Photosensitive compositions and applications thereof

Patent metadata

Field	Value
Publication number	US-9696623-B2
Application number	US-201615097050-A
Country	US
Kind code	B2
Filing date	Apr 12, 2016
Priority date	Apr 26, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor device having a plurality of chip stacks comprising:
coating a surface of a first substrate with a photosensitive composition comprising:
a) a polymer having a first repeating unit of formula (IA) derived from a monomer of formula (I):

wherein:
represents a position at which the bonding takes place with another repeat unit;
a is an integer from 0 to 3;
b is an integer from 1 to 4;
c is an integer from 1 to 4;
R 1 is selected from hydrogen, methyl, ethyl, n-propyl, i-propyl or n-butyl;

b) a photo active compound containing a diazo-quinone moiety of formula (A):

c) an epoxy compound containing one or more oxirane groups; and
d) an additive selected from:
a compound of formula (IV):

wherein d and e are integers from 1 to 4;
f and g are integers from 0 to 4;
R 2 and R 3 are the same or different and independently of each other selected from hydrogen, methyl, ethyl, linear or branched C 3 -C 6 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl; or
R 2 and R 3 taken together with the carbon atom to which they are attached form a 5 to 8 membered substituted or unsubstituted carbocyclic ring where said substituents are selected from C 1 -C 8 alkyl;
R 4 and R 5 are the same or different and independently of each other selected from methyl, ethyl, linear or branched C 3 -C 6 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl;
a compound of formula (V):

wherein h is an integer from 1 to 4;
i is 1 or 2;

R 6 independently is methyl, ethyl, linear or branched C 3 -C 16 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl;
a compound of formula (VI):

wherein j and k are integers from 1 to 4;
l and m are integers from 0 to 4;

R 7 and R 8 are the same or different and independently of each other selected from methyl, ethyl, linear or branched C 3 -C 6 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl;
a compound of formula (VII):

wherein n and o are integers from 1 to 4;
p and q are integers from 0 to 4;
R 9 , R 10 , R 11 and R 12 are the same or different and independently of each other selected from methyl, ethyl, linear or branched C 3 -C 6 alkyl;
R 13 is —(CH 2 ) r — or phenylene, where r is 1 to 2; or
when R 13 is —(CH 2 ) r —, one of R 9 or R 10 and one of R 11 or R 12 taken together with the carbon atoms to which they are attached form a 5 to 8 membered substituted or unsubstituted carbocyclic ring where said substituents are selected from C 1 -C 6 alkyl;
R 14 and R 15 are the same or different and independently of each other selected from methyl, ethyl, linear or branched C 3 -C 6 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl;
a compound of formula (VIII):

wherein R 16 and R 17 are the same or different and independently of each other selected from hydrogen, methyl, ethyl or linear or branched C 3 -C 6 alkyl;
a compound of formula (IX):

 or
a compound of formula (X):

heating the coated substrate to a temperature from 70° C. to 130° C. for 1 to 30 minutes;
imagewise exposing the coated substrate to an actinic radiation to form an exposed layer on the substrate;
developing the exposed layer to obtain a patterned layer;
subjecting the patterned layer to a temperature from 130° C. to 160° C. for 20 to 60 minutes;
providing a second substrate;
contacting the second substrate to the surface of the first substrate containing the polymer layer where such contacting comprises thermal compression bonding whereby causing the bonding of the surface of the first substrate with the surface of the second substrate; and
curing the first and second substrate by heating to a temperature from 170° C. to 200° C.

2. The method of claim 1 , where said coating is performed by spin coating.

3. The method of claim 1 , where said developing is performed by an aqueous developer.

4. The method of claim 1 , where said curing is performed at a temperature of from 170° C. to 200° C. at an incremental heating ramp of 5° C. and for 1 to 5 hours.

5. A method of manufacturing a semiconductor device having a plurality of chip stacks comprising:
coating a surface of a first substrate with a photosensitive composition comprising:
a) a polymer having a first repeating unit of formula (IA) derived from a monomer of formula (I):

wherein:
represents a position at which the bonding takes place with another repeat unit;
a is an integer from 0 to 3;
b is an integer from 1 to 4;
c is an integer from 1 to 4;
R 1 is selected from hydrogen, methyl, ethyl, n-propyl, i-propyl or n-butyl;

b) a photo active compound containing a diazo-quinone moiety of formula (A):

c) an epoxy compound containing one or more oxirane groups; and
d) an additive selected from:
a compound of formula (IV):

wherein d and e are integers from 1 to 4;
f and g are integers from 0 to 4;
R 2 and R 3 are the same or different and independently of each other selected from hydrogen, methyl, ethyl, linear or branched C 3 -C 6 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl; or
R 2 and R 3 taken together with the carbon atom to which they are attached form a 5 to 8 membered substituted or unsubstituted carbocyclic ring where said substituents are selected from C 1 -C 8 alkyl;
R 4 and R 5 are the same or different and independently of each other selected from methyl, ethyl, linear or branched C 3 -C 6 alkyl, C 3 -C 8 cycloalkyl, C 6 -C 10 aryl or C 7 -C 12 aralkyl;
a compound of formula (V):

wherein h is an integer from 1 to 4;
i is 1 or 2;

R 6 independently is methyl, ethyl, linear or branch

Assignees

• Promerus Llc
• Sumitomo Bakelite Co
• Sumitomo Bakelite Co

Inventors

• Knapp Brian
• Burns Cheryl
• Elce Edmund
• Seto Keitaro
• Sugiyama Hiromichi
• Horii Makoto
• Fujita Kazuyoshi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/24

  at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title