Copolymer and resin composition, packaging film and package structure including the same

Patent metadata

Field	Value
Publication number	US-9698377-B1
Application number	US-201615386400-A
Country	US
Kind code	B1
Filing date	Dec 21, 2016
Priority date	May 6, 2016
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A copolymer according to the present disclosure is provided, which includes 30 to 80 mol % of a repeating unit represented by formula (I), 5 to 25 mol % of a repeating unit represented by formula (II), and 5 to 30 mol % of a repeating unit represented by formula (III):

wherein R 1 is C6-C13 aryl group, C7-C13 aralkyl group, C6-C8 halogenated aryl group or C7-C8 aryloxyalkyl group; R 3 is C3-C16 alkyl group or C3-C6 alkoxy substituted alkyl group; R 5 is a single bond or C1-C3 alkylene group, R 6 and R 7 are independently C1-C3 alkoxy group, R 8 is polysiloxane with methyl and phenyl groups; and R 2 , R 4 and R 9 are independently hydrogen or methyl. In addition, a resin composition, a packaging film and a package structure including the same are provided.

First claim

What is claimed is:

1. A copolymer comprising 30 to 80 mol % of a repeating unit represented by formula (I), 5 to 25 mol % of a repeating unit represented by formula (II), and 5 to 30 mol % of a repeating unit represented by formula (III):

wherein,
R 1 is C6-C13 aryl group, C7-C13 aralkyl group, C6-C8 halogenated aryl group or C7-C8 aryloxyalkyl group;
R 3 is C3-C16 alkyl group or C3-C6 alkoxy substituted alkyl group;
R 5 is a single bond or C1-C3 alkylene group;
R 6 and R 7 are independently C1-C3 alkoxy group;
R 8 is polysiloxane with methyl and phenyl groups; and
R 2 , R 4 and R 9 are independently hydrogen or methyl.

2. The copolymer as claimed in claim 1 , further comprising a repeating unit represented by formula (IV):

wherein,
R 10 is hydrogen, methyl, hydroxyethyl or hydroxypropyl; and R 11 is hydrogen or methyl.

3. The copolymer as claimed in claim 1 , wherein the copolymer comprises 30 to 50 mol % of a repeating unit represented by formula (I), 5 to 25 mol % of a repeating unit represented by formula (II), 5 to 30 mol % of a repeating unit represented by formula (III), and 10 to 30 mol % of a repeating unit represented by formula (IV).

4. The copolymer as claimed in claim 1 , wherein R 1 is benzyl, phenyl, phenylethyl, chlorophenyl, pentabromophenyl, pentafluorophenyl, tribromophenyl, benzhydryl or phenoxyethyl.

5. The copolymer as claimed in claim 1 , wherein R 3 is tert-amyl, n-butoxyethyl, tert-butyl, n-butyl, iso-butyl, sec-butyl, iso-decyl, n-decyl, n-dodecyl, ethoxyethoxy ethyl, ethylhexy, hexadecyl, n-hexyl, methoxyethyl, n-octyl or n-propyl.

6. The copolymer as claimed in claim 1 , wherein R 5 is a single bond or propylene, R 6 and R 7 are independently methoxy or ethoxy.

7. The copolymer as claimed in claim 1 , wherein a repeating unit of the polysiloxane comprises

or a combination thereof, wherein Me is methyl, and Ph is phenyl.

8. The copolymer as claimed in claim 7 , wherein a molar ratio of phenyl groups to methyl groups in the polysiloxane is 3 or less.

9. The copolymer as claimed in claim 7 , wherein the polysiloxane has a weight average molecular weight of 500 to 20000.

10. A resin composition, comprising
the copolymer as claimed in claim 1 ; and
an epoxy, wherein a weight ratio of the epoxy to the copolymer is from 0.01 to 1.

11. The resin composition as claimed in claim 10 , further comprising a solvent having a content of 40 to 80% by weight based on the total weight of the resin composition.

12. The resin composition as claimed in claim 10 , further comprising an accelerator having a content of 0.05 to 5% by weight based on the total weight of the resin composition.

13. The resin composition as claimed in claim 10 , wherein the epoxy has a content of 5 to 10% by weight based on the total weight of the resin composition.

14. The resin composition as claimed in claim 10 , wherein the epoxy has a weight average molecular weight of 150 to 300 and a viscosity of 3 to 300 cps.

15. A packaging film, comprising
a substrate;
a release layer, disposed on the substrate;
a gas barrier layer, disposed on the release layer; and
a resin layer, disposed on the gas barrier layer and comprising the resin composition as claimed in claim 10 .

16. The packaging film as claimed in claim 15 , wherein an adhesive force between the release layer and the gas barrier layer is from 65 to 6000 nN/20 mm.

17. The packaging film as claimed in claim 15 , wherein the release layer comprises tungsten oxide or silica material.

18. The packaging film as claimed in claim 15 , wherein the gas barrier layer comprises silicon oxide, silicon nitride or a combination thereof.

19. The packaging film as claimed in claim 15 , wherein the substrate comprises polyethylene terephthalate, polymethylmethacrylate, polyethersulfone, polycarbonate or polyimide.

20. The packaging film as claimed in claim 15 , wherein the substrate has a thickness of 2 μm to 200 μm, the release layer has a thickness of 2 nm to 200 nm, the gas barrier layer has a thickness of 2 nm to 200 nm, and the resin layer has a thickness of 5 μm to 600 μm.

21. A package structure, comprising
a substrate;
a semiconductor element, disposed on the substrate;
a resin layer, encapsulating the semiconductor element and comprising the resin composition as claimed in claim 10 ; and
a gas barrier layer, disposed on the resin layer.

22. The package structure as claimed in claim 21 , wherein the substrate comprises polyethylene terephthalate, polymethylmethacrylate, polyethersulfone, polycarbonate or polyimide.

23. The package structure as claimed in claim 21 , wherein the gas barrier layer comprises silicon oxide, silicon nitride or a combination thereof.

24. The package structure as claimed in claim 21 , wherein the resin layer has a thickness of 5 μm to 600 μm, and the gas barrier layer has a thickness of 2 nm to 200 nm.

Assignees

• Ind Tech Res Inst

Inventors

• Wu Ming-Tzung
• Chang Te-Yi
• Huang Yao-Jheng
• Lai Yun-Yu

Classifications

• C08F220/18 Primary

  with acrylic or methacrylic acids · CPC title

• C08L2203/16

  used for films · CPC title

• C08F283/12

  on to polysiloxanes · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08L33/10

  Homopolymers or copolymers of methacrylic acid esters · CPC title