Optical module having multi-mode coupler formed on semiconductor substrate

Patent metadata

Field	Value
Publication number	US-9684126-B2
Application number	US-201615222483-A
Country	US
Kind code	B2
Filing date	Jul 28, 2016
Priority date	Jul 29, 2015
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

An optical module that implements an MMI device including an optical hybrid primarily made of semiconductor material is disclosed. The MMI device, which has a rectangular plane shape and includes multi-mode couplers, is mounted on a carrier. The carrier provides a step extending in a whole lateral width of a top surface thereof, where the step makes a gap against the MMI device in an area where the MMI couplers are formed.

First claim

What is claimed is:

1. An optical module, comprising:
a multi-mode interference (MMI) device that includes a semiconductor substrate having a multi-mode interference (MMI) coupler and waveguides, the waveguides longitudinally extending from the MIMI coupler in a top surface of the semiconductor substrate; and
a carrier that mounts the MMI device thereon through solder,
wherein the MIMI device has an area in a back surface of the semiconductor substrate, the area being not fixed to the carrier, overlapping with the MIMI coupler in the top surface of the semiconductor substrate, and extending in an overall lateral width of the substrate.

2. The optical module of claim 1 ,
wherein the carrier has a step extending in an overall lateral width thereof, the step corresponding to the area of the semiconductor substrate of the MIMI device and forming a gap against the semiconductor substrate of the MIMI device.

3. The optical module of claim 1 ,
wherein the back surface of the semiconductor substrate has a back metal except for the area not fixed to the carrier, the back metal being fixed to the carrier through the solder.

4. The optical module of claim 3 ,
wherein the back metal is made of gold (Au).

5. The optical module of claim 1 ,
wherein the carrier has expansion co-efficient greater than expansion co-efficient of the semiconductor substrate.

6. The optical module of claim 5 ,
wherein the carrier is made of aluminum oxide (Al 2 O 3 ), and the semiconductor substrate is made of indium phosphide (InP).

7. The optical module of claim 5 ,
wherein the semiconductor substrate at the area thereof receives a compressing stress greater than 20 MPa along the longitudinal direction but substantially no compressing stress along the lateral direction.

8. The optical module of claim 1 ,
wherein the MMI coupler includes a 2×4 MMI coupler and a 2×2 MMI coupler optically coupled with the 2×4 MMI coupler.

9. The optical module of claim 8 ,
wherein the 2×4 MMI coupler and the 2×2 MMI coupler have rectangular plane shape having longitudinal edges along which the waveguides are longitudinally extended.

10. The optical module of claim 1 ,
wherein the carrier is mounted on a base made of copper tungsten (CuW).

11. The optical module of claim 1 ,
wherein the MIMI device monolithically integrates photodiodes (PDs) optically coupled with the MMI coupler through the waveguides.

Assignees

• Sumitomo Electric Industries

Inventors

• Fujimura Yasushi
• Moriyama Yutaka
• Takechi Masaru
• Kikuchi Takehiko

Classifications

• G02B6/4298

  coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers · CPC title

• G02B6/12004 Primary

  Combinations of two or more optical elements · CPC title

• G02B6/4232

  using the surface tension of fluid solder to align the elements, e.g. solder bump techniques (flip-chip mounting techniques in assembly of semiconductor devices H10W72/072) · CPC title

• G02B6/1203

  using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients · CPC title

• G02B6/4286 Primary

  Optical modules with optical power monitoring · CPC title