Multi-layer ground shield structure of interconnected elements

Patent metadata

Field	Value
Publication number	US-9691720-B2
Application number	US-201514809983-A
Country	US
Kind code	B2
Filing date	Jul 27, 2015
Priority date	Jul 27, 2015
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A multi-layer ground shield structure of interconnected elements is disclosed. The ground shield structure may include a first patterned layer of a ground shield structure, a second patterned layer of the ground shield structure, and a spacer between the first patterned layer and the second patterned layer. The first patterned layer includes first conductive elements interconnected within the first patterned layer according to a first pattern. The second patterned layer includes second conductive elements interconnected within the second patterned layer according to a second pattern.

First claim

What is claimed is:

1. A device comprising:
a first patterned layer of a ground shield structure, the first patterned layer including first conductive elements electrically interconnected within the first patterned layer according to a first pattern, wherein a particular conductive element of the first conductive elements is connected to at least two other conductive elements of the first conductive elements;
a second patterned layer of the ground shield structure, the second patterned layer including second conductive elements electrically interconnected within the second patterned layer according to a second pattern, wherein the first pattern and the second pattern are complementary patterns; and
a spacer between the first patterned layer and the second patterned layer.

2. The device of claim 1 , wherein the first conductive elements are electrically interconnected to provide a first conductive path from a first side of the first patterned layer to a second side of the first patterned layer, and wherein the first conductive path extends across the first patterned layer.

3. The device of claim 2 , wherein the first conductive elements are electrically interconnected such that no conductive path extends between the first side of the first patterned layer and a third side of the first patterned layer, and wherein the third side is adjacent to the first side and adjacent to the second side.

4. The device of claim 1 , wherein the second conductive elements are electrically interconnected to provide a second conductive path that extends between a first side of the second patterned layer and a second side of the second patterned layer, and wherein the second conductive elements are electrically interconnected such that no conductive path extends between the first side of the second patterned layer and a third side of the second patterned layer.

5. The device of claim 1 , wherein the first patterned layer further includes third conductive elements, wherein at least one conductive element of the third conductive elements is electrically isolated from the first conductive elements.

6. The device of claim 1 , wherein the first patterned layer includes a first plurality of first unit cells and the second patterned layer includes a second plurality of second unit cells.

7. The device of claim 6 , wherein each of the first unit cells and each of the second unit cells has a rectangular shape.

8. The device of claim 6 , wherein each of the first unit cells and each of the second unit cells has a hexagonal shape.

9. The device of claim 6 , wherein multiple unit cells of the first plurality of unit cells are electrically interconnected to provide a first conductive path that extends across the multiple unit cells between a first side of the first patterned layer and a second side of the first patterned layer.

10. The device of claim 9 , wherein multiple second unit cells of the second plurality of unit cells are electrically interconnected to provide a second conductive path that extends across the multiple second unit cells between a first side of the second patterned layer and a second side of the second patterned layer.

11. The device of claim 10 , wherein the first conductive path extends generally in a particular direction across the first patterned layer and the second conductive path extends generally in the particular direction across the first patterned layer.

12. The device of claim 10 , further comprising a ground connection coupled to the first conductive path and a second ground connection coupled to the second conductive path.

13. The device of claim 1 , wherein the spacer comprises a dielectric material, and wherein the spacer electrically isolates the first patterned layer from the second patterned layer.

14. The device of claim 1 , further comprising an apparatus in which the first patterned layer and the second patterned layer are integrated, wherein the apparatus comprises a mobile phone, a computer, a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), or a fixed location data unit.

15. The device of claim 1 , further comprising a first component on a first side of the ground shield structure and a second component of a second side of the ground shield structure, wherein the ground shield structure provides electrical isolation between the first component and the second component.

16. The device of claim 15 , wherein at least one of the first component or the second component includes an inductor.

17. The device of claim 1 , wherein a particular conductive element of the second conductive elements is connected to at least two other conductive elements of the second conductive elements, and wherein the first conductive elements are physically interconnected.

18. The device of claim 1 , wherein the particular conductive element of the first conductive elements forms a portion of a first conductive path of the first patterned layer, and wherein the particular conductive element is in contact with multiple conductive elements of the first conductive elements.

19. The device of claim 1 , wherein the first pattern and the second pattern have an inverse arrangement of conductive elements with reference to a particular axis.

20. The device of claim 19 , wherein the first patterned layer further includes dielectric material positioned between each of the first conductive elements, and wherein the dielectric material of the first patterned layer and the second conductive elements of the second patterned layer are substantially aligned with reference to the particular axis.

21. The device of claim 20 , wherein the dielectric material of the first patterned layer and the second conductive elements of the second patterned layer have substantially the same size, have substantially the same shape, and have substantially the same position with reference to the particular axis.

22. A computer-readable medium storing instructions that are executable by a processor to perform operations comprising:
initiating formation of a first patterned layer of a ground shield structure, the first patterned layer including first conductive elements electrically interconnected within the first patterned layer according to a first pattern, wherein a particular conductive element of the first conductive elements is connected to at least two other conductive elements of the first conductive elements; and
initiating formation of a second patterned layer of the ground shield structure, the second patterned layer including second conductive elements electrically interconnected within the second patterned layer according to a second pattern, wherein a spacer is between the first patterned layer and the second patterned layer, and wherein the first pattern and the second pattern are complementary patterns.

23. The computer-readable medium of claim 22 , wherein formation of the first patterned layer includes depositing conductive material on the spacer to form the first pattern and formation of the second patterned layer includes depositing conductive material on the spacer to form the second pattern.

24. A ground shield structure comprising:
means for conducting charge, the means for conducting charge comprising a first layer of first electrically interconnected elements and a second layer of second electrically interconnected elements, the first layer of first electrically interconnected e

Assignees

• Qualcomm Inc

Inventors

• Song Young Kyu
• Jow Uei-Ming
• Lee Jong-Hoon

Classifications

• H10W42/267

  Patterned shielding planes · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title