Contact probe and semiconductor element socket provided with same

Patent metadata

Field	Value
Publication number	US-9684031-B2
Application number	US-201314416692-A
Country	US
Kind code	B2
Filing date	May 23, 2013
Priority date	Jul 23, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

The invention provides a contact probe and a semiconductor element socket provided with the same, the contact probe capable of smooth inspection of a device while securing good conductivity. A contact probe has an upper plunger having a contact stem portion, a lower plunger having an insertion hole with which the contact stem portion is capable of coming into contact, and a coil spring connected to the upper plunger and the lower plunger in such a way as to cover the contact stem portion. The coil spring is configured by helically winding a wiring, and includes a guide portion wound tight in the axial direction of the coil spring by the wire, the guide portion located on the lower plunger side of the coil spring and also includes the upper plunger side portion than an upper end portion of the insertion hole.

First claim

The invention claimed is:

1. A contact probe comprising:
a first plunger having a contact stem portion;
a second plunger having a contact portion with which the contact stem portion is capable of coming into contact; and
a coil spring connected to the first plunger and the second plunger in such a way as to cover the contact stem portion, wherein
the coil spring is configured by helically winding a wiring and is provided with a guide portion formed by the wiring wound tight in an axial direction of the coil spring, the guide portion being located at a portion on the second plunger side of the coil spring and including the first plunger side portion of the coil spring other than the guide portion, and the guide portion guides the contact stem portion such that the contact stem portion is inserted into a hole of the second plunger when the first plunger comes close to the second plunger,
the hole of the second plunger is a round hole, and the wiring forming the guide portion is wound around an exterior portion of the second plunger that includes the hole,
the contact stem portion is slightly inserted into the guide portion when the first plunger and the second plunger do not come close to each other, and
the contact stem portion is inserted into the hole of the second plunger when the upper plunger and the lower plunger come close to each other.

2. The contact probe according to claim 1 , wherein the guide portion has a tapered shape gradually narrowing toward the contact portion.

3. A semiconductor element socket provided with the contact probe as claimed in claim 2 , wherein the contact probe brings an electrode portion of a semiconductor element and an electrode portion of an inspection board into conduction.

4. A semiconductor element socket provided with the contact probe as claimed in claim 1 , wherein the contact probe brings an electrode portion of a semiconductor element and an electrode portion of an inspection board into conduction.

5. The contact probe according to claim 1 , wherein an upper end of the second plunger is inserted in to the guide portion.

Assignees

• Yamaichi Electronics Co Ltd

Inventors

• Suzuki Katsumi
• Suzuki Takeyuki

Classifications

• G01R1/067

  Measuring probes · CPC title

• G01R1/0466

  concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding · CPC title

• G01R1/06722 Primary

  Spring-loaded · CPC title

• G01R31/2884 Primary

  using dedicated test connectors, test elements or test circuits on the IC under test (G01R31/2855 takes precedence) · CPC title