The manufacturing method for the power module packaging structure of claim 14 , wherein a ratio of an area of a vertical projection of the second conducting layer onto the first conducting layer to an area of the second conducting layer is greater than 50%.

17. The manufacturing method for the power module packaging structure of claim 14 , further comprising:
coupling the first conducting layer to the second conducting layer via conducting member.

18. The manufacturing method for the power module packaging structure of claim 14 , further comprising:
forming a substrate, wherein the substrate comprises the first conducting layer, the first insulating layer, and the second conducting layer.

19. The manufacturing method for the power module packaging structure of claim 14 , further comprising:
forming a first substrate, wherein the first substrate comprises the first conducting layer; and
forming a second substrate above the first substrate, wherein the second substrate comprises the second conducting layer and the first insulating layer.

20. The manufacturing method for the power module packaging structure of claim 19 , further comprising:
forming a third conducting layer; and
forming a second insulating layer on the third conducting layer, and forming the first conducting layer on the second insulating layer;
wherein the step of forming the second substrate further comprises:
forming a fourth conducting layer of the second substrate, wherein the first insulating layer is disposed on the fourth conducting layer, wherein the fourth conducting layer is connected to the first conducting layer via conductive connection material.

21. The manufacturing method for the power module packaging structure of claim 20 , further comprising:
forming a third substrate, wherein the third substrate has a same structure as the first substrate; and
forming a fourth substrate above the third substrate, and the third substrate and the fourth substrate being connected via conductive conn

Assignees

• Delta Electronics Inc

Inventors

• Li Zeng
• Lu jun-cheng
• Wang Tao
• Wan zheng-fen
• Zhao zhen-qing

Classifications

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/00

  Package configurations · CPC title