Electronic assembly with one or more heat sinks

Patent metadata

Field	Value
Publication number	US-9693488-B2
Application number	US-201514689445-A
Country	US
Kind code	B2
Filing date	Apr 17, 2015
Priority date	Feb 13, 2015
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.

First claim

The invention claimed is:

1. An electronic assembly comprising:
a semiconductor device having conductive pads on a device first side and a metallic region on a device second side opposite the first side, wherein an auxiliary metallic region comprises a central metallic region on the device first side;
a lead frame for providing separate terminals that are electrically and mechanically connected to the conductive pads;
a first heat sink comprising a first component having a mating side, a portion of the mating side directly bonded with the metallic region of the semiconductor device and having an opposite side opposite the mating side; and
a circuit board having an opening, the semiconductor device and the lead frame extending at or outward toward a board first side of the circuit board, a board second side of the circuit board opposite the first side, a plurality of board conductive pads being on the board first side of the circuit board to align with the corresponding terminals of the lead frame for electrical connection therewith.

2. The electronic assembly according to claim 1 wherein the conductive pads are arranged at or near a perimeter of the semiconductor device outward from the auxiliary metallic region.

3. The electronic assembly according to claim 1 wherein the opposite side of the first heat sink comprises first protrusions for heat dissipation.

4. The electronic assembly according to claim 1 wherein the board conductive pads comprise metallic layers of greater thickness than other conductive traces on the circuit board.

5. The electronic assembly according to claim 1 wherein the board conductive pads comprise copper or copper alloy pours.

6. The electronic assembly according to claim 1 wherein directly bonded means that the metallic region and the first component of the heat sink are fused, brazed or welded to form an electrical and mechanical connection.

7. The electronic assembly according to claim 1 wherein the heat sink is located at or below the board second side of the circuit board.

8. The electronic assembly according to claim 1 further comprising a current sensor above a conductive strip on the circuit board.

9. The electronic assembly according to claim 1 wherein the current sensor is surrounded by a metallic shield associated with the circuit board.

10. The electronic assembly according claim 1 wherein the lead frame comprises an output terminal that has an interfacing surface that is bonded to the conductive pads of the device and the auxiliary metallic region on the device first side.

11. The electronic assembly according to claim 10 wherein the output terminal is connected to a corresponding conductive strip on the circuit board, where the conductive strip has sufficient size to promote secondary heat dissipation from the output terminal.

12. The electronic assembly according to claim 10 wherein the output terminal has a notch in an interfacing surface of the output terminal.

13. An electronic assembly comprising:
a semiconductor device having conductive pads on a device first side and a metallic region on a device second side opposite the first side;
a lead frame for providing separate terminals that are electrically and mechanically connected to the conductive pads;
a first heat sink comprising a first component having a mating side, a portion of the mating side directly bonded with the metallic region of the semiconductor device and having an opposite side opposite the mating side;
a circuit board having an opening, the semiconductor device and the lead frame extending at or outward toward a board first side of the circuit board, a board second side of the circuit board opposite the first side, a plurality of board conductive pads being on the board first side of the circuit board to align with the corresponding terminals of the lead frame for electrical connection therewith; and
a second heat sink comprising a first member overlying the device first side of the semiconductor device, such that the semiconductor device has thermal pathways for heat transfer or dissipation on both the device first side and the device second side.

14. The electronic assembly according to claim 13 wherein a thermal interface material comprises a dielectric material between the first member of the first heat sink and a terminal of the semiconductor device, wherein the terminal is electrically and mechanically connected to one or more conductive pads on the device first side.

15. The electronic assembly according to claim 13 wherein the second heat sink further comprises:
a second member that mates with the first member to form an interior chamber;
a plurality of second protrusions populating the interior chamber and generally spaced apart from each other;
an inlet and an outlet for communication with the interior chamber to circulate a liquid coolant within the interior chamber.

16. An electronic assembly comprising:
a semiconductor device having conductive pads on a device first side and a metallic region on a device second side opposite the first side;
a lead frame for providing separate terminals that are electrically and mechanically connected to the conductive pads;
a circuit board having an opening, the semiconductor device and the lead frame extending at or outward toward a board first side of the circuit board, a board second side of the circuit board opposite the first side, a plurality of board conductive pads being on the board first side of the circuit board to align with the corresponding terminals of the lead frame for electrical connection therewith;
a first heat sink comprising a first component having a mating side, a portion of the mating side directly bonded with the metallic region of the semiconductor device and having an opposite side opposite the mating side, the first heat sink comprising:
a second component with a recess, the second component mating with the first component to form an interior volume;
a plurality of first protrusions of the first member populating the interior volume and generally spaced apart from each other; and
an inlet and an outlet for communication with the interior volume to circulate a liquid coolant within the interior volume.

17. The electronic assembly according to claim 16 wherein the first component comprises a lid with the thermal dissipation members extending from one end, where each protrusion comprises a ridge or elevated region that extends outward from a base surface of the lid.

Assignees

• Deere & Co

Inventors

• Singh Brij N
• Roan Thomas
• Wieland Andrew D
• Clements Neal D

Classifications

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W40/237

  attached to additional arrangements for cooling · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H01L2023/4056

  Electricity · mapped topic