Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability

US9694337B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9694337-B2
Application numberUS-201615207016-A
CountryUS
Kind codeB2
Filing dateJul 11, 2016
Priority dateAug 5, 2011
Publication dateJul 4, 2017
Grant dateJul 4, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and/or swells the TIM gap filler, thereby reducing the bond strength between the substrates.

First claim

Opening claim text (preview).

What is claimed is: 1. A microcapsule adapted to rupture in a magnetic field, comprising: a urea-formaldehyde (UF) microcapsule having a shell into which one or more organosilane-coated magnetic nanoparticles is/are covalently bound so that the one or more organosilane-coated magnetic nanoparticles is/are embedded in the shell of the UF microcapsule, wherein the shell of the UF microcapsule encapsulates a solvent. 2. The microcapsule adapted to rupture in a magnetic field as recited in claim 1 , wherein the one or more organosilane-coated magnetic nanoparticles is/are one or more (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles. 3. The microcapsule adapted to rupture in a magnetic field as recited in claim 2 , wherein the [shell of the UF microcapsule encapsulates] solvent is toluene. 4. An enhanced thermal interface material (TIM) gap filler, comprising: a TIM gap filler; and microcapsules adapted to rupture in a magnetic field distributed in the TIM gap filler, wherein each microcapsule has a shell encapsulating a solvent and into which one or more organosilane-coated magnetic nanoparticles is/are covalently bound so that the one or more organosilane-coated magnetic nanoparticles is/are embedded in the shell of the microcapsule, and wherein the solvent is selected to dissolve and/or swell the TIM gap filler when the solvent is released from encapsulation upon rupture of the microcapsules in the magnetic field. 5. The enhanced thermal interface (TIM) gap filler as recited in claim 4 , wherein the microcapsules include urea-formaldehyde (UF) microcapsules each having a shell into which one or more (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles is/are covalently bound. 6. The enhanced thermal interface (TIM) gap filler as recited in claim 5 , wherein the solvent is toluene. 7. A microcapsule adapted to rupture in a magnetic field, comprising: a microcapsule having a shell encapsulating a solvent and into which one or more organosilane-coated magnetic nanoparticles is/are covalently bound so that the one or more organosilane-coated magnetic nanoparticles is/are embedded in the shell of the microcapsule, wherein the microcapsule is to be added into a thermal interface material (TIM) gap filler, and wherein the solvent is selected to dissolve and/or swell the TIM gap filler when the solvent is released from encapsulation upon rupture of the microcapsule in a magnetic field. 8. The microcapsule adapted to rupture in a magnetic field as recited in claim 7 , wherein the microcapsule is a urea-formaldehyde (UF) microcapsule having a shell into which one or more (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles is/are covalently bound. 9. The microcapsule adapted to rupture in a magnetic field as recited in claim 8 , wherein the shell of the UF microcapsule encapsulates toluene.

Assignees

Inventors

Classifications

  • Delaminating · CPC title

  • Magnetic, paramagnetic · CPC title

  • Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.] · CPC title

  • Electrical equipment · CPC title

  • Materials not undergoing a change of physical state when used (C09K5/16, C09K5/20 take precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9694337B2 cover?
An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is/are covalently b…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification B01J13/18. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).