Multilayer ceramic electronic component and board having the same

Patent metadata

Field	Value
Publication number	US-9685271-B2
Application number	US-201514663412-A
Country	US
Kind code	B2
Filing date	Mar 19, 2015
Priority date	Oct 6, 2014
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction thereof, and floating electrodes which are partially overlapped with the first and second internal electrodes; upper and lower cover parts including the dielectric layers and disposed above and below the active part; dummy electrodes disposed in the upper and lower cover parts to be overlapped with the floating electrodes; and first and second external electrodes.

First claim

What is claimed is:

1. A multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers;
an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction of the ceramic body and are stacked with at least one of the dielectric layers interposed therebetween, and floating electrodes which alternate with the first and second internal electrodes in a thickness direction of the ceramic body while allowing both end portions thereof to be spaced apart from and overlapped with the first and second internal electrodes in the thickness direction;
upper and lower cover parts disposed above and below the active part;
dummy electrodes disposed between the dielectric layers within the upper and lower cover parts; and
first and second external electrodes provided on both end surfaces of the ceramic body in the length direction and electrically connected to the first and second internal electrodes, respectively,
wherein
an area of the floating electrode on the dielectric layer is equal to an area of the dummy electrode on the dielectric layer,
the first and second external electrodes include band portions which are extended onto upper and lower surfaces of the ceramic body, and
a distance between inner edges of the band portions of the first and second external electrodes on the upper or lower surface of the ceramic body is defined as Lc′ and a length of the dummy electrode in the length direction of the ceramic body is defined as Lp, Lc′<Lp is satisfied.

2. The multilayer ceramic electronic component of claim 1 , wherein a length of the ceramic body is defined as Lc, 1.1×Lc′≦Lp<0.95×Lc is satisfied.

3. The multilayer ceramic electronic component of claim 1 , wherein a distance between the floating electrode and one end surface of the ceramic body in the length direction of the ceramic body is defined as Lm and a length of one band portion of the first and second external electrodes extended onto the upper or lower surface of the ceramic body in the length direction of the ceramic body is defined as Lb, Lm<Lb is satisfied.

4. The multilayer ceramic electronic component of claim 3 , wherein Lm≦0.95×Lb is satisfied.

5. The multilayer ceramic electronic component of claim 1 , wherein a length of the first and second internal electrodes in the length direction of the ceramic body is defined as Lp′ and a length of one band portion of the first and second external electrodes extended onto the upper or lower surface of the ceramic body in the length direction of the ceramic body is defined as Lb, Lb<Lp′ is satisfied.

6. The multilayer ceramic electronic component of claim 5 , wherein 1.1×Lb≦Lp′ is satisfied.

7. The multilayer ceramic electronic component of claim 1 , wherein a thickness of the upper or lower cover part is defined as Tc and a distance between a lowermost dummy electrode and an uppermost dummy electrode among the dummy electrodes disposed in the upper or lower cover part is defined as Td, 0.1×Tc≦Td≦0.99×Tc is satisfied.

8. A board having a multilayer ceramic electronic component, the board comprising:
a printed circuit board;
first and second board electrodes disposed on one surface of the printed circuit board; and
a multilayer ceramic electronic component mounted on the printed circuit board and electrically connected to the first and second board electrodes,
wherein the multilayer ceramic electronic component includes:
a ceramic body including dielectric layers;
an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction of the ceramic body and are stacked with at least one of the dielectric layers interposed therebetween, and floating electrodes which alternate with the first and second internal electrodes in a thickness direction of the ceramic body while allowing both end portions thereof to be spaced apart from and overlapped with the first and second internal electrodes in the thickness direction;
upper and lower cover parts disposed above and below the active part;
dummy electrodes disposed between the dielectric layers within the upper and lower cover parts; and
first and second external electrodes formed on both end surfaces of the ceramic body in the length direction and electrically connected to the first and second internal electrodes, respectively,
wherein an area of the floating electrode on the dielectric layer is equal to an area of the dummy electrode on the dielectric layer,
the first and second external electrodes include band portions which are extended to upper and lower surfaces of the ceramic body, and
a distance between inner edges of the band portions of the first and second external electrodes on the upper or lower surface of the ceramic body is defined as Lc′ and a length of the dummy electrode in the length direction of the ceramic body is defined as Lp, Lc′<Lp is satisfied.

9. The board of claim 8 , wherein a length of the ceramic body is defined as Lc, 1.1×Lc′≦Lp<0.95×Lc is satisfied.

10. The board of claim 8 , wherein a distance between the floating electrode and one end surface of the ceramic body in the length direction of the ceramic body is defined as Lm and a length of one band portion of the first and second external electrodes extended onto the upper or lower surface of the ceramic body in the length direction of the ceramic body is defined as Lb, Lm<Lb is satisfied.

11. The board of claim 10 , wherein Lm≦0.95×Lb is satisfied.

12. The board of claim 8 , wherein a length of the first and second internal electrodes in the length direction of the ceramic body is defined as Lp′ and a length of one band portion of the first and second external electrodes extended to the upper or lower surface of the ceramic body in the length direction of the ceramic body is defined as Lb, Lb<Lp′ is satisfied.

13. The board of claim 12 , wherein 1.1×Lb≦Lp′ is satisfied.

14. The board of claim 8 , wherein a thickness of the upper or lower cover part is defined as Tc and a distance between a lowermost dummy electrode and an uppermost dummy electrode among the dummy electrodes disposed in the upper or lower cover part is defined as Td, 0.1×Tc≦Td≦0.99×Tc is satisfied.

Assignees

• Samsung Electro Mech

Inventors

• Lee Sun Cheol
• Lim Hyoung Wook
• Park Mi Ok
• Choi Jae Yeol
• Moon Ji Hee

Classifications

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title