Bonded structure, piezoelectric device, liquid ejecting head, and method of manufacturing bonded structure

Patent metadata

Field	Value
Publication number	US-9682554-B2
Application number	US-201615238103-A
Country	US
Kind code	B2
Filing date	Aug 16, 2016
Priority date	Aug 21, 2015
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

Provided is a bonded structure including a first substrate in which a resin portion made of an elastic member protrudes on one surface and a first electrode layer is formed to cover at least a part of the resin portion, and a second substrate in which a second electrode layer electrically connected to the first electrode layer is formed on a surface facing the first substrate, the first substrate and the second substrate being bonded to each other in a state in which a photosensitive adhesive is interposed therebetween. In a surface of one of the first substrate and the second substrate on the photosensitive adhesive side, a first region reflecting light and a second region less likely to reflect light than the first region are provided in positions different from each other on a region overlapping the photosensitive adhesive in a substrate bonding direction.

First claim

What is claimed is:

1. A bonded structure comprising:
a first substrate in which a resin portion made of an elastic member protrudes on one surface and a first electrode layer is formed to cover at least a part of the resin portion and
a second substrate in which a second electrode layer electrically connected to the first electrode layer is formed on a surface facing the first substrate, the first substrate and the second substrate being bonded to each other in a state in which a photosensitive adhesive is interposed therebetween,
wherein, in a surface of one of the first substrate and the second substrate on the photosensitive adhesive side, a first region reflecting light and a second region less likely to reflect light than the first region are provided in positions different from each other on a region overlapping the photosensitive adhesive in a substrate bonding direction.

2. The bonded structure according to claim 1 ,
wherein at least a part of the photosensitive adhesive is formed on a region deviated to one side in an in-bonding-surface direction from a connection region where the first electrode layer and the second electrode layer abut onto each other and a region deviated to the other side from the connection region, and the connection region is disposed between the photosensitive adhesives on the both sides.

3. A piezoelectric device comprising:
the bonded structure according to claim 2 and
a piezoelectric element that is formed on one of the first substrate and the second substrate and is electrically connected to the first electrode layer and the second electrode layer.

4. A liquid ejecting head comprising:
the piezoelectric device according to claim 3 ;
a pressure chamber of which the volume changes due to deformation of the piezoelectric element; and
a nozzle that communicates with the pressure chamber.

5. The bonded structure according to claim 1 ,
wherein the first region is a region where the photosensitive adhesive and a metal layer intersect each other.

6. A piezoelectric device comprising:
the bonded structure according to claim 5 and
a piezoelectric element that is formed on one of the first substrate and the second substrate and is electrically connected to the first electrode layer and the second electrode layer.

7. A liquid ejecting head comprising:
the piezoelectric device according to claim 6 ;
a pressure chamber of which the volume changes due to deformation of the piezoelectric element; and
a nozzle that communicates with the pressure chamber.

8. The bonded structure according to claim 1 ,
wherein a space formed by recessing a surface on the opposite side to the photosensitive adhesive side is provided on a region overlapping at least a part of the photosensitive adhesive in the substrate bonding direction in one of the first substrate and the second substrate and
wherein the second region is a region corresponding to the space of the one substrate.

9. A piezoelectric device comprising:
the bonded structure according to claim 8 and
a piezoelectric element that is formed on one of the first substrate and the second substrate and is electrically connected to the first electrode layer and the second electrode layer.

10. A liquid ejecting head comprising:
the piezoelectric device according to claim 9 ;
a pressure chamber of which the volume changes due to deformation of the piezoelectric element; and
a nozzle that communicates with the pressure chamber.

11. A piezoelectric device comprising:
the bonded structure according to claim 1 and
a piezoelectric element that is formed on one of the first substrate and the second substrate and is electrically connected to the first electrode layer and the second electrode layer.

12. A liquid ejecting head comprising:
the piezoelectric device according to claim 11 ;
a pressure chamber of which the volume changes due to deformation of the piezoelectric element; and
a nozzle that communicates with the pressure chamber.

13. A method of manufacturing a bonded structure including a first substrate in which a resin portion made of an elastic member protrudes on one surface and a first electrode layer is formed to cover at least a part of the resin portion and a second substrate in which a second electrode layer electrically connected to the first electrode layer is formed on a surface facing the first substrate, the first substrate and the second substrate being bonded to each other in a state in which a photosensitive adhesive is interposed therebetween, the method comprising:
forming a photosensitive adhesive layer on one of the first substrate and the second substrate;
applying light to the photosensitive adhesive layer on the one substrate to form the photosensitive adhesives having different hardness in positions different from each other and removing the other photosensitive adhesive; and
bonding the first substrate and the second substrate to each other by further curing the photosensitive adhesive in a state in which the first electrode layer and the second electrode layer are connected to each other.

14. The method of manufacturing a bonded structure according to claim 13 , further comprising:
forming a metal layer on a first region on which at least a part of the photosensitive adhesive is formed in a surface of the one substrate where the photosensitive adhesive is formed,
wherein, in the applying light, light incident on the photosensitive adhesive layer is reflected by the metal layer, and the photosensitive adhesive in the first region is further cured than a photosensitive adhesive in a second region deviated from the first region.

Assignees

• Seiko Epson Corp

Inventors

• Yoshiike Masashi

Classifications

• B41J2/1632

  machining · CPC title

• B41J2/14201 Primary

  Structure of print heads with piezoelectric elements · CPC title

• B41J2/161

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2002/14419

  Manifold · CPC title

• B41J2/1631

  photolithography · CPC title