Header assembly

US9692168B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9692168-B1
Application numberUS-201615072477-A
CountryUS
Kind codeB1
Filing dateMar 17, 2016
Priority dateMar 17, 2016
Publication dateJun 27, 2017
Grant dateJun 27, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A header assembly includes a dielectric housing, an electrically conductive outer contact, and a center contact. The housing has a front panel that defines a contact opening therethrough between a front side and a rear side of the front panel. The housing also includes a base panel extending from the rear side of the front panel. The base panel mounts to a circuit board. The outer contact includes a mating segment that extends through the contact opening of the housing and defines a channel that receives the center contact therein. The outer contact also includes a mounting segment that engages the base panel of the housing and is disposed between the base panel and the circuit board. The mounting segment couples and electrically terminates to the circuit board.

First claim

Opening claim text (preview).

What is claimed is: 1. A header assembly comprising: a housing composed of a dielectric material, the housing having a front panel including a front side and a rear side, the front panel defining a contact opening therethrough between the front side and the rear side, the housing also including a base panel extending from the rear side of the front panel and formed integral to the front panel, the base panel configured to mount to a circuit board; an outer contact formed of an electrically conductive material, the outer contact including a mating segment and a mounting segment, the mating segment extending through the contact opening of the front panel and defining a cylindrically-shaped channel, the mounting segment disposed between the base panel and the circuit board and engaging the base panel along a length of the base panel, the mounting segment configured to mechanically couple and electrically terminate to the circuit board; and a center contact disposed in the channel of the outer contact. 2. The header assembly of claim 1 , further comprising a nose cone coupled to the front panel and extending from the front side of the front panel, the nose cone defining a cavity that receives the mating segment of the outer contact therein such that the nose cone surrounds the mating segment, the nose cone having at least one keying rib along an exterior thereof. 3. The header assembly of claim 2 , wherein the front panel defines at least one aperture through the front panel that is proximate to the contact opening, the nose cone having at least one lug extending from a back wall of the nose cone, each lug being received in a corresponding one of the apertures to couple the nose cone to the front panel. 4. The header assembly of claim 1 , wherein the base panel of the housing includes mounting posts configured to extend into corresponding holes in the circuit board to mount the housing to the circuit board. 5. The header assembly of claim 1 , wherein the housing includes at least one support wall extending between the front panel and the base panel. 6. The header assembly of claim 1 , wherein the mounting segment of the outer contact has two rear grounding legs that extend from a spine portion of the outer contact, each rear grounding leg having a proximal section that extends generally laterally from the spine portion and a distal section that extends generally vertically towards the circuit board to mount to the circuit board, the rear grounding legs extending around corresponding stub portions of the base panel such that each stub portion is disposed laterally between the distal section of the corresponding rear grounding leg and the spine portion of the outer contact. 7. The header assembly of claim 1 , wherein the base panel of the housing defines a tunnel that extends rearward from a front of the base panel at the front panel, the mounting segment of the outer contact being disposed within the tunnel and engaging an inner surface of the tunnel. 8. The header assembly of claim 7 , wherein the tunnel has an elongated dome shape that is open along a bottom side of the base panel that faces the circuit board. 9. The header assembly of claim 7 , wherein the tunnel defines two tunnel slots therethrough extending frontward from a rear end of the tunnel, the mounting segment of the outer contact having two rear grounding legs that extend outward from a spine portion of the outer contact, each rear grounding leg extending out of the tunnel through a corresponding one of the tunnel slots to mechanically couple and electrically terminate to the circuit board. 10. The header assembly of claim 1 , wherein the mating segment of the outer contact has a closed cylindrical shape and the mounting segment of the outer contact has an open cylindrical shape, the mating segment formed integral to the mounting segment, the mounting segment including edges and grounding legs that extend from the edges to be received within vias of the circuit board. 11. A header assembly comprising: a housing composed of a dielectric material, the housing having a front panel including a front side and a rear side, the front panel defining a contact opening therethrough between the front side and the rear side, the housing also including a base panel extending from the rear side of the front panel, the base panel defining a tunnel that extends rearward from a front of the base panel at the front panel, the base panel configured to mount to a circuit board, the tunnel having an elongated dome shape that is open along a bottom side of the base panel that faces the circuit board; an outer contact formed of an electrically conductive material, the outer contact including a mating segment and a mounting segment, the mating segment extending through the contact opening of the front panel and defining a cylindrically-shaped channel, the mounting segment being disposed within the tunnel of the base panel between an inner surface of the tunnel and the circuit board, the mounting segment configured to mechanically couple and electrically terminate to the circuit board; and a center contact disposed in the channel of the outer contact. 12. The header assembly of claim 11 , wherein the tunnel defines two tunnel slots therethrough, the mounting segment of the outer contact having two rear grounding legs that extend outward from a spine portion of the outer contact, each rear grounding leg extending from the tunnel through a corresponding one of the tunnel slots to mechanically couple and electrically terminate to the circuit board. 13. The header assembly of claim 12 , wherein the base panel includes a top side and a bottom side that faces the circuit board, the base panel defining a mounting slot on both a first side and a second side of the tunnel along a lateral width of the housing, each mounting slot extending through the base panel between the top side and the bottom side, wherein each rear grounding leg of the outer contact has a proximal section that extends out of the tunnel through the corresponding tunnel slot and a distal section that extends downward through a corresponding mounting slot in the base panel to mount to the circuit board such that at least a stub portion of the base panel is disposed laterally between the distal section of the rear grounding leg and the spine portion of the outer contact. 14. The header assembly of claim 11 , wherein the outer contact is a first outer contact and the contact opening of the front panel is a first contact opening, the header assembly further including a second outer contact, the front panel further defining a second contact opening disposed adjacent to the first contact opening along a lateral width of the housing, the second outer contact having a mating segment extending through the second contact opening and a mounting segment disposed between the base panel of the housing and the circuit board, the mounting segment of the second outer contact configured to mechanically couple and electrically terminate to the circuit board. 15. A header assembly comprising: a housing composed of a dielectric material, the housing having a front panel including a front side and a rear side, the front panel defining a contact opening therethrough between the front side and the rear side, the front panel defining at least one aperture therethrough that is proximate to the contact opening, the housing also including a base panel extending from the rear side of the front panel, the base panel configured to mount to a circuit board; a nose cone coupled to the front panel and extending from the front side of the front panel along a mating axis,

Assignees

Inventors

Classifications

  • H01R13/502Primary

    composed of different pieces (H01R13/514 takes precedence) · CPC title

  • Two poles · CPC title

  • H01R24/50Primary

    mounted on a PCB [Printed Circuit Board] · CPC title

  • terminals for insertion into holes · CPC title

  • cooperating directly with the edge of the rigid printed circuits · CPC title

Patent family

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Frequently asked questions

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What does patent US9692168B1 cover?
A header assembly includes a dielectric housing, an electrically conductive outer contact, and a center contact. The housing has a front panel that defines a contact opening therethrough between a front side and a rear side of the front panel. The housing also includes a base panel extending from the rear side of the front panel. The base panel mounts to a circuit board. The outer contact inclu…
Who is the assignee on this patent?
Tyco Electronics Corp, Te Connectivity Corp
What technology area does this patent fall under?
Primary CPC classification H01R13/502. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 27 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).