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US-2024369481-A1 · Nov 7, 2024 · US
US9696253B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9696253-B2 |
| Application number | US-201414895405-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 2, 2014 |
| Priority date | Jun 4, 2013 |
| Publication date | Jul 4, 2017 |
| Grant date | Jul 4, 2017 |
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Disclosed herein are a microchip provided with a titanium oxide film between a glass substrate and a metal thin film; and a method for forming the metal thin film and the titanium oxide film on the glass substrate of the microchip. The microchip has a second microchip substrate that has the metal thin film inside a channel, and the titanium oxide film, which has a low extinction coefficient, is provided as a buffer layer between the substrate and the metal thin film such as a gold film.
Opening claim text (preview).
What is claimed is: 1. A method of forming a metal thin film in a microchip including a substrate made of glass on which the metal thin film is formed, and a channel formed in a space including the metal thin film, the method comprising: irradiating a surface of the substrate with light including vacuum ultraviolet light with a wavelength equal to or less than 200 nm under an ambient atmosphere containing oxygen and moisture; immersing the substrate in titanium ion solution and forming a titanium oxide film having a rutile type structure and an anatase type structure being mixed on a vacuum ultraviolet light irradiated face of the substrate; and depositing the metal thin film on the surface of the substrate on which the titanium oxide film is formed. 2. The method for forming a metal thin film in a microchip according to claim 1 , wherein the metal thin film is composed of any of gold (Au), platinum (Pt), rhodium (Rh), palladium (Pd), or palladium-platinum alloy (Pd—Pt alloy).
Hydrophilic and oleophilic coatings · CPC title
Properties of coatings · CPC title
Pre-treatment · CPC title
Coatings of the type glass/inorganic compound/metal · CPC title
the multilayer coating containing a metal layer · CPC title
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