Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
US-2024234132-A1 · Jul 11, 2024 · US
US9695508B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9695508-B2 |
| Application number | US-201514639697-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 5, 2015 |
| Priority date | Mar 22, 2011 |
| Publication date | Jul 4, 2017 |
| Grant date | Jul 4, 2017 |
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Embodiments described herein relate to an apparatus and method for lining a processing region within a chamber. In one embodiment, a modular liner assembly for a substrate processing chamber is provided. The modular liner assembly includes a first liner and a second liner, each of the first liner and second liner comprising an annular body sized to be received in a processing volume of a chamber, and at least a third liner comprising a body that extends through the first liner and the second liner, the third liner having a first end disposed in the process volume and a second end disposed outside of the chamber.
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The invention claimed is: 1. A modular liner assembly for a substrate processing chamber, comprising: a first liner comprising an annular body sized to be received in a processing volume of a chamber and having a plurality of recessed portions formed therein; a second liner comprising an annular body sized to be received in the processing volume of the chamber; and a third liner comprising a body that extends through the first liner and the second liner, the third liner having a first end disposed in the process volume and a second end disposed outside of the chamber, wherein one of the plurality of recessed portions receives a portion of the third liner. 2. The liner assembly of claim 1 , wherein the third liner comprises a gas distribution manifold. 3. The liner assembly of claim 2 , wherein the gas distribution manifold comprises a plurality of first channels and a plurality of second channels. 4. The liner assembly of claim 3 , wherein the plurality of first channels alternate with the plurality of second channels. 5. The liner assembly of claim 3 , wherein the plurality of first channels provide a flow metric that is different than a flow metric provided by the plurality of second channels. 6. The liner assembly of claim 2 , wherein the gas distribution manifold includes a first plurality of outlets and a second plurality of outlets. 7. The liner assembly of claim 6 , wherein the first plurality of outlets are disposed in a first plane and the second plurality of outlets are disposed in a second plane that is different than the first plane. 8. The liner assembly of claim 6 , wherein the first plurality of outlets are formed in a surface of the gas distribution manifold having a first radius and the second plurality of outlets are formed in a surface of the gas distribution manifold having a second radius that is different than the first radius. 9. The liner assembly of claim 1 , wherein the third liner comprises an exhaust liner. 10. A modular liner assembly for a substrate processing chamber, comprising: a first liner and a second liner, the first liner comprising an annular body having two recessed portions formed between a cut-out portion formed in the annular body; and a third liner comprising a body that is received in and at least partially contacts a portion of the recessed portions of the first liner. 11. The liner assembly of claim 10 , wherein the third liner comprises one of a gas distribution manifold, a slit valve liner, or an exhaust insert liner assembly. 12. The liner assembly of claim 11 , wherein the gas distribution manifold includes a first plurality of outlets and a second plurality of outlets, wherein the first plurality of outlets are disposed in a first plane and the second plurality of outlets are disposed in a second plane that is different than the first plane. 13. The liner assembly of claim 10 , wherein the first liner and the second liner are disposed in a process volume of a chamber, and the body of the third liner includes a first end disposed in the process volume and a second end disposed outside of the chamber. 14. A process kit for a semiconductor processing chamber, comprising: a plurality of liners adapted to modularly couple to each other in a processing volume of a chamber, the plurality of liners comprising: a first liner and a second liner, each of the first liner and second liner comprising an annular body having a plurality of recessed portions formed therein; and at least a third liner comprising a body that is received in and at least partially contacts a portion of the plurality of recessed portions. 15. The process kit of claim 14 , wherein the plurality of recessed portions comprise a first recessed portion and a second recessed portion. 16. The process kit of claim 15 , wherein the first recessed portion is disposed opposite to the second recessed portion. 17. The process kit of claim 15 , wherein the first recessed portion is disposed normal to the second recessed portion. 18. The process kit of claim 14 , wherein the third liner comprises one of a gas distribution manifold, a slit valve liner, or an exhaust insert liner assembly. 19. The process kit of claim 18 , wherein the gas distribution manifold comprises a plurality of first channels and a plurality of second channels. 20. The process kit of claim 19 , wherein the plurality of first channels alternate with the plurality of second channels.
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