Semiconductor device with air gap and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-9698097-B2
Application number	US-201615147237-A
Country	US
Kind code	B2
Filing date	May 5, 2016
Priority date	Jul 12, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A semiconductor device includes a dielectric structure which has an opening exposing a surface of a substrate; and a conductive structure which is formed in the opening, wherein the conductive structure comprises: a first conductive pattern recessed in the opening; a second conductive pattern covering a top surface and sidewalls of the first conductive pattern; an air gap defined between sidewalls of the opening and the second conductive pattern; and a third conductive pattern capping the second conductive pattern and the air gap.

First claim

What is claimed is:

1. A semiconductor device comprising:
a plurality of conductive structures including first conductive patterns which are formed over a substrate;
second conductive patterns recessed between the conductive structures;
third conductive patterns covering top surfaces and sidewalls of the second conductive patterns;
air gaps defined between the first conductive patterns and the third conductive patterns; and
fourth conductive patterns capping the air gaps and the third conductive patterns,
wherein the third conductive patterns are formed of metal silicide.

2. The semiconductor device according to claim 1 , further comprising:
barrier patterns formed between the third conductive patterns and the fourth conductive patterns, and capping the air gaps and the third conductive patterns; and
glue patterns formed over the barrier patterns.

3. The semiconductor device according to claim 2 , wherein each of the barrier patterns covers a top surface and sidewalls of an upper portion of the respective third conductive pattern.

4. The semiconductor device according to claim 1 , wherein stack structures of the second conductive patterns, the third conductive patterns, and the fourth conductive patterns comprise plugs.

5. The semiconductor device according to claim 1 , wherein the third conductive patterns comprise titanium silicide, cobalt silicide, nickel silicide, or tungsten silicide.

6. The semiconductor device according to claim 1 , wherein the second conductive patterns comprise a silicon-containing material, the fourth conductive patterns comprise a metal-containing material, and the third conductive patterns comprise titanium silicide, cobalt silicide, nickel silicide, or tungsten silicide.

7. The semiconductor device according to claim 1 , wherein the first conductive patterns comprise bit lines, and the semiconductor device further comprises capacitors which are coupled to the fourth conductive patterns.

8. The semiconductor device according to claim 1 , further comprising:
buried gate type transistors having gate electrodes which are buried in the substrate, wherein the second conductive patterns are coupled to source regions or drain regions of the buried gate type transistors.

Assignees

• Sk Hynix Inc

Inventors

• Lee Nam-Yeal
• Yeom Seung-Jin

Classifications

• H10W20/4451

  Semiconductor materials, e.g. polysilicon · CPC title

• H10W20/0698

  Local interconnections · CPC title

• H10W20/495

  Capacitive arrangements or effects of, or between wiring layers · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/089

  using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning · CPC title