Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Patent metadata

Field	Value
Publication number	US-9691696-B2
Application number	US-201615005220-A
Country	US
Kind code	B2
Filing date	Jan 25, 2016
Priority date	Mar 12, 2014
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

Stacked dies ( 110 ) are encapsulated in an interposer's cavity ( 304 ) by multiple encapsulant layers ( 524 ) formed of moldable material. Conductive paths ( 520, 620.3 ) connect the dies to the cavity's bottom wall ( 304 B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole ( 514 ) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.

First claim

The invention claimed is:

1. An assembly comprising:
a substrate whose top side comprises a cavity comprising a bottom wall;
one or more contact pads under the bottom wall;
a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer made of cured resin at least partially cured separately from the encapsulant layer of any other level; and
electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall.

2. The assembly of claim 1 wherein the one or more contact pads under the bottom wall are part of a redistribution layer formed on a bottom surface of the substrate.

3. The assembly of claim 1 wherein the electrically conductive wiring comprises a plurality of vertical segments each of which passes through a respective one of the encapsulant layers and is electrically connected, by the electrically conductive wiring, to the at least one die and to the at least one contact pad.

4. The assembly of claim 3 wherein the electrically conductive wiring comprises, at a top of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment.

5. The assembly of claim 3 wherein the electrically conductive wiring comprises, at a bottom of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment.

6. The assembly of claim 3 wherein the electrically conductive wiring comprises a conductive path comprising a non-vertical line and interconnecting two of the vertical segments passing through the respective encapsulant layers adjacent to each other.

7. The assembly of claim 1 wherein each encapsulant layer does not have any separately cured sub-layers.

8. The assembly of claim 1 , comprising one or more contact pads on top of the plurality of levels, for connection to structures external to the assembly.

9. The assembly of claim 1 wherein in least one level, at least one die is part of a multi-chip module contained by the level.

10. The assembly of claim 1 wherein each level comprises at least one die whose top surface is coplanar with the encapsulant layer of the level.

11. An assembly comprising:
a substrate whose top side comprises a cavity comprising a bottom wall;
one or more contact pads under the bottom wall;
a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer comprising organic polymer; and
electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall;
wherein the electrically conductive wiring comprises a plurality of vertical segments each of which passes through a respective one of the encapsulant layers and is electrically connected, by the electrically conductive wiring, to the at least one die and to the at least one contact pad; and
wherein the electrically conductive wiring comprises, at a top of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment.

12. The assembly of claim 11 wherein the electrically conductive wiring comprises, at a bottom of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment.

13. The assembly of claim 11 wherein the electrically conductive wiring comprises a conductive path comprising a non-vertical line and interconnecting two of the vertical segments passing through the respective encapsulant layers adjacent to each other.

14. The assembly of claim 11 wherein the one or more contact pads under the bottom wall are part of a redistribution layer formed on a bottom surface of the substrate.

15. The assembly of claim 11 , comprising one or more contact pads on top of the plurality of levels, for connection to structures external to the assembly.

16. The assembly of claim 11 wherein in least one level, at least one die is part of a multi-chip module contained by the level.

17. The assembly of claim 11 wherein each level comprises at least one die whose top surface is coplanar with the encapsulant layer of the level.

18. An assembly comprising:
a substrate whose top side comprises a cavity comprising a bottom wall;
one or more contact pads under the bottom wall;
a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer comprising organic polymer; and
electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall;
wherein the electrically conductive wiring comprises a plurality of vertical segments each of which passes through a respective one of the encapsulant layers and is electrically connected, by the electrically conductive wiring, to the at least one die and to the at least one contact pad; and
wherein the electrically conductive wiring comprises, at a bottom of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment.

19. The assembly of claim 18 wherein the electrically conductive wiring comprises a conductive path comprising a non-vertical line and interconnecting two of the vertical segments passing through the respective encapsulant layers adjacent to each other.

20. The assembly of claim 18 wherein each level comprises at least one die whose top surface is coplanar with the encapsulant layer of the level.

Assignees

• Invensas Corp

Inventors

• Shen Hong
• Wang Liang
• Katkar Rajesh

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title