Heat dissipation in hermetically-sealed packaged devices

Patent metadata

Field	Value
Publication number	US-9688453-B2
Application number	US-201514617078-A
Country	US
Kind code	B2
Filing date	Feb 9, 2015
Priority date	Feb 9, 2015
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.

First claim

What is claimed is:

1. An apparatus comprising:
a hermetically sealed enclosure comprising a base portion and a thermally insulating lid;
at least one thermally conductive via formed in the thermally insulating lid;
a plurality of heat generating elements supported by the base portion, the plurality of heat generating elements rising to a plurality of different heights from the base portion; and
at least one resilient heat exchange component that extends from the thermally conductive via to the plurality of different heights and configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.

2. The apparatus of claim 1 , further comprising a heat sink coupled to the lid opposite the resilient heat exchange component.

3. The apparatus of claim 2 , wherein the thermally conductive via transfers heat between the resilient heat exchange component and the heat sink.

4. The apparatus of claim 1 , further comprising a thermoelectric cooler between the lid and the resilient heat exchange component.

5. The apparatus of claim 4 , wherein the lid of the enclosure is electrically insulating, and wherein the thermoelectric cooler is electrically powered through electrically conductive vias in the lid of the enclosure.

6. The apparatus of claim 1 , further comprising a plurality of thermoelectric coolers between the resilient heat exchange component and the plurality of heat generating elements.

7. The apparatus of claim 6 , wherein the lid is formed of electrically insulating material, and wherein the plurality of thermoelectric coolers are electrically powered through electrically conductive vias in the lid of the enclosure.

8. The apparatus of claim 1 , wherein the at least one resilient heat exchange component comprises one or more leaf springs, one or more beds of springs, or a combination of one or more leaf springs and one or more beds of springs.

9. The apparatus of claim 1 , wherein the heat generating elements comprise electronic devices or photonic devices.

10. The apparatus of claim 9 , wherein the heat generating elements include electrical connections coupled to the base portion of the enclosure.

11. An apparatus comprising:
a hermetically sealed enclosure comprising a base portion and a thermally insulating lid;
at least one thermally conductive via formed in the thermally insulating lid; and
at least one resilient heat exchange component that extends from the thermally conductive via to a plurality of different heights from the base portion of the enclosure at a plurality of different locations within the enclosure and configured to conduct heat from inside the enclosure through the lid of the enclosure to outside the enclosure.

12. The apparatus of claim 11 , further comprising a heat sink coupled outside the enclosure to the thermally conductive via in the lid opposite the resilient heat exchange component.

13. The apparatus of claim 12 , wherein the thermally conductive via between the resilient heat exchange component and the heat sink transfers heat from inside the enclosure to the heat sink outside the enclosure.

14. The apparatus of claim 11 , wherein the at least one resilient heat exchange component comprises one or more leaf springs, one or more beds of springs, or a combination of one or more leaf springs and one or more beds of springs.

15. The apparatus of claim 11 , further comprising a thermoelectric cooler between the lid and the resilient heat exchange component.

16. The apparatus of claim 15 , wherein the lid of the enclosure is electrically insulating, and wherein the thermoelectric cooler is electrically powered through electrically conductive vias in the lid of the enclosure.

17. The apparatus of claim 11 , further comprising a plurality of thermoelectric coolers between the resilient heat exchange component and a plurality of heat generating elements inside the enclosure.

18. The apparatus of claim 17 , wherein the lid is formed of electrically insulating material, and wherein the plurality of thermoelectric coolers are electrically powered through electrically conductive vias in the lid of the enclosure.

19. The apparatus of claim 17 , wherein the heat generating elements comprise electronic devices or photonic devices.

20. The apparatus of claim 19 , wherein the heat generating elements include electrical connections coupled to the base portion of the enclosure.

Assignees

• Cisco Tech Inc

Inventors

• Savic Jovica
• Ahmad Mudasir
• Brenner Thomas

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• B65D43/0202

  without integral tamper element · CPC title

• H01L35/30

  Electricity · mapped topic

• B65D81/18 Primary

  providing specific environment for contents, e.g. temperature above or below ambient (with thermal insulation B65D81/38) · CPC title