LED module and method of preparing the LED module, lighting device

Patent metadata

Field	Value
Publication number	US-9685594-B2
Application number	US-201314387703-A
Country	US
Kind code	B2
Filing date	May 24, 2013
Priority date	May 31, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.

First claim

The invention claimed is:

1. An LED module comprising:
a submount having a face in a thickness direction of the submount;
an LED chip bonded to the face with a first bond;
a reflective layer provided on a further face of the submount in the thickness direction for reflecting light from the LED chip;
a patterned wiring circuit electrically connected to the LED chip; and
an opaque substrate,
the first bond allowing light emitted from the LED chip to pass therethrough,
the submount being a light-transmissive member having light diffusing properties and having a planar size larger than a planar size of the LED chip,
the patterned wiring circuit being provided on the face of the submount so as not to overlap the LED chip,
the submount being constituted by a first ceramic layer and a second ceramic layer which are stacked in the thickness direction, the first ceramic layer and the second ceramic layer being arranged from the LED chip in order of the first ceramic layer and the second ceramic layer, the first ceramic layer being thicker than the second ceramic layer, the first ceramic layer including ceramic particles having a greater particle diameter than the second ceramic layer, while the second ceramic layer includes ceramic particles having a smaller particle diameter than the first ceramic layer and the second ceramic layer further includes pores, the first ceramic layer and the second ceramic layer having different optical properties so that the second ceramic layer which is farther from the LED chip is higher than the first ceramic layer in reflectance in a wavelength range of the light emitted from the LED chip,
the submount being bonded to a surface of the opaque substrate with a second bond,
a silver paste being screen printed on a ceramic green paste, the silver paste formed onto the second ceramic layer,
the silver paste being sintered to form the reflective layer, while the sintering also forms the second ceramic layer from the ceramic green paste such that the reflective layer is formed onto the second ceramic layer, and
the surface of the opaque substrate having one of light diffusing properties or specular reflective properties.

2. The LED module according to claim 1 , further comprising:
a color conversion portion made of a transparent material containing a first fluorescent material which is excited by the light emitted from the LED chip to emit light having a different color from the light emitted from the LED chip,
the color conversion portion covering sides of the LED chip and an opposite surface of the LED chip from the first bond.

3. The LED module according to claim 2 , wherein
the color conversion portion contains a light diffusion material.

4. The LED module according to claim 1 , wherein
at least one of the first bond and the second bond contains a second fluorescent material which is excited by the light emitted from the LED chip to emit light having a different color from the light emitted from the LED chip.

5. The LED module according to claim 1 , further comprising a resin portion which is situated over the face of the submount and serves as an outer cover through which light passes last,
the resin portion being made of a transparent resin which contains a light diffusion material.

6. The LED module according to claim 1 , further comprising a plurality of the LED chips on the face of the submount,
wherein:
the patterned wiring circuit includes a first conductor and a second conductor that are arranged apart from each other on the face of the submount;
the plurality of the LED chips include a group of LED chips which are connected in series and arranged on a virtual line connecting the first conductor and the second conductor to each other;
an LED chip of the group of LED chips that is closest to the first conductor on the virtual line has an anode electrode which is electrically connected to the first conductor by a first wire;
an LED chip of the group of LED chips that is closest to the second conductor on the virtual line has a cathode electrode which is electrically connected to the second conductor by a second wire; and
adjacent LED chips of the group of LED chips on the virtual line are electrically connected to each other in such a manner that an LED chip of the adjacent LED chips that is closer to the first conductor has a cathode electrode which is electrically connected to an anode electrode of an LED chip of the adjacent LED chips that is closer to the second conductor by a third wire.

7. The LED module according to claim 6 , comprising
an encapsulating portion with a band shape which covers the first wire, the second wire, the third wire, and the group of the LED chips arranged on the virtual line,
the encapsulating portion having a recessed portion between the adjacent LED chips on the virtual line for suppressing total reflection of light emitted from the adjacent LED chips.

8. The LED module according to claim 1 , wherein:
the reflective layer is a metal layer; and
the LED module further comprises a protection layer provided on the further face of the submount for protecting the reflective layer.

9. A method of manufacturing an LED module having a submount having a face in a thickness direction of the submount, an LED chip bonded to the face with a first bond that allows light emitted from the LED chip to pass therethrough, a reflective layer provided on a further face of the submount in the thickness direction for reflecting light from the LED chip, a patterned wiring circuit electrically connected to the LED chip, and an opaque substrate, the method comprising:
providing the patterned wiring circuit on the face of the submount so as not to overlap the LED chip, wherein:
the submount is a light-transmissive member having light diffusing properties and having a planar size larger than a planar size of the LED chip,
the submount is constituted by a first ceramic layer and a second ceramic layer which are stacked in the thickness direction, the first ceramic layer and the second ceramic layer being arranged from the LED chip in order of the first ceramic layer and the second ceramic layer, the first ceramic layer being thicker than the second ceramic layer, the first ceramic layer including ceramic particles having a greater particle diameter than the second ceramic layer, while the second ceramic layer includes ceramic particles having a smaller particle diameter than the first ceramic layer and the second ceramic layer further includes pores, the first ceramic layer and the second ceramic layer having different optical properties so that the second ceramic layer which is farther from the LED chip is higher than the first ceramic layer in reflectance in a wavelength range of the light emitted from the LED chip, and
the submount is bonded to a surface of the opaque substrate with a second bond;
screen-printing a silver paste on a ceramic green paste, the silver paste formed onto the second ceramic layer; and
sintering the silver paste to form the reflective layer, while the sintering also forms the second ceramic layer from the ceramic green paste, such that the reflective layer is formed onto the second ceramic layer.

10. A lighting device comprising:
a device main body; and
a light source that is the LED module according to claim 1 .

Assignees

• Panasonic Corp
• Panasonic Ip Man Co Ltd

Inventors

• Urano Yoji
• Tanaka Kenichiro
• Nakamura Akifumi
• Hirano Toru
• Hyuga Hideaki
• Suzuki Masanori
• Yokota Teruhisa

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/01515

  Forming coatings · CPC title