Foldable machines

Patent metadata

Field	Value
Publication number	US-9686867-B2
Application number	US-201213723364-A
Country	US
Kind code	B2
Filing date	Dec 21, 2012
Priority date	Sep 17, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

Methods to systematize the development of machines using inexpensive, fast, and convenient fabrication processes are disclosed. In an embodiment, a folding pattern and corresponding circuit design can provide the blueprints for fabrication. The folding pattern may be provided (e.g. laser machined) on a flat sheet of substrate material, such as a polymer. The circuit pattern may be generated by etching or applying (e.g. sputtering) a copper foil layer onto the substrate. Circuit components and actuators may then be added at specified locations. The flat substrate may then be folded along the predefined locations to form the final machine. The machine may operate autonomously to perform a task.

First claim

What is claimed is:

1. A method for fabricating a machine, the method comprising:
defining a set of machine parameters which define a machine for accomplishing a task, the machine parameters comprising a folding pattern for forming the machine from a foldable substrate and circuit locations for placement of circuits on the substrate;
storing the set of machine parameters as a machine model in a computer storage;
applying the folding pattern to at least one surface of the substrate;
forming one or more conductive signal paths directly on at least one surface of the substrate, wherein forming one or more conductive signal paths includes etching a circuit pattern on a conductive foil layer disposed on the at least one surface of the substrate such that the conductive signal paths correspond to metallic traces disposed on the at least one surface of the substrate and such that at least one of the conductive signal paths is formed across a fold of the folding pattern;
disposing circuit components directly on one or more surfaces of said substrate such that the circuit components are directly electrically coupled to the conductive signal paths thereby forming one or more electrical circuits; and
folding the substrate according to the folding pattern, such that the substrate is folded into the machine wherein the machine is provided having moving parts controlled by the electrical circuits and wherein folding the substrate includes folding the at least one conductive signal path that crosses the fold.

2. The method of claim 1 further comprising adapting the machine model according to user specifications.

3. The method of claim 1 wherein folding the substrate comprises modifying a substrate into a shape defined by the machine model.

4. The method of claim 3 wherein modifying a substrate comprises modifying a substantially flat substrate.

5. The method of claim 4 wherein modifying the substantially flat substrate includes cutting a shape from a piece of stock substrate.

6. The method of claim 1 wherein the machine is autonomously functioning.

7. The method of claim 1 wherein the substrate is a polymer substrate.

8. The method of claim 1 wherein the substrate has a thickness of about 5 mils to about 10 mils.

9. A method for fabricating a machine, the method comprising:
defining a set of machine parameters which define a machine for accomplishing a task, the machine parameters comprising a folding pattern for forming the machine from a foldable substrate and circuit locations for placement of circuits on the substrate;
storing the set of machine parameters as a machine model in a computer storage;
providing the folding pattern on at least one surface of the substrate;
creating electrical circuits directly on at least one surface of the substrate including:
forming conductive signal paths comprising metallic traces on the at least one surface of the substrate; and

folding the substrate and the conductive signal paths according to the folding pattern, such that the substrate is folded into the machine wherein the machine is provided having moving parts controlled by the electrical circuits;
wherein
forming the conductive signal paths includes etching a circuit pattern on a conductive foil layer disposed on the substrate thereby providing the one or more conductive signal paths as etched conductive foil signal paths and forming at least one of the conductive signal paths across a fold of the folding pattern; and
folding the substrate includes folding the at least one conductive signal path that crosses the fold.

10. The method of claim 9 wherein conductive signal paths that cross a fold comprise a foldable material so that the metallic traces do not break when the substrate is folded.

11. A method for fabricating a machine, the method comprising:
providing a folding pattern on at least one surface of a substrate;
forming one or more conductive signal paths directly on at least one surface of the substrate, wherein the conductive signal paths comprise conductive metallic traces that cross a fold of the folding pattern;
disposing circuit components directly on one or more surfaces of said substrate such that the circuit components are directly electrically coupled to the conductive signal paths thereby forming one or more electrical circuits; and
folding the substrate and the metallic traces that cross a fold, according to the folding pattern, such that the substrate and at least one of the metallic traces are folded into the form of the machine, wherein the machine is provided having moving parts controlled by the electrical circuits;
wherein forming the one or more conductive signal paths comprises etching a circuit pattern on a conductive foil layer disposed on the substrate thereby providing the one or more conductive signal paths as etched conductive foil signal paths.

12. A method for fabricating a machine, the method comprising:
defining a set of machine parameters which define a machine for accomplishing a task, the machine parameters comprising a folding pattern for forming the machine from a foldable substrate and circuit locations for placement of circuits on the substrate;
storing the set of machine parameters as a machine model in a computer storage;
applying the folding pattern to at least one surface of the substrate;
forming one or more conductive signal paths directly on at least one surface of the substrate wherein forming one or more conductive signal paths directly on at least one surface of the substrate comprises etching a circuit pattern on a conductive foil layer disposed on the substrate thereby providing the one or more conductive signal paths as etched conductive foil conductive signal paths;
disposing circuit components directly on one or more surfaces of said substrate such that the circuit components are directly electrically coupled to the etched conductive foil conductive signal paths thereby forming one or more electrical circuits; and
folding the substrate according to the folding pattern, such that the substrate is folded into the machine such that the machine is provided having moving parts controlled by the electrical circuits
wherein:
forming one or more conductive signal paths includes forming at least one of the conductive signal paths across a fold of the folding pattern; and
folding the substrate according to the folding pattern includes folding the at least one conductive signal path that crosses the fold.

Assignees

• Rus Daniela
• Wood Robert J
• Onal Cagdas Denizel
• Tolley Michael
• Massachussetts Inst Of Tech
• Harvard College

Inventors

• Rus Daniela
• Wood Robert J
• Onal Cagdas Denizel
• Tolley Michael

Classifications

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title

• H05K3/0052

  Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards · CPC title

• H05K3/0005

  for designing circuits by computer · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K2201/0909

  Preformed cutting or breaking line · CPC title