Optoelectronic component and method for producing an optoelectronic component

Patent metadata

Field	Value
Publication number	US-9698282-B2
Application number	US-93351009-A
Country	US
Kind code	B2
Filing date	Mar 31, 2009
Priority date	Apr 17, 2008
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An optoelectronic component including a connection carrier comprising a structured carrier strip in which interspaces are filled with an electrically insulating material and an optoelectronic semiconductor chip attached and electrically connected to a top portion of the connection carrier, wherein the electrically insulating material terminates substantially flush with the carrier strip in places or the carrier strip projects beyond the electrically insulating material, and the carrier strip is not covered by the electrically insulating material on the top portion and/or on a bottom portion of the connection carrier.

First claim

The invention claimed is:

1. An optoelectronic component comprising:
a cavity-free connection carrier comprising a structured carrier strip in which interspaces are filled with an electrically insulating material, and
an optoelectronic semiconductor chip attached and electrically connected to a top portion of the connection carrier, wherein
the electrically insulating material terminates substantially flush with the carrier strip in places or the carrier strip projects beyond the electrically insulating material,
the carrier strip is not covered by the electrically insulating material on the top portion and on a bottom portion of the connection carrier,
the carrier strip is a lead frame which consists of an electrically conductive material,
the entire connection carrier is planar on its top and bottom sides, and
the carrier strip has a smaller cross-sectional area at the top portion of the connection carrier than at the bottom portion of the connection carrier.

2. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip is surrounded by a potting body containing silicone and in selected locations directly adjoins the electrically insulating material of the connection carrier, and the electrically insulating material contains a silicone or consists of a silicone.

3. The optoelectronic component according to claim 1 , wherein the carrier strip comprises at least one anchoring structure in the form of undercuts, wherein the anchoring structure improves adhesion of the electrically insulating material to the carrier strip.

4. The optoelectronic component according to claim 1 , wherein the carrier strip comprises a T-shaped cross section at least in selected locations.

5. The optoelectronic component according to claim 1 , wherein the carrier strip comprises a mushroom-shaped cross section at least in selected locations.

6. The optoelectronic component according to claim 1 , wherein the at least one anchoring structure is etched.

7. The optoelectronic component according to claim 1 , wherein the at least one anchoring structure is an opening in the carrier strip.

8. The optoelectronic component according to claim 1 , wherein the electrically insulating material contains at least one of or consists of epoxy resin and silicone.

9. The optoelectronic component according to claim 1 , wherein the electrically insulating material contains filler particles which reduce the coefficient of thermal expansion of the connection carrier.

10. The optoelectronic component according to claim 1 , wherein the electrically insulating material contains an adhesion promoter which increases adhesion to the carrier strip.

11. The optoelectronic component according to claim 1 , wherein the carrier strip comprises a main body containing copper covered in selected locations with a layer containing at least one metal selected from the group consisting of silver, nickel, platinum, gold and palladium.

12. The optoelectronic component according to claim 1 , wherein the carrier strip comprises side faces which run transversely or orthogonally with respect to the top portion and to the bottom portion of the connection carrier, the side faces being completely formed with the electrically insulating material.

13. An optoelectronic component comprising:
a cavity-free connection carrier comprising a structured carrier strip in which interspaces are filled with an electrically insulating material, and
an optoelectronic semiconductor chip attached and electrically connected to a top portion of the connection carrier, wherein
the electrically insulating material terminates substantially flush with the carrier strip in places or the carrier strip projects beyond the electrically insulating material,
the carrier strip is not covered by the electrically insulating material on the top portion and on a bottom portion of the connection carrier,
the carrier strip is a lead frame which consists of an electrically conductive material,
the entire connection carrier is planar on its top and bottom sides,
the carrier strip has a smaller cross-sectional area at the top portion of the connection carrier than at the bottom portion of the connection carrier,
the electrically insulating material contains a silicone, filler particles that reduce the coefficient of thermal expansion of the connection carrier and an adhesion promoter that increases adhesion of the insulating material to the carrier strip,
the optoelectronic semiconductor chip is surrounded by a potting body containing silicone,
the silicone of the electrically insulating material and the silicone of the potting body are in direct contact with each other,
the carrier strip comprises a main body that contains copper, and
said main body is covered with a layer that contains at least one of silver, nickel, platinum, gold or palladium.

Assignees

• Jaeger Harald
• Zitzlsperger Michael
• Osram Opto Semiconductors Gmbh

Inventors

• Jaeger Harald
• Zitzlsperger Michael

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W70/479

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title