Curable silicone composition, and optical semiconductor device

Patent metadata

Field	Value
Publication number	US-9688869-B2
Application number	US-201415029865-A
Country	US
Kind code	B2
Filing date	Oct 8, 2014
Priority date	Oct 17, 2013
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

The present invention provides a curable silicone composition for forming a cured product which inhibits the discoloration of silver electrodes or a silver-plated substrate in an optical semiconductor device due to a sulfur-containing gas, the curable silicone composition comprising: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) an organic compound having an organic value of at least 175 in an organic conceptual diagram and having a specific group; and (D) a hydrosilylation reaction catalyst. In addition, the present invention provides an optical semiconductor device in which silver electrodes or a silver-plated substrate of an optical semiconductor device is sealed or covered with a cured product of the composition described above, the optical semiconductor device having excellent reliability after a sulfur resistance test.

First claim

The invention claimed is:

1. A curable silicone composition comprising at least:
(A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule;
(B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, in an amount such that an amount of silicon-bonded hydrogen atoms in this component is from 0.1 to 10 mol per 1 mol of silicon-bonded alkenyl groups in component (A);
(C) an organic compound having an organic value (OV) of at least 175 in an organic conceptual diagram and having at least one group selected from the group consisting of —COOH, —C(O)OC(O)—, —CH 2 CH 2 CH 2 OH, —CH 2 CH(OH)—, —OCH(CH 2 OH)—, —CHO(CH 2 O—) 2 , and —C(O)O—, in an amount of from 0.001 to 10 mass % with respect to the composition, wherein the organic value (OV) is the sum of a value determined by multiplying the total number of carbon atoms of the organic compound (C) by 20 and an organic value assigned to substituents and wherein the organic conceptual diagram is a diagram in which the covalency of the organic compound (C) is evaluated with the organic value (OV) and ionic bonding properties are evaluated with an inorganic value (IV), wherein the position of the organic compound (C) is expressed as a point (OV, IV) on a rectangular coordinate plane using the organic axis as the horizontal axis and the inorganic axis as the vertical axis; and
(D) a platinum hydrosilylation reaction catalyst, in an amount such that an amount of platinum atoms in this component is from 0.01 to 500 ppm with respect to the composition in terms of mass units.

2. The curable silicone composition according to claim 1 , wherein component (C) is at least one organic compound selected from the group consisting of a fatty acid, an acid anhydride, a higher alcohol, a polyglycerin, a triglyceride, an ester, a sorbitan fatty acid ester, a glycerin fatty acid ester, a polyoxyethylene monoester, a polypropylene glycol monoester, a polybutylene glycol monoester, a polyoxyethylene diester, a polyoxyethylene alkyl ether ester, a polyoxytetramethylene diester, a polyoxyethylene fatty acid glyceryl, a polyoxyethylene sorbitan fatty acid ester, a mono-fatty acid polyoxyethylene-cured castor oil, and a mixture of two or more thereof.

3. The curable silicone composition according to claim 1 , wherein component (C) is at least one ester selected from the group consisting of cetyl myristate, octyldodecyl myristate, isopropyl myristate, isopropyl palmitate, butyl stearate, stearyl stearate, ethyl oleate, decyl oleate, diethyl sebacate, dioctyl sebacate, neopentyl glycol di-2-ethylhexanoate, pentaerythrite tetra-2-ethylhexanoate, ethylene glycol distearate, 2-ethylhexyl palmitate, 2-ethylhexyl stearate, isotridecyl isononanoate, isodecyl isononanoate, ethylhexylpalmitate, hexyldecylethyl hexanoate, PEG-4-diheptanoate, isostearyl neopentanoate, tridecyl neopentanoate, cetyl octanoate, cetyl palmitate, cetyl ricinoleate, cetyl stearate, cetyl myristate, coco-dicaprylate/caprylate, decyl isostearate, isodecyl oleate, isodecyl neopentanoate, isohexyl neopentanoate, octyl palmitate, dioctyl maleate, tridecyl octanoate, myristyl myristate, and octyl dodecanoate.

4. The curable silicone composition according to claim 1 , wherein component (C) is at least one sorbitan fatty acid ester selected from the group consisting of sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan sesquilaurate, sorbitan sesquipalmitate, sorbitan sesquistearate, sorbitan sesquioleate, sorbitan trilaurate, sorbitan tripalmitate, sorbitan tristearate, and sorbitan trioleate.

5. The curable silicone composition according to claim 1 , wherein component (C) is at least one polyglycerin selected from the group consisting of monoallyl diglycerin, monoallyl tetraglycerin, triglycerin, and tetraglycerin.

6. The curable silicone composition according to claim 1 , wherein component (C) is at least one polyoxyethylene fatty acid glyceryl selected from the group consisting of polyoxyethylene glyceryl caprylate, polyoxyethylene glyceryl (caprylate/caprate), polyoxyethylene glyceryl laurate, polyoxyethylene glyceryl stearate, polyoxyethylene glyceryl oleate, polyoxyethylene glyceryl tallowate, polyoxyethylene coconut oil fatty acid glyceryl, polyoxyethylene glyceryl isostearate, and polyoxyethylene glyceryl triisostearate.

7. The curable silicone composition according to claim 1 , wherein the composition is a sealing agent or a coating agent of an optical semiconductor device.

8. An optical semiconductor device comprising a silver electrode or a silver-plated substrate, the electrode or substrate being sealed or covered with a cured product of the curable silicone composition according to claim 1 .

9. The curable silicone composition according to claim 1 , wherein the content of alkenyl groups with respect to all of the silicon-bonded organic groups in component (A) is from 0.05 to 40 mol %.

10. The curable silicone composition according to claim 1 , wherein the content of component (B) is an amount such that the content of silicon-bonded hydrogen atoms in this component is from 0.5 to 5 mol per 1 mol of silicon-bonded alkenyl groups in component (A).

11. The curable silicone composition according to claim 9 , wherein the content of component (B) is an amount such that the content of silicon-bonded hydrogen atoms in this component is from 0.5 to 5 mol per 1 mol of silicon-bonded alkenyl groups in component (A).

12. The curable silicone composition according to claim 1 , wherein the content of component (C) is an amount of from 0.01 to 7 mass % with respect to the composition.

13. The curable silicone composition according to claim 11 , wherein the content of component (C) is an amount of from 0.01 to 7 mass % with respect to the composition.

Assignees

• Dow Corning Toray Co Ltd

Inventors

• Miyamoto Yusuke
• Hayashi Akito
• Kobayashi Akihiko

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• C09D7/1233 Primary

  Chemistry & Metallurgy · mapped topic

• C08L83/04 Primary

  Polysiloxanes · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title

• H01L2924/12044

  Electricity · mapped topic