Microwave module

Patent metadata

Field	Value
Publication number	US-9683882-B2
Application number	US-201514753532-A
Country	US
Kind code	B2
Filing date	Jun 29, 2015
Priority date	Jun 30, 2014
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A microwave module 1 for a fill level measuring device 2 operating with the runtime method, has a chip for generating and/or receiving microwave signals and a carrier element. To provide an advantageous as possible microwave module, the chip is located in a cavity 9 of the carrier element 8.

First claim

What is claimed is:

1. A microwave module for a fill level measuring device operating with the runtime method, comprising:
at least one chip for at least one of generating and receiving microwave signals, and having at least one carrier element,
wherein the chip is located in a cavity of the carrier element,
wherein the chip is connected to at least one antenna element,
wherein the antenna element comprises a waveguide in the carrier element and a cap functionally extending the waveguide,
wherein the carrier element comprises at least one copper carrier and one dielectric substrate that form an upper side of the carrier element,
wherein at least one through-contact is located in the substrate of the carrier element reaching at least to the copper carrier, below at least one side part of the cap and
wherein the waveguide is only located in the copper carrier of the carrier element and the cap is located opposite the waveguide on the upper side of the carrier element.

2. The microwave module according to claim 1 , wherein the chip and the cavity are configured and aligned relative to one another so that at least an upper side of the carrier element surrounds the cavity and is flush with an upper side of the chip that faces the upper side of the carrier element.

3. The microwave module according to claim 1 , wherein the chip and the cavity are configured and aligned relative to one another so that at least one bond wire connecting the chip to a conductor path structure located on the upper side the carrier element has a length that is at most 300 micrometers.

4. The microwave module according to claim 1 , wherein the chip is connected to at least one ring coupler.

5. The microwave module according to claim 1 , wherein the chip is able to at least one of generate and receive microwave signals having a frequency greater than 57 GHz.

Assignees

• Krohne Messtechnik Gmbh

Inventors

• Gerding Michael
• Deilmann Michael
• Pohl Nils
• Vogt Michael
• Schulz Christian
• Jaeschke Timo
• Schmits Christoph

Classifications

• G01F23/284 Primary

  Electromagnetic waves · CPC title

• G01F23/00

  Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm · CPC title

• G01N22/00

  Investigating or analysing materials by the use of microwaves or radio waves, i.e. electromagnetic waves with a wavelength of one millimetre or more (G01N3/00 - G01N17/00, G01N24/00 take precedence) · CPC title

• G01S7/032 Primary

  Constructional details for solid-state radar subsystems · CPC title