Substrate treatment apparatus and substrate treatment method

Patent metadata

Field	Value
Publication number	US-9694371-B2
Application number	US-201514670983-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Mar 31, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A substrate treatment apparatus according to the embodiment includes: a nozzle which ejects a treatment liquid onto a treatment target surface of a substrate; a trajectory deflector including a trajectory deflecting surface, which is an annular inclined surface that deflects a traveling direction of the treatment liquid ejected from the nozzle and makes the treatment liquid incident on the treatment target surface, the trajectory deflecting surface having an inclination angle varying in a direction of annular extension of the trajectory deflecting surface; and a position changer which moves an incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.

First claim

What is claimed is:

1. A substrate treatment apparatus comprising:
a table configured to support a substrate;
a nozzle provided below the substrate supported by the table configured to eject a treatment liquid onto a treatment target surface of a bottom surface of the substrate;
a trajectory deflector including a trajectory deflecting surface being an annular inclined surface designed to deflect a traveling direction of the treatment liquid ejected from the nozzle and to make the treatment liquid incident on the treatment target surface, the trajectory deflecting surface having an inclination angle varying in a direction of annular extension of the trajectory deflecting surface; and
a position changer configured to move an incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.

2. The substrate treatment apparatus according to claim 1 , wherein the position changer is a rotation mechanism configured to rotate one or both of the nozzle and the trajectory deflector in the direction of annular extension of the trajectory deflecting surface about an axis intersecting with the treatment target surface as a rotation center, and to move the incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.

3. The substrate treatment apparatus according to claim 2 , wherein the rotation mechanism is configured to rotate both of the nozzle and the trajectory deflector so that the nozzle and the trajectory deflector are rotated in reverse directions to each other.

4. The substrate treatment apparatus according to claim 1 , wherein the trajectory deflecting surface is a continuous surface in which the inclination angle varies continuously.

5. The substrate treatment apparatus according to claim 2 , wherein the trajectory deflecting surface is a continuous surface in which the inclination angle varies continuously.

6. The substrate treatment apparatus according to claim 3 , wherein the trajectory deflecting surface is a continuous surface in which the inclination angle varies continuously.

7. The substrate treatment apparatus according to claim 1 , wherein the trajectory deflecting surface is a non-smooth surface comprising a stepped surface for the inclined surface.

8. The substrate treatment apparatus according to claim 2 , wherein the trajectory deflecting surface is a non-smooth surface comprising a stepped surface for the inclined surface.

9. The substrate treatment apparatus according to claim 3 , wherein the trajectory deflecting surface is a non-smooth surface comprising a stepped surface for the inclined surface.

Assignees

• Shibaura Mechatronics Corp

Inventors

• Ootagaki Takashi
• Hayashi Konosuke

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title