Connector and substrate interconnection structure

Patent metadata

Field	Value
Publication number	US-9698508-B2
Application number	US-201615086259-A
Country	US
Kind code	B2
Filing date	Mar 31, 2016
Priority date	Apr 1, 2015
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A plug connector electrically connected to a socket connector includes a movable housing engaged with the socket connector; a fixed housing secured to a first substrate; and a plug terminal having a plug contact portion in electrical contact with the socket connector engaged with the movable housing, and a movable part configured to support the fixed housing such that the fixed housing can be displaced with respect to the movable housing in engaging and disengaging directions of the socket connector with respect to the movable housing, while maintaining the contact of the plug contact portion with the socket connector.

First claim

What is claimed is:

1. A substrate interconnection structure comprising:
a first substrate;
a second substrate disposed opposite the first substrate at a predetermined distance therefrom;
a connector secured to the first substrate; and
a connection object secured to the second substrate, the connection object being electrically connected to the connector,
wherein the connector includes an engagement-side housing engaged with the connection object, a substrate-side housing secured to the first substrate, and a first terminal having a first contact portion in electrical contact with the connection object engaged with the engagement-side housing and a movable piece elastically connecting the engagement-side housing to the substrate-side housing; and
when at least one of the first substrate and the second substrate warps in engaging and disengaging directions of the connection object with respect to the engagement-side housing, the movable piece elastically supports the substrate-side housing displaced in response to movement of the first substrate, while maintaining the contact of the first contact portion with the connection object.

2. The substrate interconnection structure according to claim 1 , wherein the engagement-side housing has an abutting portion configured to abut against the first substrate; and
one of the engagement-side housing and the connection object has an engagement gap so that, when at least one of the first substrate and the second substrate warps in a direction of reducing the distance therebetween to cause the abutting portion of the engagement-side housing to be pressed in by the first substrate, the engagement-side housing and the connection object are engaged with each other at a deeper position.

3. The substrate interconnection structure according to claim 2 , wherein the substrate interconnection structure has a movement gap between the first substrate and the engagement-side housing.

4. The substrate interconnection structure according to claim 2 , wherein the substrate interconnection structure has a movement gap between the substrate-side housing and the engagement-side housing.

5. The substrate interconnection structure according to claim 2 , wherein the movable piece elastically supports the substrate-side housing displaced when at least one of the first substrate and the second substrate warps in a direction of increasing the distance therebetween.

6. The substrate interconnection structure according to claim 2 , wherein the movable piece elastically supports the substrate-side housing displaced when at least one of the first substrate and the second substrate warps in a direction of reducing the distance therebetween.

7. The substrate interconnection structure according to claim 1 , wherein the engagement-side housing has an abutting portion configured to abut against the substrate-side housing; and
one of the engagement-side housing and the connection object has an engagement gap so that, when at least one of the first substrate and the second substrate warps in a direction of reducing the distance therebetween to cause the abutting portion of the engagement-side housing to be pressed in by the substrate-side housing, the engagement-side housing and the connection object are engaged with each other at a deeper position.

8. The substrate interconnection structure according to claim 7 , wherein the substrate interconnection structure has a movement gap between the substrate-side housing and the engagement-side housing.

9. The substrate interconnection structure according to claim 7 , wherein the movable piece elastically supports the substrate-side housing displaced when at least one of the first substrate and the second substrate warps in a direction of increasing the distance therebetween.

10. The substrate interconnection structure according to claim 7 , wherein the movable piece elastically supports the substrate-side housing displaced when at least one of the first substrate and the second substrate warps in a direction of reducing the distance therebetween.

Assignees

• Iriso Electronics Co Ltd

Inventors

• Kobayashi Hiroaki
• Ogura Yoshiyuki
• Sato Katsumasa
• Kuniyoshi Koji

Classifications

• H01R12/716 Primary

  Coupling device provided on the PCB · CPC title

• H01R12/91

  allowing relative movement between coupling parts, e.g. floating or self aligning (for coupling devices not specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures, H01R13/6315 takes precedence) · CPC title

• H01R13/533

  Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence) · CPC title

• H01R13/26

  Pin or blade contacts for sliding co-operation on one side only {(for modular jack type connectors H01R24/62)} · CPC title

• H01R13/187

  with spring member in the socket · CPC title