Apparatus and method for forming holes in glass substrate

Patent metadata

Field	Value
Publication number	US-9688563-B2
Application number	US-201615057605-A
Country	US
Kind code	B2
Filing date	Mar 1, 2016
Priority date	Nov 16, 2015
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 μm.

First claim

What is claimed is:

1. An apparatus for forming holes in a glass substrate, comprising:
a laser source that irradiates a laser beam on a first surface of the glass substrate; and
a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed,
wherein the base plate includes a recessed area in a central part thereof, and a plurality of supports arranged within the recessed area to support the glass substrate,
wherein at least a part of the plurality of supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the plurality of supports extend,
wherein one support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval d that is shorter than 30 mm, and
wherein the plurality of supports have a height h that is higher than 70 μm.

2. The apparatus as claimed in claim 1 , wherein the lattice shape is a triangular lattice shape.

3. The apparatus as claimed in claim 2 , wherein all of the plurality of supports are arranged in the triangular lattice shape within the plane approximately perpendicular to the direction in which the plurality of supports extend.

4. The apparatus as claimed in claim 1 , wherein the lattice shape is a rectangular lattice shape.

5. The apparatus as claimed in claim 4 , wherein all of the plurality of supports are arranged in the rectangular lattice shape within the plane approximately perpendicular to the direction in which the plurality of supports extend.

6. The apparatus as claimed in claim 1 , wherein the interval d is longer than 10 mm.

7. The apparatus as claimed in claim 1 , wherein the base plate includes a suction mechanism that fixes the glass substrate thereon by suction.

8. The apparatus as claimed in claim 1 , wherein the recessed area of the base plate is defined by an inner wall that is formed at an outer peripheral part of the base plate.

9. The apparatus as claimed in claim 1 , wherein the plurality of supports have a maximum dimension in a range of 500 μm to 5000 μm.

10. The apparatus as claimed in claim 1 , wherein the glass substrate has a thickness in a range of 0.05 mm to 0.7 mm.

11. The apparatus as claimed in claim 1 , wherein the glass substrate includes a first protection film formed on the first surface, and a second protection film formed on the second surface.

12. A method for forming holes in a glass substrate, comprising:
preparing a workpiece that includes a glass substrate having a first surface and a second surface opposite to the first surface; and
irradiating a laser beam on the first surface of the glass substrate, to form the holes in the glass substrate,
wherein the irradiating is performed in a state in which the workpiece is placed on a base plate such that the second surface of the glass substrate is closer to the base plate,
wherein the base plate includes a recessed area in a central part thereof, and a plurality of supports within the recessed area to support the workpiece,
wherein at least a part of the plurality of supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the plurality of supports extend,
wherein one support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval d that is shorter than 30 mm, and
wherein the plurality of supports have a height h that is higher than 70 μm.

13. The method as claimed in claim 12 , wherein the lattice shape is a triangular lattice shape.

14. The method as claimed in claim 13 , wherein all of the plurality of supports are arranged in the triangular lattice shape within the plane approximately perpendicular to the direction in which the plurality of supports extend.

15. The method as claimed in claim 12 , wherein the lattice shape is a rectangular lattice shape.

16. The method as claimed in claim 15 , wherein all of the plurality of supports are arranged in the rectangular lattice shape within the plane approximately perpendicular to the direction in which the plurality of supports extend.

17. The method as claimed in claim 12 , wherein the preparing forms a first protection film on the first surface of the glass substrate, and forms a second protection film on the second surface of the glass substrate.

Assignees

• Asahi Glass Co Ltd

Inventors

• Ono Motoshi
• Kobashi Takanori

Classifications

• B26D7/01

  Means for holding or positioning work · CPC title

• C03B33/102

  involving a focussed radiation beam, e.g. lasers · CPC title

• C03B33/023 Primary

  the sheet {or ribbon} being in a horizontal position · CPC title

• B26D7/20 Primary

  Cutting beds {(B26D7/018 takes precedence; supporting beds for severing by means of a fluid jet B26F3/008)} · CPC title

• B23K37/0408

  for planar work · CPC title