Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-9695345-B2
Application number	US-74101108-A
Country	US
Kind code	B2
Filing date	Oct 28, 2008
Priority date	Dec 27, 2007
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

First claim

The invention claimed is:

1. A dicing die bonding film, comprising:
a die bonding portion having an adhesive layer adapted to adhere to a wafer; and
a dicing portion having a tacky layer,
wherein a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.25 to 0.33, and the adhesive layer of the die bonding portion has a storage modulus of 125 to 276 MPa at a room temperature,
wherein the adhesive power X between the wafer and the adhesive layer of the die bonding portion is 30 to 75 gf/inch, and the tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 122 to 221 gf/inch,
wherein the adhesive layer of the die bonding portion consists of a) a thermosetting multi-functional epoxy resin, b) an acryl copolymer containing glycidyl groups, c) a curing agent, d) a curing promoting agent, and e) an inorganic filler,
wherein the a) thermosetting multi-functional epoxy resin contains at least two epoxy groups in a main chain and has a glass transition temperature of 50° C. or above, and
wherein the b) acryl copolymer containing glycidyl groups has a glass transition temperature of 50° C. or below.

2. The dicing die bonding film as claimed in claim 1 , wherein the a) thermosetting multi-functional epoxy resin has an average epoxy equivalent weight of 180 to 1000.

3. The dicing die bonding film as claimed in claim 1 , wherein the a) thermosetting multi-functional epoxy resin is at least one selected from the group consisting of cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, 4-functional epoxy resin, biphenyl epoxy resin, tri-phenol methane epoxy resin, alkyl-modified tri-phenol methane epoxy resin, naphthalene epoxy resin, dicyclopentadiene epoxy resin, and dicyclopentadiene-modified phenol epoxy resin.

4. The dicing die bonding film as claimed in claim 1 , wherein the curing agent is a multi-functional phenol resin.

5. The dicing die bonding film as claimed in claim 4 , wherein the multi-functional phenol resin has a hydroxyl equivalent weight of 100 to 1000.

6. The dicing die bonding film as claimed in claim 4 , wherein the multi-functional phenol resin is at least one selected from the group consisting of bisphenol A resin, phenol novolac resin, cresol novolac resin, bisphenol A novolac resin, phenol aralkyl resin, multi-functional novolac, dicyclopentadiene phenol novolac resin, amino triazine phenol novolac resin, polybutadiene phenol novolac resin, and biphenyl resin.

7. The dicing die bonding film as claimed in claim 1 , wherein the curing agent has an equivalent weight 0.4 to 2 times as large as the equivalent weight of the a) thermosetting multi-functional epoxy resin.

8. The dicing die bonding film as claimed in claim 1 , wherein the die bonding portion further includes a protective film.

9. The dicing die bonding film as claimed in claim 1 , wherein the tacky layer of the dicing portion includes an acryl-based copolymer.

10. A semiconductor wafer, wherein the adhesive layer of the dicing die bonding film according to claim 1 is attached to one side of the wafer, and the tacky layer of the dicing die bonding film is fixed to a wafer ring frame.

11. A semiconductor device, comprising:
a wiring substrate;
an adhesive layer of the dicing die bonding film according to claim 1 attached to a chip mounting surface of the wiring substrate; and

a semiconductor chip mounted on the adhesive layer.

Assignees

• Yoo Hyun Jee
• Kim Jang Soon
• Hong Jong Wan
• Park Hyo Soon
• Kho Dong Han
• Lg Chemical Ltd

Inventors

• Yoo Hyun Jee
• Kim Jang Soon
• Hong Jong Wan
• Park Hyo Soon
• Kho Dong Han

Classifications

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/50

  Bond wires · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title