Shielding structure and wire harness using conductive resin mold and non-metallic fiber braid

US9691527B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9691527-B2
Application numberUS-201414225975-A
CountryUS
Kind codeB2
Filing dateMar 26, 2014
Priority dateSep 27, 2011
Publication dateJun 27, 2017
Grant dateJun 27, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A shielding structure includes a conductive resin molded product, and a non-metallic fiber braid which is formed in a tubular shape by using multiple ultrathin strands made of conductive non-metallic fibers. A distal end of the non-metallic fiber braid is welded to the conductive resin molded product in the shielding structure.

First claim

Opening claim text (preview).

What is claimed is: 1. A shielding structure, comprising: a first conductive resin molded product; a second conductive resin molded product; a non-metallic fiber braid, formed in a tubular shape by using multiple ultrathin strands made of conductive non-metallic fibers; a first weld that secures a first distal end of the non-metallic fiber braid to the first conductive resin molded product; and a second weld that secures a second distal end of the non-metallic fiber braid to the second conductive resin molded product, wherein the first distal end and the second distal end are opposite ends of the non-metallic fiber braid in axial direction of the non-metallic fiber braid. 2. A shielding structure as claimed in claim 1 , wherein the non-metallic fiber is a carbon fiber or a conductive resin fiber in which a conductive material is mixed with a resin material. 3. A shielding structure as claimed in claim 1 , wherein the first conductive resin molded product is a fixing member configured to be fixed to the another member having conductivity. 4. A shielding structure as claimed in claim 1 , wherein the second conductive resin molded product is a pipe body having conductivity and the non-metallic fiber braid circumscribes the pipe body. 5. A wire harness, comprising: one or plural conducting paths; a non-metallic fiber braid formed in a tubular shape using multiple ultrathin strands made of conductive non-metallic fibers, the non-metallic fiber braid with which the one or plural conducting paths are covered; a conductive resin molded product; a first weld that secures a first distal end of the non-metallic fiber braid; and a second weld that secures a second distal end of the non-metallic fiber braid, wherein the first distal end and the second distal end are opposite ends of the non-metallic fiber braid in axial direction of the non-metallic fiber braid. 6. A shielding structure as claimed in claim 2 , wherein the first conductive resin molded product is a fixing member configured to be fixed to another member having conductivity. 7. A shielding structure as claimed in claim 2 , wherein the second conductive resin molded product is a pipe body having conductivity and the non-metallic fiber braid circumscribes the pipe body.

Assignees

Inventors

Classifications

  • Dielectric material made conductive, e.g. plastic material coated with metal · CPC title

  • H01R13/504Primary

    different pieces being moulded, cemented, welded, e.g. ultrasonic welding, or swaged together · CPC title

  • H01B17/42Primary

    Means for obtaining improved distribution of voltage (capacitor-type lead-through insulators H01B17/28); Protection against arc discharges · CPC title

  • Protecting, fastening and routing means therefor · CPC title

  • the conductive member being a shielded cable · CPC title

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Frequently asked questions

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What does patent US9691527B2 cover?
A shielding structure includes a conductive resin molded product, and a non-metallic fiber braid which is formed in a tubular shape by using multiple ultrathin strands made of conductive non-metallic fibers. A distal end of the non-metallic fiber braid is welded to the conductive resin molded product in the shielding structure.
Who is the assignee on this patent?
Yazaki Corp
What technology area does this patent fall under?
Primary CPC classification H01R13/504. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 27 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).