System and method for embossing the wire side of a molded fiber article

Patent metadata

Field	Value
Publication number	US-9694536-B2
Application number	US-201414546835-A
Country	US
Kind code	B2
Filing date	Nov 18, 2014
Priority date	Nov 18, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A system and method for constructing a molded fiber article capable of having detailed indicia embossed thereon is provided. A molded fiber article having a smooth surface with detailed indicia is also provided. The system includes using a wire mesh structure coupled with an embossing plate such that the embossing plate imparts a smooth surface with indicia onto the molded fiber article during formation. The smooth surface if the embossing plate allows for greater detail than that of the textured surface created by the wire mesh structure. The system may also include a forming die that generally conforms to the wire mesh structure to facilitate formation of the molded fiber article. The wire mesh structure may include a recessed area for housing the embossing plate, which may be attached to the wire mesh structure using fasteners and a backing plate.

First claim

What is claimed is:

1. A system for embossing a molded fiber article, said system comprising:
a wire mesh structure adapted for allowing removal of moisture from a material from which said molded fiber article is formed; and
an embossing plate coupled to said wire mesh structure;
wherein said embossing plate includes a face for producing indicia on an exterior surface of said molded fiber article.

2. The system of claim 1 , wherein at least a portion of said face of said embossing plate comprises a smooth surface.

3. The system of claim 1 , wherein said wire mesh structure comprises a base with a recessed area defined into said base, wherein said recess area has a shape conforming to a shape of said embossing plate and is configured for receiving at least a portion of said embossing plate.

4. The system of claim 3 , wherein said recessed area has a depth substantially equal to a thickness of said embossing plate such that a top surface of said embossing plate is generally flush with a top surface of said base when said embossing plate is positioned within said recessed area.

5. The system of claim 1 , wherein said embossing plate is fixedly connected to said wire mesh structure.

6. The system of claim 1 further comprising at least one fastener for coupling said embossing plate to said wire mesh structure.

7. The system of claim 6 , wherein said embossing plate includes at least one aperture for receiving said at least one fastener.

8. The system of claim 1 further comprising a backing plate coupled with said wire mesh structure on a bottom side of said wire mesh structure.

9. The system of claim 8 , wherein said backing plate includes at least one aperture for receiving at least one fastener.

10. The system of claim 9 , wherein said at least one aperture of said backing plate is threaded for receiving threads of said at least one fastener.

11. The system of claim 1 further comprising of a first forming die having a base and sides generally conforming to a base and sides of said wire mesh structure for receiving at least a portion of said wire mesh structure.

12. The system of claim 11 further comprising a backing plate coupled with said wire mesh structure on a bottom side of said wire mesh structure, wherein said base of said first forming die includes a recessed area generally conforming to said backing plate for receiving at least a portion of said backing plate.

13. The system of claim 11 further comprising a second forming die, wherein said second forming die generally conforms to said wire mesh structure such that said second forming die may be at least partially received within said wire mesh structure opposite of said first forming die.

14. The system of claim 1 , wherein said embossing plate includes indicia recessed on said face of said embossing plate.

15. The system of claim 1 , wherein said embossing plate includes indicia protruding from said face of said embossing plate.

16. A system for embossing a molded fiber article, said system comprising:
a wire mesh structure having sides and a base, said wire mesh structure being adapted for allowing removal of moisture from a material from which said molded fiber article is formed;
an embossing plate coupled with a top surface of said base of said wire mesh structure;
a backing plate coupled with a bottom surface of said base of said wire mesh structure; and
a forming die generally conforming to said sides and base of said wire mesh structure for receiving at least part of said wire mesh structure;
wherein said embossing plate and said backing plate are coupled with said wire mesh structure by at least one fastener;
wherein said wire mesh structure has a recessed area within said base of said wire mesh structure generally conforming to said embossing plate for receiving at least part of said embossing plate;
wherein said embossing plate includes a face for producing indicia on an exterior surface of said molded fiber article, wherein at least a portion of said face includes a generally smooth surface.

Assignees

• Huhtamaki Inc

Inventors

• Yang Keegan Y
• Breton Donald V
• Michaud James

Classifications

• B65D1/34 Primary

  Trays or like shallow containers {(B65D81/3813 takes precedence)} · CPC title

• B29C59/02 Primary

  by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title

• B65D2203/12

  Audible, olfactory or visual signalling means (B65D51/248, B65D55/028, B65D79/02 and B65D81/24 take precedence) · CPC title

• B29C33/428

  For altering indicia, e.g. data, numbers (for injection moulding B29C45/374) · CPC title

• B65D85/30

  for articles particularly sensitive to damage by shock or pressure · CPC title