Lighting device and method of making lighting device

Patent metadata

Field	Value
Publication number	US-9698322-B2
Application number	US-201213368177-A
Country	US
Kind code	B2
Filing date	Feb 7, 2012
Priority date	Feb 7, 2012
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A lighting device comprises a solid state light emitter on a circuit board, and an optic held in place relative to the first circuit board, a voltage drop across the emitter at least 60 volts. A lighting device comprises a solid state light emitter on a first circuit board, an optic held in place relative to the first circuit board, and a non-isolated power supply. A lighting device comprises a solid state light emitter on a first circuit board, and a flame-rated optic held in place relative to the first circuit board. An optic, comprising a translucent region, a first dimension not larger than about 10 mm, a second dimension not larger than 15 mm. A flame-rated optic comprising a translucent region, structure configured to hold the optic in place relative to a circuit board. Methods of making lighting devices.

First claim

The invention claimed is:

1. A lighting device, comprising:
at least a first circuit board;
at least a first solid state light emitter chip on the first circuit board; and
at least a first optic held in place relative to the first circuit board,
the first optic on the first circuit board,
at least part of the first solid state light emitter chip between at least a portion of the first circuit board and at least a portion of the first optic,
the first solid state light emitter chip the only solid state light emitter chip between the first circuit board and the first optic,
if the first solid state light emitter chip is illuminated, at least a portion of light emitted by the first solid state light emitter chip passes through the first optic, and
a voltage drop across the first solid state light emitter chip is at least 60 volts.

2. A lighting device as recited in claim 1 , wherein the lighting device further comprises at least a first index-matching element between at least a portion of the first solid state light emitter chip and the first optic.

3. A lighting device as recited in claim 2 , wherein the index-matching element comprises at least a first luminescent material.

4. A lighting device as recited in claim 1 , wherein the first optic comprises at least a first luminescent material.

5. A lighting device as recited in claim 1 , wherein the first optic is flame-rated.

6. A lighting device as recited in claim 1 , wherein the first optic is in direct contact with the first circuit board.

7. A lighting device as recited in claim 1 , wherein the first solid state light emitter chip is included in an LED package.

8. A lighting device as recited in claim 1 , wherein the first solid state light emitter chip is a light emitting chip diode chip in direct contact with the first circuit board.

9. A lighting device as recited in claim 1 , wherein the first solid state light emitter chip comprises a plurality of light emitting devices formed by depositing stacked active layers on a wafer and/or substrate, and then isolating respective regions of those stacked layers from each other to provide a plurality of light emitting devices which are mechanically connected to one another.

10. A lighting device as recited in claim 1 , wherein the first solid state light emitter chip comprises a plurality of light emitting diode devices arranged in series on a first region of the first circuit board, the first region having a surface area of not larger than about 2.0 square millimeters.

11. A lighting device as recited in claim 1 , wherein at least a first dimension of the lighting device is not larger than about 10 mm.

12. A lighting device as recited in claim 11 , wherein at least a second dimension of the lighting device is not larger than about 15 mm.

13. A lighting device as recited in claim 1 , wherein the lighting device further comprises at least a first power supply.

14. A lighting device as recited in claim 13 , wherein the first power supply is non-isolated, such that (1) the first power supply and the first solid state light emitter chip are not electrically and magnetically separated from one another, or (2) transient voltage from the first power supply can affect the first solid state light emitter chip.

15. A lighting device as recited in claim 1 , wherein only one solid state light emitter is between the first optic and the first circuit board.

16. A lighting device, comprising:
at least a first circuit board;
at least a first solid state light emitter chip on the first circuit board; and
at least a first optic held in place relative to the first circuit board,
the first optic on the first circuit board,
at least part of the first solid state light emitter chip between at least a portion of the first circuit board and at least a portion of the first optic,
the first solid state light emitter chip the only solid state light emitter chip between the first circuit board and the first optic,
if the first solid state light emitter chip is illuminated, at least a portion of light emitted by the first solid state light emitter chip passes through the first optic, and
(1) the first optic is flame-rated according to UL 94 5VA as revised on Jan. 31, 2012, (2) the first optic is made of a material that is rated according to UL 94 VO as revised on Jan. 31, 2012 and passes the UL 94 5VA as revised on Jan. 31, 2012 5 inch flame test, or (3) the first optic is flame-rated according to UL 94 5VA as revised on Jan. 31, 2012 and the first optic is made of a material that is rated according to UL 94 VO as revised on Jan. 31, 2012 and passes the UL 94 5VA as revised on Jan. 31, 2012 5 inch flame test.

17. A lighting device as recited in claim 16 , wherein the lighting device further comprises at least a first index-matching element between at least a portion of the first solid state light emitter chip and the first optic.

18. A lighting device as recited in claim 17 , wherein the index-matching element comprises at least a first luminescent material.

19. A lighting device as recited in claim 16 , wherein the first optic comprises at least a first luminescent material.

20. A lighting device as recited in claim 16 , wherein the first solid state light emitter chip is included in an LED package.

21. A lighting device as recited in claim 16 , wherein the first solid state light emitter chip is a light emitting diode chip in direct contact with the first circuit board.

22. A lighting device as recited in claim 16 , wherein the first solid state light emitter chip comprises a plurality of light emitting devices formed by depositing stacked active layers on a wafer and/or substrate, and then isolating respective regions of those stacked layers from each other to provide a plurality of light emitting devices which are mechanically connected to one another.

23. A lighting device as recited in claim 16 , wherein the first solid state light emitter chip comprises a plurality of light emitting diode devices arranged in series on a first region of the first circuit board, the first region having a surface area of not larger than about 2.0 square millimeters.

24. A lighting device as recited in claim 16 , wherein at least a first dimension of the lighting device is not larger than about 10 mm.

25. A lighting device as recited in claim 24 , wherein at least a second dimension of the lighting device is not larger than about 15 mm.

26. A lighting device as recited in claim 16 , wherein the lighting device further comprises at least a first power supply.

27. A lighting device as recited in claim 26 , wherein the first power supply is non-isolated, such that (1) the first power supply and the first solid state light emitter chip are not electrically and magnetically separated from one another, or (2) transient voltage from the first power supply can affect the first solid state light emitter chip.

28. A lighting device as recited in claim 16 , wherein the first optic is in direct contact with the first circuit board.

29. A method of making a lighting device, comprising:
bringing at least a first structure of a first optic into contact with a first circuit board, the first structure configured to hold the first optic in place relative to the first circuit board,
(1) the first optic is flame-rated according to UL 94 5VA as revised on Jan. 31, 2012, (2) the first optic i

Assignees

• Pickard Paul Kenneth
• Cree Inc

Inventors

• Pickard Paul Kenneth

Classifications

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

• Y10T29/49002

  Electrical device making · CPC title

• H10W90/00

  Package configurations · CPC title

• H01L2924/00

  Electricity · mapped topic

• H01L25/0753

  Electricity · mapped topic