Curable composition for sealing optical semiconductor

Patent metadata

Field	Value
Publication number	US-9685597-B2
Application number	US-201414894438-A
Country	US
Kind code	B2
Filing date	May 21, 2014
Priority date	May 28, 2013
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition according to the present invention for sealing optical semiconductor further includes a component (D) in addition to the components (A), (B) and (C). The component (A) is a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups. The component (B) is a cycloaliphatic epoxy compound. The component (C) is a curing catalyst including a cationic component and an anionic component and generating an acid upon application of light or heat, where the cationic component contains an aromatic ring, and the anionic component contains a central element selected from boron and phosphorus. The component (D) is conductive fiber-bearing particles each including a particulate substance and a fibrous conductive substance lying on or over the particulate substance.

First claim

The invention claimed is:

1. A curable composition for sealing optical semiconductor, the curable composition comprising:
a component (A) being a compound containing epoxy groups, excluding a cycloaliphatic epoxy compound;
a component (B) being a cycloaliphatic epoxy compound; and
a component (C) being a curing catalyst, the curing catalyst including:
a cationic component containing three or more aromatic rings;
an anionic component containing a central element selected from boron and phosphorus,

the curing catalyst generating an acid upon application of light or heat,
wherein the component (A) includes:
a compound (A1) containing at least two epoxy groups, and
a compound (A2) containing one epoxy group per molecule and having a molecular weight of 100 to 1000.

2. A curable composition for sealing optical semiconductor, the curable composition comprising:
a component (A) being a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups;
a component (B) being a cycloaliphatic epoxy compound;
a component (C) being a curing catalyst, the curing catalyst including:
a cationic component containing at least one aromatic ring; and
an anionic component containing a central element selected from boron and phosphorus,
the curing catalyst generating an acid by application of light or heat; and

a component (D) being conductive fiber-bearing particles each including:
a particulate substance; and
a fibrous conductive substance lying on or over the particulate substance.

3. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (A) includes a compound (A1′), and
wherein the compound (A1′) contains at least one aromatic ring and at least two epoxy groups.

4. The curable composition according to claim 3 for sealing optical semiconductor,
wherein the compound (A1′) has a molecular weight of 100 to 10000.

5. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (A) includes a compound (A2′),
wherein the compound (A2′) contains at least one aromatic ring, contains one epoxy group, and
wherein the compound (A2′) has a molecular weight of 100 to 1000.

6. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (B) is a compound containing two or more cycloaliphatic epoxy groups.

7. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (B) has a molecular weight of 100 to 500.

8. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (B) is a compound devoid of ester groups and/or carbonate groups.

9. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (A) is a compound containing at least one aromatic ring and containing at least one epoxy group, and
wherein the component (B) is a cycloaliphatic epoxy compound excluding aromatic-ring-containing compounds.

10. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the component (B) is a compound represented by Formula (3):

wherein X is selected from a single bond and a linkage group.

11. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the curable composition contains the component (B) in a content of 30 to 95 percent by weight based on the total weight (100 percent by weight) of the curable composition, and
wherein the curable composition contains the component (C) in a content of 0.01 to 8 percent by weight based on the total weight (100 percent by weight) of the curable composition.

12. The curable composition according to claim 1 for sealing optical semiconductor,
wherein the cationic component containing at least one aromatic ring in the component (C) is an aromatic sulfonium salt.

13. The curable composition according to claim 2 for sealing optical semiconductor,
wherein the fibrous conductive substance in the component (D) is a conductive nanowire.

14. The curable composition according to claim 13 for sealing optical semiconductor,
wherein the conductive nanowire is at least one selected from the group consisting of metal nanowires, semiconductor nanowires, carbon fibers, carbon nanotubes, and conductive polymer nanowires.

15. A cured product of the curable composition for sealing optical semiconductor according to claim 1 .

16. The cured product according to claim 15 ,
wherein the cured product has a water vapor permeability of equal to or less than 40 g/m 2 ·day.

17. The cured product according to claim 15 ,
wherein an outgassing amount is equal to or less than 20 ppm.

18. The cured product according to claim 15 ,
wherein an acrolein amount is equal to or less than 3 ppm.

19. An optical semiconductor encapsulated or sealed using the curable composition according to claim 1 for sealing optical semiconductor.

20. An optical semiconductor device comprising
the optical semiconductor according to claim 19 .

Assignees

• Daicel Corp

Inventors

• Marukawa Masanori
• Egawa Tomoya
• Shibamoto Akihiro

Classifications

• H01L51/5237

  Electricity · mapped topic

• C08G65/18

  Oxetanes · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/24

  carbocyclic · CPC title

• C08L2205/02

  containing two or more polymers of the same C08L -group · CPC title