Structure and method for FinFET device

Patent metadata

Field	Value
Publication number	US-9698058-B2
Application number	US-201514924422-A
Country	US
Kind code	B2
Filing date	Oct 27, 2015
Priority date	Apr 25, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

The present disclosure provides an embodiment of a fin-like field-effect transistor (FinFET) device. The device includes a substrate having a first gate region, a first fin structure over the substrate in the first gate region. The first fin structure includes an upper semiconductor material member, a lower semiconductor material member, surrounded by an oxide feature and a liner wrapping around the oxide feature of the lower semiconductor material member, and extending upwards to wrap around a lower portion of the upper semiconductor material member. The device also includes a dielectric layer laterally proximate to an upper portion of the upper semiconductor material member. Therefore the upper semiconductor material member includes a middle portion that is neither laterally proximate to the dielectric layer nor wrapped by the liner.

First claim

What is claimed is:

1. A method comprising:
forming a fin structure over a substrate;
after forming the fin structure over a substrate, forming an oxide feature around the fin structure such that a first portion of the fin structure is positioned above the oxide feature and a second portion of the fin structure is positioned below the oxide feature;
forming a liner layer directly on the second portion of the fin structure, the oxide feature and the first portion of the fin structure;
forming a dielectric layer on the liner layer;
removing a portion of the liner layer and a portion of the dielectric layer to expose the fin structure;
forming a gate dielectric layer on the fin structure, a remaining portion of the liner layer, and a remaining portion of the dielectric layer; and
forming a gate electrode on the gate dielectric layer.

2. The method of claim 1 , wherein forming the fin structure over the substrate includes:
forming a first semiconductor material layer over the substrate;
forming a second semiconductor material layer over the first semiconductor material layer, the second semiconductor material layer being different that the first semiconductor material layer; and
patterning the first and second semiconductor material layers to form the fin structure.

3. The method of claim 2 , wherein forming the oxide feature around the fin structure includes forming the oxide feature around the patterned first semiconductor material layer.

4. The method of claim 2 , wherein forming the liner layer directly on the second portion of the fin structure, the oxide feature and the first portion of the fin structure includes forming the liner layer directly on a sidewall of the patterned second semiconductor material layer.

5. The method of claim 4 , wherein after removing the portion of the liner layer and the portion of the dielectric layer to expose the fin structure, the sidewall of the patterned second semiconductor material layer is exposed.

6. The method of claim 5 , wherein forming the gate dielectric layer on the fin structure, the remaining portion of the liner layer, and the remaining portion of the dielectric layer includes forming the gate dielectric layer directly on the exposed sidewall of the patterned second semiconductor material layer.

7. The method of claim 1 , wherein after removing the portion the liner layer and the portion of the dielectric layer to expose the fin structure, the oxide feature remains covered by the remaining portion of the liner layer.

8. The method of claim 1 , further comprising:
recessing a portion of the fin structure after removing the portion of the liner layer and the portion of the dielectric layer to expose the fin structure; and
forming a source/drain feature on the recessed portion of the fin structure.

9. The method of claim 1 , wherein the liner layer includes a material selected from the group consisting of silicon nitride, silicon oxynitride and aluminum oxide.

10. The method of claim 1 , wherein forming the fin structure over the substrate includes forming another fin structure over the substrate,
wherein forming the oxide feature around the fin structure includes performing an oxidation process, and
wherein the another fin structure is protected during the performing of the oxidation process thereby preventing an oxide feature from forming around the another fin structure.

11. A method comprising:
forming a first fin structure over a substrate, the first fin structure including:
a first semiconductor material layer; and
a second semiconductor material layer disposed over the first semiconductor material layer, the second semiconductor material layer being different than the first semiconductor material layer;

forming a liner layer extending along a sidewall of the first semiconductor material layer and along a sidewall of the second semiconductor material layer;
forming a dielectric isolation feature adjacent the first and second semiconductor material layers, wherein after forming the dielectric isolation feature, a first portion of the sidewall of the second semiconductor material layer is covered by the dielectric isolation feature and a second portion of the sidewall of the second semiconductor material layer is exposed;
forming a gate dielectric layer on the exposed second portion of the sidewall of the second semiconductor material layer;
forming a gate electrode layer over the gate dielectric;
forming a second fin structure over a substrate, the second fin structure including:
the first semiconductor material layer; and
the second semiconductor material layer disposed over the first semiconductor material layer; and

performing an oxidation process to form an oxide feature around the first semiconductor material layer of the second fin structure, wherein the first fin structure is protected during the performing of the oxidation process thereby preventing oxide from forming around the first semiconductor material layer of the first fin structure.

12. The method of claim 11 , wherein the first fin structure further includes a third semiconductor material layer disposed over the second semiconductor material layer,
wherein after forming the dielectric isolation feature, a sidewall of the third semiconductor material layer is exposed, and
wherein forming the gate dielectric layer on the exposed second portion of the sidewall of the second semiconductor material layer includes forming the gate dielectric layer on the exposed sidewall of the third semiconductor material layer.

13. The method of claim 11 , further comprising forming another liner layer on the liner layer extending along the sidewall of the first semiconductor material layer and along the sidewall of the second semiconductor material layer.

14. The method of claim 13 , wherein forming the dielectric isolation feature adjacent the first and second semiconductor material layers includes forming the dielectric isolation feature directly on a portion of the liner layer and a portion of the another liner layer.

15. The method of claim 11 , further comprising forming a hard mask layer extending along the sidewall of the first semiconductor material layer and along the sidewall of the second semiconductor material layer, and
removing the hard mask layer extending along the sidewall of the first semiconductor material layer and along the sidewall of the second semiconductor material layer prior to forming the liner layer extending along the sidewall of the first semiconductor material layer and along the sidewall of the second semiconductor material layer.

16. The method of claim 11 , further comprising:
wherein forming the liner layer includes forming the liner layer extending along a sidewall of the first semiconductor material layer of the second fin structure and along a sidewall of the second semiconductor material layer of the second fin structure;
wherein forming the dielectric isolation feature includes forming another dielectric isolation feature adjacent the first and second semiconductor material layers of the second fin structure, wherein after forming the another dielectric isolation feature adjacent the first and second semiconductor material layers of the second fin structure, a first portion of the sidewall of the second semiconductor material layer of the second fin structure is covered by the another dielectric isolation feature and a second portion of the sidewall of the second semiconductor material layer of the second fin structure is exposed;
wherein forming the gate dielectric layer includes forming the gate dielectric on the expo

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Ching Kuo-Cheng
• Fung Ka-Hing
• Chang Chih-Sheng
• Wu Zhiqiang

Classifications

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10P14/69391

  the material containing aluminium, e.g. Al2O3 · CPC title

• H10P14/6927

  the material being a silicon oxynitride, e.g. SiON or SiON:H · CPC title

• H10P14/6322

  Formation by thermal treatments (formation by plasma treatment H10P14/6319) · CPC title

• H10P14/6306

  of the semiconductor materials · CPC title