Component mounting method using a tape feeder

US9686894B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9686894-B2
Application numberUS-201214234792-A
CountryUS
Kind codeB2
Filing dateAug 16, 2012
Priority dateAug 25, 2011
Publication dateJun 20, 2017
Grant dateJun 20, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A size S 1 of each of projections 32 b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32 b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20 , and a size S 2 of each of the projections 32 b in a direction perpendicular to the proceeding direction of the tape member 20 at a height where each of the projections 32 b is engaged with each of the feed holes 22 of the tape member 20 is smaller than the diameter D of each of the feed holes 22 of the tape member 20.

First claim

Opening claim text (preview).

The invention claimed is: 1. A component mounting method by a component mounting apparatus, the component mounting apparatus comprising: a substrate positioning unit arranged to perform positioning of a substrate; a tape feeder that is arranged to make a tape member comprising: a plurality of component storage units that are aligned at regular intervals; and a plurality of feed holes that are aligned at regular intervals in parallel with the alignment of the component storage units, wherein the tape feeder moves the tape member to supply components that are housed in each of the component storage units of the tape member to a predetermined component ejection slot; and a mounting head arranged to pick up the components that are supplied to the predetermined component ejection slot and to mount the components on the substrate of which positioning is performed by the substrate positioning unit, wherein the tape feeder comprises a feeder main body comprising a tape passage that is a passage of the tape member, a sprocket that is provided rotatable under the tape member that passes inside the tape passage of the feeder main body, and comprises a number of projections on an outer perimeter, and sprocket driving means for moving each of the projections provided on the outer perimeter of the sprocket on a circular orbit having an rotation axis of the sprocket as its center by drivingly rotating the sprocket intermittently, inserting each of the projections from beneath into each of the feed holes of the tape member that passes through the tape passage of the feeder main body to engage each of the projections with each of the feed holes before and after each of the projections passes through one region on the circular orbit, and making the tape member proceed in a manner that each of the projections leaves the tape member for the beneath of the feed holes after retracting the tape member, and wherein a size of each of the projections provided on the outer perimeter of the sprocket in a proceeding direction of the tape member at a height where each of the projections is engaged with each of the feed holes of the tape member is larger than a diameter of each of the feed holes of the tape member, and a size of each of the projections in a direction perpendicular to the proceeding direction of the tape member at a height where each of the projections is engaged with each of the feed holes of the tape member is smaller than the diameter of each of the feed holes of the tape member, the component mounting method comprising the steps of: performing positioning of the substrate by the substrate positioning unit; supplying the components to the component ejection slot by the tape feeder; and picking up the components that are supplied by the tape feeder with use of the mounting head to mount the components on the substrate of which positioning is performed. 2. The component mounting method according to claim 1 comprising: wherein each of the projections has a leading arc-shaped surface and a trailing arc-shaped surface and opposite side surfaces, and wherein a longest distance between the leading arc-shaped surface and the trailing arc-shaped surface in the proceeding direction of the tape member at the height where each of the projections is engaged with each of the feed holes of the tape member is larger than the diameter of each of the feed holes of the tape member, and a distance between the opposite side surfaces in the direction perpendicular to the proceeding direction of the tape member at the height where each of the projections is engaged with each of the feed holes of the tape member is smaller than the diameter of each of the feed holes of the tape member. 3. The component mounting method according to claim 2 comprising: wherein at least one of the entire leading arc-shaped surface and the entire trailing arc-shaped surface is in contact with an inner rim of the feed hole of the tape member when the projection engages with the feed hole, and wherein the entire of the opposite side surfaces are spaced from the inner rim of the feed hole of the tape member when the projection engages with the feed hole. 4. The component mounting method according to claim 1 wherein the size of each of the projections that is larger than the diameter of each of the feed holes of the tape member is aligned parallel with the proceeding direction of the tape member.

Assignees

Inventors

Classifications

  • Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

  • H05K13/02Primary

    Feeding of components · CPC title

  • Feeding with belts or tapes · CPC title

  • Means to fasten electrical component to wiring board, base, or substrate · CPC title

  • tape feeders · CPC title

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Frequently asked questions

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What does patent US9686894B2 cover?
A size S 1 of each of projections 32 b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32 b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20 , and a size S 2 of each of the projections 32 b in a…
Who is the assignee on this patent?
Kanai Kazunori, Hiyoshi Masanori, Yoneyama Shigekazu, and 2 more
What technology area does this patent fall under?
Primary CPC classification H05K13/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 20 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).