Heat transfer device

Patent metadata

Field	Value
Publication number	US-9689622-B2
Application number	US-201214395734-A
Country	US
Kind code	B2
Filing date	Apr 25, 2012
Priority date	Apr 25, 2012
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction of the pipe line. There is provided a proximity portion where the heat transfer block is in proximate to the pipe line at both ends of the heat transfer block in the extending direction of the pipe line.

First claim

The invention claimed is:

1. A heat transfer device transferring heat to a pipe line in which a fluid flows, comprising:
a heat transfer block of high heat conductivity, surrounding said pipe line,
a heat pipe formed in said heat transfer block, along an extending direction of said pipe line, and
a heater applying heat to said heat pipe,
said heat transfer block including a plurality of divided blocks dividable along the extending direction of said pipe line,
a proximity portion where said heat transfer block is in proximity to said pipe line being provided at both ends of said heat transfer block in the extending direction of said pipe line.

2. The heat transfer device according to claim 1 , wherein an extending length of said proximity portion in the extending direction of said pipe line is less than or equal to an outer diameter of said pipe line at said proximity portion.

3. The heat transfer device according to claim 1 , wherein
said heat transfer block includes a first divided block and a second divided block,
said heat pipe is formed at only said first divided block, among the plurality of divided blocks,
said first divided block and said second divided block are in surface contact.

4. The heat transfer device according to claim 3 , wherein
said heat transfer block includes an intermediate member between said divided block and said pipe line, at said proximity portion,
said intermediate member is in thermal contact with said divided block.

5. The heat transfer device according to claim 4 , wherein a small gap is provided between said intermediate member and said pipe line.

6. The heat transfer device according to claim 3 , wherein said proximity portion is formed by reducing an inner diameter of said divided block at said proximity portion.

7. The heat transfer device according to claim 6 , wherein a small gap is provided between said divided block and said pipe line at said proximity portion.

8. The heat transfer device according to claim 3 , comprising a biasing member pushing said pipe line at said proximity portion towards said first divided block side.

9. The heat transfer device according to claim 8 , comprising a sphere attached to a leading end of said biasing member,
said sphere being in contact with an outer circumferential face of said pipe line.

10. The heat transfer device according to claim 1 , wherein said heat transfer block includes a first divided block and a second divided block,
said first divided block facing said second divided block with a small gap therebetween.

11. The heat transfer device according to claim 10 , wherein said heat transfer block includes an intermediate member between said divided block and said pipe line, at said proximity portion,
said intermediate member being in thermal contact with said divided block.

12. The heat transfer device according to claim 11 , wherein said intermediate member is in contact with said pipe line.

13. The heat transfer device according to claim 10 , wherein said proximity portion is formed by reducing an inner diameter of said divided block at said proximity portion.

14. The heat transfer device according to claim 13 , wherein said divided block is in contact with said pipe line at said proximity portion.

Assignees

• Uno Junichi
• Yamakage Hisaaki
• Toshiba Mitsubishi-Electric Ind Systems Corp

Inventors

• Uno Junichi
• Yamakage Hisaaki

Classifications

• F28D15/02 Primary

  in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F24H1/12 Primary

  in which the water is kept separate from the heating medium · CPC title

• F16L53/001

  Mechanical Engineering · mapped topic

• F28D15/0233

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title