High current interconnect system and method for use in a battery module

Patent metadata

Field	Value
Publication number	US-9698403-B2
Application number	US-201414230737-A
Country	US
Kind code	B2
Filing date	Mar 31, 2014
Priority date	Sep 6, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A printed circuit board (PCB) assembly includes a PCB and a high current interconnect mounted on the PCB. The high current interconnect is configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect includes feet made of a conductive material that are coupled to the PCB. The trace is coupled to the feet via a weld.

First claim

The invention claimed is:

1. A printed circuit board (PCB) assembly comprising:
a PCB; and
a high current interconnect mounted on the PCB and configured to receive a first high current bladed component and a second high current bladed component, wherein the first high current bladed component and the second high current bladed component are electrically coupled to a trace disposed on the PCB after being received by the high current interconnect mount; and
wherein the high current interconnect comprises:
feet coupled to the PCB, the feet comprise a conductive material, and the trace is electrically coupled to the feet;
a frame with a first opening exposing a first pocket and a second opening exposing a second pocket, wherein the first and second openings are disposed on opposite sides of the frame;
a first spring disposed in the first pocket of the frame; and
a second spring disposed in the second pocket of the frame;

wherein the frame extends into the feet; and
wherein the first pocket is configured to receive the first high current bladed component and the second pocket is configured to receive the second high current bladed component.

2. The PCB assembly of claim 1 , wherein each of the first spring and the second spring is a single piece of material bent in a U-shape with two sides facing each other.

3. The PCB assembly of claim 1 , wherein the first spring comprises a first flexible sheet of a conductive material, and the second spring comprises a second flexible sheet of the conductive material.

4. The PCB assembly of claim 1 , wherein the frame comprises a single piece of conductive material.

5. The PCB assembly of claim 1 , wherein the first spring is configured to contact and exert a compressive force on the first high current bladed component and the second spring is configured to contact and exert a compressive force on the second high current bladed component.

6. The PCB assembly of claim 1 , wherein the high current interconnect is configured to mechanically couple to the first and second high current bladed components without the use of a fastener and without the use of a weld.

7. The PCB assembly of claim 1 , wherein the high current interconnect is configured to electrically couple together at least two of a bladed fuse connector, a battery terminal connector, a bus bar, or a high current blade of a contactor.

8. A battery module comprising:
a housing; and
a printed circuit board (PCB) assembly disposed within the housing and comprising:
a PCB comprising a trace leading to a voltage sensor;
a first high current component disposed on a first side of the PCB;
a second high current component disposed on a second side of the PCB; and
a high current interconnect mounted on the PCB and coupled with the first high current component and the second high current component, wherein the first high current component and the second high current component are electrically coupled to the trace via the high current interconnect, wherein the high current interconnect comprises:
a frame with a first opening of a first width exposing a first pocket and a second opening of a second width exposing a second pocket, wherein the first and second openings are disposed on opposite sides of the frame;
a first spring disposed in the first opening pocket of the frame, wherein the first high current interconnect is disposed in contact with the first spring in the first pocket; and
a second spring disposed in the second opening pocket of the frame is disposed in contact with the second spring in the second pocket.

9. The battery module of claim 8 , wherein the first spring is configured to exert a compressive force on the first high current component disposed in the first pocket, and wherein the second spring is configured to exert a compressive force on the second high current component disposed in the second pocket.

10. The battery module of claim 8 , wherein the first width is larger than the second width.

11. The battery module of claim 8 , wherein each of the first and second high current components comprises a bladed component.

12. The battery module of claim 8 , wherein the battery module further comprises a plurality of battery cells disposed within the housing and below the PCB assembly, and wherein the high current interconnect extends between the PCB and the plurality of battery cells.

13. The battery module of claim 8 , wherein the battery module further comprises a plurality of battery cells disposed within the housing and below the PCB assembly, and wherein the high current interconnect extends above the PCB.

14. The battery module of claim 11 , wherein each bladed component is coupled to the high current interconnect without the use of a fastener and without the use of a weld.

15. The battery module of claim 11 , wherein the bladed component of the first high current component is disposed in the first pocket of the frame on a first side of the high current interconnect and the bladed component of the second high current component is disposed in the second pocket of the frame on a second side of the high current interconnect opposite the first side.

16. The battery module of claim 11 , wherein each bladed component comprises a bladed fuse connector, a battery terminal connector, a bus bar, or a high current blade of a contactor.

17. A method of manufacturing a battery module, comprising:
mounting a high current interconnect to a PCB of the battery module, the high current interconnect comprising a frame with a first opening of a first width exposing a first pocket and a second opening of a second width exposing a second pocket;
shaping a single piece of conductive material into the frame;
inserting a first spring into the frame;
inserting a second spring into the frame;
shaping the first spring to form the first pocket;
shaping the second spring to form the second pocket;
compressing the frame to form the first opening exposing the first pocket; and
compressing the frame to form the second opening exposing the second pocket;
disposing a first high current component in the first pocket;
disposing a second high current component in the second pocket, wherein disposing the first high current component in the first pocket comprises inserting a first bladed component into the first pocket and disposing the second high current component in the second pocket comprises inserting a second bladed component into the second pocket; and
electrically coupling the first high current component and the second high current component to one another and to a trace disposed on the PCB.

18. The method of claim 17 , wherein compressing the frame comprises stamping the frame.

19. The method of manufacture of claim 17 , wherein the first spring comprises a first flexible sheet of a conductive material and the second spring comprises a second flexible sheet of the conductive material.

20. The method of claim 17 , wherein the first width is larger than the second width.

21. The method of claim 17 , wherein mounting the high current interconnect to the PCB comprises disposing electrically conductive feet of the frame into openings in the PCB and welding the feet to the PCB.

Assignees

• Johnson Controls Tech Co

Inventors

• Soleski Edward J
• Dekeuster Richard M
• Thieme Bryan L
• Dulle Ronald J
• Balk Mikhail S

Classifications

• B60L58/24

  for controlling the temperature of batteries · CPC title

• B60L58/15

  Preventing overcharging · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/0218

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title