Heat pipe

US9689625B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9689625-B2
Application numberUS-201314103855-A
CountryUS
Kind codeB2
Filing dateDec 12, 2013
Priority dateDec 14, 2012
Publication dateJun 27, 2017
Grant dateJun 27, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a heat pipe comprising following steps: providing an elongated circular tube; providing an elongated rod, the rod comprising an upper portion and a lower portion, a cross section of each of the upper portion and the lower portion being semicircular, the upper portion having a radius less than that of the lower portion, the radius of the lower portion being equal to an inner radius of the circular tube; inserting the rod in the circular tube, a receiving portion being formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube, labeling the position of the first wick structure at an exterior of the circular tube and sealing the tube to thereby form the heat pipe; and flattening the heat pipe under an outer force applied on the label on the exterior of the circular tube to thereby form a flat heat pipe. 2. The method for manufacturing the heat pipe of claim 1 , wherein before the rod is inserted in the circular tube, a nitrogen compound thin film is formed on an outer surface of the rod by performing high temperature surface treatment on the outer surface of the rod in nitrogen atmosphere, and an organic mold-release agent is sprayed over the outer surface of the rod. 3. The method for manufacturing the heat pipe of claim 1 , wherein a transverse cross section of the receiving portion is semicircular ring shaped. 4. The method for manufacturing the heat pipe of claim 1 , wherein after the amount of metal powder is filled into the receiving portion of the circular tube, the circular tube is vibrated until the metal powder is evenly distributed along the length of the circular tube in accordance with its particle size. 5. The method for manufacturing the heat pipe of claim 1 , wherein a transverse cross section of the first wick structure is semicircular ring shaped. 6. The method for manufacturing the heat pipe of claim 1 , wherein a transverse cross section of the first wick structure is U-shaped after the circular tube is flattened. 7. The method for manufacturing the heat pipe of claim 1 , wherein the position of the first wick structure is labeled by imprinting, drawing with a color pencil, or printing date on the exterior of the circular tube corresponding to the position of the first wick structure in an interior of the circular tube. 8. The method for manufacturing the heat pipe of claim 1 , wherein the entire inner circumferential face of the circular tube is etched to form a plurality of elongated, spaced protruding portions with the grooves therebetween before the rod is inserted in the circular tube, and the protruding portions and the grooves cooperatively form a second wick structure. 9. The method for manufacturing the heat pipe of claim 8 , wherein a circle enclosed by distal ends of the protruding portions has a radius equal to the radius of the lower portion of the rod. 10. The method for manufacturing the heat pipe of claim 8 , wherein the first wick structure is attached to a part of the second wick structure which is formed on a bottom of the tube.

Assignees

Inventors

Classifications

  • Heat pipe device making · CPC title

  • F28D15/046Primary

    characterised by the material or the construction of the capillary structure · CPC title

  • Means for filling or sealing heat pipes · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9689625B2 cover?
A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first w…
Who is the assignee on this patent?
Furui Precise Component (Kunshan) Co Ltd, Foxconn Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification F28D15/046. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jun 27 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).