Semiconductor laser device

Patent metadata

Field	Value
Publication number	US-9685759-B2
Application number	US-201615248318-A
Country	US
Kind code	B2
Filing date	Aug 26, 2016
Priority date	Aug 28, 2015
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.

First claim

What is claimed is:

1. A semiconductor laser device comprising:
a base;
a semiconductor laser element provided above the base;
a lid provided over the base and housing the semiconductor laser element, the lid having a recess formed in an upper portion of the lid with the recess being defined by a lateral surface and a bottom, and the lid having a through-hole formed in the bottom of the recess;
a support member disposed in the recess and having a through-hole disposed above the through-hole of the lid, a diameter of the through-hole of the support member being smaller than a diameter of the through-hole of the lid, the support member having a coefficient of thermal expansion that is different from a coefficient of thermal expansion of the lid, and the support member having a lateral surface spaced apart from the lateral surface of the recess;
a wavelength converting member supported in the through-hole of the support member;
a holding member fixed to the lid and holding an upper surface of the support member; and
a buffer material disposed in at least a part of a space between the lateral surface of the recess and the lateral surface of the support member.

2. The semiconductor laser device according to claim 1 , wherein
the buffer material is composed of a material having a Young's modulus smaller than a Young's modulus of the lid and a Young's modulus of the support member.

3. The semiconductor laser device according to claim 1 , wherein
the buffer material is composed of a resin or an eutectic solder.

4. The semiconductor laser device according to claim 1 , wherein
an opening of the through-hole of the support member is in a circular shape in plan view and has the diameter in a range of 0.1 mm to 1 mm on a lower side.

5. The semiconductor laser device according to claim 1 , wherein
the through-hole of the support member has a cross-sectional shape that spreads out from bottom to top.

6. The semiconductor laser device according to claim 1 , wherein
the support member is composed of a ceramic.

7. The semiconductor laser device according to claim 6 , wherein
the support member is composed of aluminum oxide or aluminum nitride.

8. The semiconductor laser device according to claim 6 , wherein
the lid is composed of a metal.

9. The semiconductor laser device according to claim 8 , wherein
the lid is composed of a material containing iron as main component.

10. The semiconductor laser device according to claim 1 , wherein
in plan view, the buffer material is disposed at a plurality of locations that are spaced apart from each other along a periphery of the support member.

11. The semiconductor laser device according to claim 1 , wherein
the lateral surface of the recess has a stepped cross-sectional shape so as to spread out from bottom to top.

12. The semiconductor laser device according to claim 1 , wherein
the holding member is welded to the lid.

13. The semiconductor laser device according to claim 1 , wherein
the lid has a first lid surrounding the semiconductor laser element, and a second lid disposed on the first lid and having the recess.

14. The semiconductor laser device according to claim 8 , wherein
the buffer material is composed of a resin.

15. The semiconductor laser device according to claim 1 , wherein
a distance between the lateral surface of the recess and the lateral surface of the support member is in a range of 10 μm to 200 μm.

16. The semiconductor laser device according to claim 14 , wherein
a distance between the lateral surface of the recess and the lateral surface of the support member is in a range of 10 μm to 200 μm.

17. The semiconductor laser device according to claim 1 , further comprising
a lens provided in the lid between the semiconductor laser element and the support member.

18. The semiconductor laser device according to claim 13 , further comprising
a lens provided on the first lid between the semiconductor laser element and the support member.

19. The semiconductor laser device according to claim 18 , wherein
the semiconductor laser element is configured to emit light having a peak wavelength in a range of 300 nm to 500 nm.

20. The semiconductor laser device according to claim 19 , wherein
the semiconductor laser element is formed of a Group III-V semiconductor.

21. The semiconductor laser device according to claim 1 , wherein
in plan view, the buffer material is continuously disposed along a periphery of the support member to surround the support member.

Assignees

• Nichia Corp

Inventors

• Morizumi Naoto
• Namie Takashi
• Nakagawa Takashi
• Komoda Daisuke
• Shozui Hiroaki

Classifications

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/02208 Primary

  characterised by the shape of the housings · CPC title

• F21S41/192

  Details of lamp holders, terminals or connectors · CPC title

• F21S43/195

  Details of lamp holders, terminals or connectors · CPC title

• F21S41/176

  Light sources where the light is generated by photoluminescent material spaced from a primary light generating element · CPC title