Systems and methods for in-situ fabric link optimization in a modular information handling system chassis
US-2016077841-A1 · Mar 17, 2016 · US
Midplane interconnect system with conductor twist mitigation
US9697160B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9697160-B2 |
| Application number | US-201414581119-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 23, 2014 |
| Priority date | Dec 23, 2014 |
| Publication date | Jul 4, 2017 |
| Grant date | Jul 4, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
First claim
Opening claim text (preview).
What is claimed is: 1. A system comprising: a cabled midplane interconnect having a first connection and a second connection; a first circuit board having a third connection configured to be coupled to the first connection, the third connection having transmit connections and receive connections in a first orientation; a second circuit board having a fourth connection configured to be coupled to the second connection, the fourth connection having transmit connections and receive connections in a second orientation that is opposite to the first orientation, wherein the fourth connection and the second circuit board are configured such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection such that none of the plurality of conductors crosses another of the plurality of conductors; and a third circuit board having a fifth connection and a fourth circuit board having a sixth connection wherein the first circuit board is coupled to the midplane interconnect directly across from the second circuit board and the third circuit board is coupled to the midplane interconnect directly across from the fourth circuit board, further wherein transmit connections of the third connection are coupled through the midplane interconnect directly across from receive connections of the fourth connection and transmit connections of the fifth connection are coupled through the midplane interconnect directly across from the receive connections of the sixth connection. 2. The system of claim 1 , wherein the system is a Director Class Network Switch. 3. The system of claim 1 , wherein each of the first and second circuit boards comprise switching circuitry. 4. The system of claim 1 , wherein the third connection comprises a first plurality of transmit connections and a first plurality of receive connections and the fourth connection comprises a second plurality of transmit connections and a second plurality of receive connections wherein the fourth connection is configured such that the first plurality of transmit connections are coupled to the midplane interconnect directly across from the second plurality of receive connections. 5. The system of claim 4 , wherein the fourth connection is further configured such that the first plurality of receive connections are coupled to the midplane interconnect directly across from the second plurality of transmit connections. 6. The system of claim 1 , wherein the first and second circuit boards have the same orientation with respect to their respective connections. 7. The system of claim 1 , wherein the first and second circuit boards have opposite orientations with respect to their respective connections.
Assignees
Inventors
Classifications
- G06F13/4022Primary
using switching circuits, e.g. switching matrix, connection or expansion network (G06F13/4009 takes precedence) · CPC title
for rigid printing circuits or like structures · CPC title
with a panel or printed circuit board · CPC title
forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers · CPC title
Power distribution · CPC title
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Frequently asked questions
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- What does patent US9697160B2 cover?
- A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having…
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification G06F13/4022. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jul 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).