Method and apparatus for an electromagnetic emission based imaging system

Patent metadata

Field	Value
Publication number	US-9697986-B2
Application number	US-201615380649-A
Country	US
Kind code	B2
Filing date	Dec 15, 2016
Priority date	Jan 13, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

The present invention provides apparatus for an imaging system comprising a multitude of imaging elements upon a substrate. In some embodiments the substrate may be approximately round with a radius of approximately one inch. Various methods relating to using and producing an imaging system are discussed.

First claim

What is claimed is:

1. An imaging apparatus comprising:
a first apparatus comprising a first substrate with a multitude of imaging elements arrayed thereupon, wherein the imaging elements are capable of emitting an imaging signal from their structure to a material sensitive to their emissions on a surface in a vicinity of the first apparatus, wherein the imaging elements are nano-scaled photon emitters metal deposited upon the first substrate, and wherein there are more than 1000 emitters of the first apparatus;
a support component for a second substrate to be processed by the imaging apparatus;
an alignment feature and alignment apparatus to measure the alignment feature; and
a processor operant to collect data from imaging apparatus components, process the data and control imaging apparatus components based on the data.

2. The imaging apparatus of claim 1 further comprising a cooling device in thermal communication with the second substrate.

3. The imaging apparatus of claim 1 further comprising a piezoelectric actuating device to raster the imaging apparatus.

4. The imaging apparatus of claim 3 wherein the rastering comprises at least ten steps within a distance separating two of the photon emitters.

5. A method of forming an imaging system comprising:
forming two or more individual imaging system elements, the method of forming the elements comprising:
depositing a layer of metal on a first substrate;
etching a plurality of photon emitters into a layer of metal;
finishing processing of an integrated circuit with metal layers; and
connecting a metal layer of an integrated circuit to a photon emitter to form a first imaging system element;

testing two or more of the individual imaging system elements;
emitting photons onto a second substrate comprising a photon sensitive layer;
and measuring characteristics of exposed portions of the photon sensitive layer.

6. The method of claim 5 additionally comprising:
testing the imaging system to form test structures;
measuring the test structures; and
calculating correction values utilizing result of the measuring.

7. The method of claim 5 wherein the imaging system comprises more than 1,000,000 individual imaging elements.

8. The method of claim 7 wherein the imaging system is approximately round in form with a radius of approximately 1 inch.

9. The method of claim 8 additionally comprising the step of:
including the imaging elements into a toolPod.

10. The method of claim 9 additionally comprising steps of:
placing the toolPod upon a chassis, wherein the chassis is part of a cleanspace fabricator;
placing a second substrate into the cleanspace fabricator;
placing an imaging sensitive film upon the second substrate; and
performing an imaging process upon the imaging sensitive film upon the second substrate.

11. An imaging apparatus comprising:
an array of photon emitters, wherein the photon emitters comprise metallic structures on a base layer, wherein the photon emitters are shaped by an etching process, and wherein the photon emitters are tuned to emit at wavelengths that are a fraction of a dimension of the photon emitter and wherein there are more than 10,000 photon emitters in the array; and
electrical circuits connected to each of the photon emitters, wherein the electrical circuits bias the emitters based on data related to an image.

12. The imaging apparatus of claim 11 wherein the electrical circuits that bias the photon emitters are fabricated in a CMOS processing flow.

13. The imaging apparatus of claim 12 wherein a bias potential that the electrical circuits bias the photon emitters to exceeds 1 volt.

14. The imaging apparatus of claim 13 wherein the number of photon emitters exceeds 1,000,000.

15. The imaging apparatus of claim 14 wherein the photon emitters are nano-scaled.

16. The imaging apparatus of claim 15 wherein the nano-scaled photon emitters may be tuned to emit at wavelengths that are a fraction of the emitter dimension.

Assignees

• Flitsch Frederick A

Inventors

• Flitsch Frederick A

Classifications

• H01J37/06 Primary

  Electron sources; Electron guns · CPC title

• H01J37/244 Primary

  Detectors; Associated components or circuits therefor · CPC title

• H01J2237/3174

  Etching microareas · CPC title

• H01J2237/31759

  using near-field effects, e.g. STM · CPC title

• H01J37/3177

  Multi-beam, e.g. fly's eye, comb probe · CPC title