Pressure sensitive adhesive film

Patent metadata

Field	Value
Publication number	US-9698374-B2
Application number	US-201514939857-A
Country	US
Kind code	B2
Filing date	Nov 12, 2015
Priority date	Nov 12, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.

First claim

What is claimed is:

1. A pressure-sensitive adhesive film, comprising a pressure-sensitive adhesive layer which comprises a polymer derived from isobutylene and satisfies the following Expression 4:
2.0×10 5 Pa≦ G N 0 ≦5.0×10 5 Pa  [Expression 4]

where, in Expression 4, G N 0 is a complex modulus value when a phase angle is a minimum in a graph (X-axis: complex modulus, Y-axis: phase angle) of a phase angle and complex modulus of a circular sample (diameter: 8 mm, thickness: 500 μm) prepared using the pressure-sensitive adhesive layer, which are measured using a discovery hybrid rheometer (DHR) while a frequency range is increased from 0.01 to 100 Hz at a temperature of 80° C. and a strain of 1%.

2. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive layer has a recovery rate R 1 of 55% or more according to the following Expression 3:
R 1 =( S M −S R,30 )×100 /S M   [Expression 3]

where, in Expression 3, S M is a maximum strain (%) of the circular sample (diameter: 8 mm, thickness: 500 μm) prepared using the pressure-sensitive adhesive layer, which is measured using a discovery hybrid rheometer (DHR) when a strain is applied at a shear stress of 2,000 Pa and a temperature of 80° C. for 3 minutes, and S R,30 is a residual strain (%) measured 30 seconds after the stress is removed.

3. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive layer has a phase angle (δ) in a range of 10° to 18° according to the following Expression 1:
δ=tan −1 ( G″/G ′)  [Expression 1]

where, in Expression 1, G′ and G″ respectively represent a storage modulus G′ and loss modulus G″ of the circular sample (diameter: 8 mm, thickness: 500 μm) prepared using the pressure-sensitive adhesive layer, which are measured using a discovery hybrid rheometer (DHR) under conditions of a temperature of 80° C., a strain of 1% and a frequency of 0.1 Hz.

4. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive layer has a complex viscosity (η*=|G*|/ω) of 2.5×10 4 Pa·s to 5.0×10 4 Pa·s according to the following Expression 2:
η*=| G *|/ω=√{square root over (( G ′/ω) 2 +( G ″/ω) 2 )}  [Expression 2]

where, in Expression 2, ω represents a frequency and is 6.28 rad/s, and G′ and G″ respectively represent a storage modulus G′ and loss modulus G″ of the circular sample (diameter: 8 mm, thickness: 500 μm) prepared using the pressure-sensitive adhesive layer, which are measured using a discovery hybrid rheometer (DHR) under conditions of a temperature of 80° C., a strain of 1% and a frequency of 0.1 Hz.

5. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive layer further comprises an active energy ray-polymerizable compound which is polyfunctional.

6. The pressure-sensitive adhesive film of claim 1 , wherein the polymer derived from isobutylene is a copolymer of a diene and an olefin-based compound comprising one carbon-carbon double bond.

7. The pressure-sensitive adhesive film of claim 1 , wherein the polymer derived from isobutylene comprises a copolymer having a polymerization unit of the following Formula A and a polymerization unit of the following Formula B:

8. The pressure-sensitive adhesive film of claim 7 , wherein the copolymer comprises the polymerization unit of Formula A at 95 to 99.5 mol % and the polymerization unit of Formula B at 0.5 to 5 mol %.

9. The pressure-sensitive adhesive film of claim 5 , wherein the active energy ray-polymerizable compound which is polyfunctional satisfies the following Formula 1:

where, in Formula 1, R 1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, X represents an n-valent residue derived from a linear, branched or cyclic alkyl group having 3 to 30 carbon atoms.

10. The pressure-sensitive adhesive film of claim 5 , wherein the active energy ray-polymerizable compound is included at 5 to 30 parts by weight relative to 100 parts by weight of the polymer.

11. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive layer further comprises a tackifier.

12. The pressure-sensitive adhesive film of claim 11 , wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

13. The pressure-sensitive adhesive film of claim 5 , wherein the pressure-sensitive adhesive layer further comprises a radical initiator.

14. The pressure-sensitive adhesive film of claim 13 , wherein the radical initiator is included at 0.2 to 20 parts by weight relative to 100 parts by weight of the active energy ray-polymerizable compound.

15. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive layer further comprises a moisture absorbent.

16. The pressure-sensitive adhesive film of claim 1 , which has a light transmittance of 85% or more in a visible light region.

17. The pressure-sensitive adhesive film of claim 1 , which has a haze of 3% or less.

18. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
the pressure-sensitive adhesive film according to claim 1 which encapsulates the organic electronic element.

19. A method of manufacturing an organic electronic device, comprising:
applying the pressure-sensitive adhesive film according to claim 1 on a substrate on which an organic electronic element is formed, such that the pressure-sensitive adhesive film covers the organic electronic element; and
crosslinking the pressure-sensitive adhesive film.

Assignees

• Lg Chemical Ltd

Inventors

• Lee Hyun Sup
• Cho Yoon Gyung
• Lee Myung Han
• Bae Kyung Yul
• Kim Sang Eun
• Park Sang Min
• Yang Se Woo
• Im Ye Hoon

Classifications

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J7/22

  Plastics; Metallised plastics · CPC title

• C09J145/00

  Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers (based on polymers of cyclic esters of polyfunctional acids C09J131/00; based on polymers of cyclic anhydrides or imides C09J135/00) · CPC title

• C09J2423/00

  Presence of polyolefin · CPC title

• C09J2409/00

  Presence of diene rubber · CPC title