Laser annealing device with multiple lasers

Patent metadata

Field	Value
Publication number	US-9691619-B2
Application number	US-201314654089-A
Country	US
Kind code	B2
Filing date	Mar 7, 2013
Priority date	Mar 7, 2013
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A laser annealing device of the present invention includes a stage on which a heating object is placed, a first laser element which emits first continuous laser light, a first optical system which leads the first continuous laser light to the heating object to form a first application region on the heating object, a second laser element which emits second continuous laser light having a wavelength shorter than that of the first continuous laser light, a second optical system which leads the second continuous laser light to the heating object to form a second application region on the heating object, and a system controller which executes scanning with the first application region and the second application region so that each portion of the heating object is scanned with at least part of the first application region before being scanned with the second application region.

First claim

The invention claimed is:

1. A laser annealing device comprising:
a stage on which a heating object is placed;
a first laser element which emits first continuous laser light;
a first optical system which leads the first continuous laser light to the heating object to form a first application region on the heating object;
a second laser element which emits second continuous laser light having a wavelength shorter than that of the first continuous laser light;
a second optical system which leads the second continuous laser light to the heating object to form a second application region on the heating object;
a system controller which executes scanning with the first application region and the second application region so that each portion of the heating object is scanned with at least part of the first application region before being scanned with the second application region;
a third laser element which emits third continuous laser light having a wavelength longer than that of the second continuous laser light; and
a third optical system which leads the third continuous laser light to the heating object to form a third application region on the heating object,
wherein the system controller executes scanning with the third application region so that each portion of the heating object is scanned with the third application region after being scanned with the second application region.

2. The laser annealing device according to claim 1 , wherein the system controller executes scanning with the first application region and the second application region so that the scanning speed is 50 to 1000 m/min.

3. A laser annealing device comprising:
a stage on which a heating object is placed;
a first laser element which emits first continuous laser light;
a first optical system which leads the first continuous laser light to the heating object to form a first application region on the heating object;
a second laser element which emits second continuous laser light having a wavelength shorter than that of the first continuous laser light;
a second optical system which leads the second continuous laser light to the heating object to form a second application region on the heating object;
a system controller which executes scanning with the first application region and the second application region so that each portion of the heating object is scanned with at least part of the first application region before being scanned with the second application region;
a third laser element which emits third continuous laser light having a wavelength shorter than that of the first continuous laser light; and
a third optical system which leads the third continuous laser light to the heating object to form a third application region on the heating object,
wherein the system controller executes scanning with the third application region so that each portion of the heating object is scanned with the third application region after being scanned with the second application region.

4. The laser annealing device according to claim 1 , wherein the first laser element, the first optical system, the second laser element and the second optical system are disposed so that a portion of the first application region and a portion of the second application region overlap each other.

5. The laser annealing device according to claim 1 , wherein the width of the second application region in a scanning direction is larger than the width of the first application region in the scanning direction.

6. The laser annealing device according to claim 1 , wherein the width of the first application region in a scanning direction is larger than the width of the second application region in the scanning direction.

7. The laser annealing device according to claim 6 , wherein part of the first application region is extended rearward in the scanning direction beyond the second application region.

8. The laser annealing device according to claim 1 , wherein the system controller again executes scanning with the first application region and the second application region on ½ to ⅔ of the region already scanned with the first application region and the second application region.

9. The laser annealing device according to claim 1 , wherein the system controller executes scanning with the first application region and the second application region on a region not overlapping the region already scanned with the first application region and the second application region, with no gap formed between the region already scanned and the region presently scanned.

Assignees

• Kanada Kazunori
• Minato Tadaharu
• Kawase Yusuke
• Mitsubishi Electric Corp

Inventors

• Kanada Kazunori
• Minato Tadaharu
• Kawase Yusuke

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• H01L21/324

  Electricity · mapped topic

• H01L21/268 Primary

  Electricity · mapped topic