Stepped retaining ring

Patent metadata

Field	Value
Publication number	US-9694470-B2
Application number	US-201313895620-A
Country	US
Kind code	B2
Filing date	May 16, 2013
Priority date	Oct 13, 2006
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.

First claim

What is claimed is:

1. A retaining ring, comprising:
an annular lower portion of a first material, the lower portion having a lower surface to contact a polishing pad and an upper surface, wherein the upper surface of the lower portion includes an upwardly projecting step positioned along an inner diameter of the lower portion, wherein a remainder of the upper surface of the lower portion between the step and an outer diameter of the lower portion is flat, and wherein at the inner diameter of the lower portion a total height of the lower portion including the step and between the lower and upper surfaces is larger than a total height of the lower portion between the lower and upper surfaces at a location between the step and the outer diameter of the lower portion;
an annular upper portion of a different second material, the upper portion having a lower surface and an upper surface, wherein the lower surface of the upper portion includes a recess positioned along an inner diameter of the upper portion and the step fits into the recess, and wherein a remainder of the lower surface of the upper portion between the recess and an outer diameter of the upper portion is flat; and
a bonding layer securing the lower portion to the upper portion.

2. The retaining ring of claim 1 , wherein the bonding layer includes an epoxy material.

3. The retaining ring of claim 1 , wherein the bonding layer is between about 4 mils and 20 mils.

4. The retaining ring of claim 1 , wherein the step is annular.

5. The retaining ring of claim 1 , wherein the step includes a vertical wall on a side of the step closer to the outer diameter of the lower portion, and the recess includes a vertical wall on a side of the recess closer to the outer diameter of the upper portion, the vertical wall of the step being parallel to the vertical wall of the recess.

6. The retaining ring of claim 5 wherein the bonding layer is disposed between the vertical wall of the step being and the vertical wall of the recess.

7. The retaining ring of claim 6 , wherein the bonding layer is additionally disposed between the remainder of the upper surface of the lower portion and the remainder of the lower surface of the upper portion.

8. The retaining ring of claim 5 , wherein the upper surface of the lower portion includes a horizontal surface and a curved portion between the vertical wall and the horizontal surface.

9. The retaining ring of claim 1 , wherein the bonding layer is disposed between the remainder of the upper surface of the lower portion and the remainder of the lower surface of the upper portion.

10. The retaining ring of claim 1 , wherein the step is at least half of a height of the lower portion at the inner diameter of the lower portion.

11. The retaining ring of claim 10 , wherein a width of the step is between about 10% and 30% of a width of the lower portion.

12. The retaining ring of claim 1 , wherein the annular lower portion has a height between the lower surface and the remainder of the upper surface of about 0.15 to 0.2 inches, and the step has a height of about 0.12 and 0.17 inches above the remainder of the upper surface of the lower portion.

13. The retaining ring of claim 1 , wherein the second material is more rigid than the first material.

Assignees

• Applied Materials Inc

Inventors

• Van Der Veen Shaun
• Zuniga Steven M

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• B24B37/32 Primary

  Retaining rings · CPC title

• B24B37/27

  Work carriers · CPC title