Oriented structural adhesives

Patent metadata

Field	Value
Publication number	US-9683149-B2
Application number	US-201113812055-A
Country	US
Kind code	B2
Filing date	Jul 26, 2011
Priority date	Jul 27, 2010
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.

First claim

The invention claimed is:

1. A dry structural adhesive material for bonding together opposing surfaces comprising:
a mixture of a first polymeric material and a second polymeric material that is compatible with the first polymeric material, wherein:
i. the first polymeric material is thermohardened at a first elevated temperature;
ii. the second polymeric material is oriented and relaxed at a second elevated temperature;
wherein the second elevated temperature is lower than the first elevated temperature and the adhesive material becomes oriented and deformed at the second elevated temperature and forms a bond upon application of heat at the first elevated temperature to cure the first polymeric material;
wherein relaxation of a molecular orientation of the second polymeric material at the second elevated temperature causes the adhesive material to shrink in at least one direction and to increase its thickness in a transverse direction and thereby contact an opposing surface and develop a bond with the opposing surface at heating to the first elevated temperature; and
wherein the second polymeric material includes at least 30% by weight of phenoxy resin and a polymeric constituent, and wherein the polymeric constituent is a solid resin including a nitrile rubber;
wherein the adhesive material is non-foaming; and
wherein the adhesive material is dry and not tacky to the touch at ambient temperature.

2. A dry structural adhesive material according to claim 1 , wherein the molecular orientation of the polymeric constituent of the second polymeric material is frozen in place prior to heat of the second elevated temperature.

3. A dry structural adhesive material according to claim 1 , wherein at temperature below a cure temperature it is moulded.

4. A dry structural adhesive material according to claim 2 , wherein the molecular orientation of the polymeric constituent of thee second polymeric material is produced during an injection moulding process.

5. A dry structural adhesive material according to claim 1 , in which the polymeric constituent of the second polymeric material further includes an elastomer.

6. A dry structural adhesive material according to claim 1 , wherein heating the adhesive material increases its thickness between 25% and 500%.

7. A dry structural adhesive material according to claim 1 , wherein the adhesive material is heated to the second elevated temperature within a range of 120° C. to 220° C. and that expands the adhesive material.

8. A dry structural adhesive material according to claim 2 , including a methacrylate/butane/styrene copolymer impact modifier.

9. A dry structural adhesive material according to claim 1 , including a dicyandiamide curing agent.

10. A dry structural adhesive material according to claim 1 , wherein heating the adhesive material increases its thickness from at least about 200% to 500%.

11. A dry structural adhesive material according to claim 1 , wherein the adhesive material has a lap shear strength of at least about 33 MPa.

12. A dry structural adhesive material according to claim 1 , wherein the adhesive material has a T-Peel value of 13.6 N/mm to 16 N/mm.

13. A dry structural adhesive material according to claim 2 , including a dicyandiamide curing agent.

14. A dry structural adhesive material according to claim 2 , wherein the adhesive material has a lap shear strength of at least about 33 MPa.

15. A dry structural adhesive material according to claim 11 , wherein the adhesive material has a T-peel value of 13.6 N/mm to 16 N/mm.

16. A dry structural adhesive material according to claim 1 , wherein the polymeric constituent of the second polymeric material further includes an elastomer and the elastomer is selected from a styrene butadiene rubber, an acrylic elastomer or a polyurethane elastomer.

17. A dry structural adhesive material according to claim 1 , wherein the adhesive material includes about 40% by weight of phenoxy resin.

18. A dry structural adhesive material according to claim 1 , wherein the adhesive material further includes epoxy resin.

Assignees

• Czaplicki Michael
• Zephyros Inc

Inventors

• Czaplicki Michael

Classifications

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• C09J2400/226

  in the substrate · CPC title

• C09J171/00

  Adhesives based on polyethers obtained by reactions forming an ether link in the main chain (based on polyacetals C09J159/00; based on epoxy resins C09J163/00; based on polythioether-ethers C09J181/02; based on polyethersulfones C09J181/06); Adhesives based on derivatives of such polymers · CPC title

• C09J5/06 Primary

  involving heating of the applied adhesive · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title