Liquid ejection head, method of cleaning the same, and recording apparatus

Patent metadata

Field	Value
Publication number	US-9682552-B2
Application number	US-201615134665-A
Country	US
Kind code	B2
Filing date	Apr 21, 2016
Priority date	May 8, 2015
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

When cleaning is performed to remove kogation, which is deposited on a heat acting portion, by causing an electrochemical reaction through application of a voltage between an upper electrode and an opposing electrode, a wiring located at a periphery of the opposing electrode occludes hydrogen generated during the cleaning, thereby causing hydrogen embrittlement. A unit configured to heat the wiring connected to the opposing electrode is provided, and is driven during the cleaning or after the cleaning, to thereby force hydrogen out of the wiring. Thus, the hydrogen embrittlement of the wiring is suppressed.

First claim

What is claimed is:

1. A method of cleaning a liquid ejection head, the liquid ejection head comprising:
a liquid ejection orifice;
a liquid chamber communicating with the liquid ejection orifice;
a first electrothermal conversion portion disposed in the liquid chamber;
a protective layer having an insulating property and being configured to prevent contact between the first electrothermal conversion portion and liquid inside the liquid chamber;
an upper electrode covering at least a heat generation portion of the protective layer, which is heated by the first electrothermal conversion portion, and being formed of a material containing a metal to be dissolved through an electrochemical reaction with the liquid;
an opposing electrode provided such that a voltage is applied between the upper electrode and the opposing electrode for dissolution of the upper electrode; and
an opposing electrode wiring connected to the opposing electrode,
the method comprising:
cleaning the liquid ejection head by removing kogation, which is deposited on a surface of the upper electrode, through the dissolution of the upper electrode; and
heating, during the cleaning or after the cleaning, the opposing electrode wiring, which is located at a periphery of the opposing electrode so as to be in contact with the liquid.

2. The method of cleaning a liquid ejection head according to claim 1 , wherein the heating of the opposing electrode wiring comprises driving a second electrothermal conversion portion, which is disposed in the liquid ejection head at a position below the opposing electrode through intermediation of the protective layer, by a circuit connected to the second electrothermal conversion portion.

3. The method of cleaning a liquid ejection head according to claim 2 , wherein the circuit connected to the second electrothermal conversion portion is configured to apply a pulse voltage to the second electrothermal conversion portion, to thereby heat the opposing electrode wiring.

4. The method of cleaning a liquid ejection head according to claim 2 , wherein the circuit connected to the second electrothermal conversion portion is configured to apply, to the second electrothermal conversion portion, electric power of a value less than a value at which a bubble is formed in the liquid, to thereby heat the opposing electrode wiring.

5. The method of cleaning a liquid ejection head according to claim 2 , wherein the circuit connected to the second electrothermal conversion portion is configured to apply, to the second electrothermal conversion portion, electric power of a value equal to or greater than a value at which a bubble is formed in the liquid, to thereby heat the opposing electrode wiring.

6. The method of cleaning a liquid ejection head according to claim 1 ,
wherein the opposing electrode wiring is disposed so as to be in contact with the liquid inside the liquid chamber, and
wherein the heating of the opposing electrode wiring is performed in a state in which the liquid inside the liquid chamber is discharged.

7. The method of cleaning a liquid ejection head according to claim 1 ,
wherein the opposing electrode wiring is disposed so as to be in contact with the liquid inside the liquid chamber, and
wherein the heating of the opposing electrode wiring is performed while replacing the liquid inside the liquid chamber.

8. The method of cleaning a liquid ejection head according to claim 1 , wherein the opposing electrode wiring is formed of a material containing Ta or Nb.

9. A recording apparatus configured to perform recording through use of a liquid ejection head, the liquid ejection head comprising:
a liquid ejection orifice;
a liquid chamber communicating with the liquid ejection orifice;
a first electrothermal conversion portion disposed in the liquid chamber;
a protective layer having an insulating property and being configured to prevent contact between the first electrothermal conversion portion and liquid inside the liquid chamber;
an upper electrode covering at least a heat generation portion of the protective layer, which is heated by the first electrothermal conversion portion, and being formed of a material containing a metal to be dissolved through an electrochemical reaction with the liquid;
an opposing electrode; and
an opposing electrode wiring connected to the opposing electrode, the opposing electrode wiring being located at a periphery of the opposing electrode so as to be in contact with the liquid,
the recording apparatus comprising:
a cleaning unit configured to remove kogation, which is deposited on a surface of the upper electrode, through dissolution of the upper electrode, which is caused by applying a voltage between the upper electrode and the opposing electrode; and
a unit configured to heat the opposing electrode wiring.

10. The recording apparatus according to claim 9 , wherein the unit configured to heat the opposing electrode wiring comprises:
a second electrothermal conversion portion disposed in the liquid ejection head at a position below the opposing electrode through intermediation of the protective layer; and
a circuit configured to drive the second electrothermal conversion portion.

11. The recording apparatus according to claim 10 ,
wherein a part of the circuit configured to drive the second electrothermal conversion portion is disposed inside the liquid ejection head, and
wherein another part of the circuit, which is different from the part disposed inside the liquid ejection head, is disposed outside the liquid ejection head.

12. The recording apparatus according to claim 9 , further comprising a unit configured to suck the liquid inside the liquid chamber from the liquid ejection orifice.

Assignees

• Canon Kk

Inventors

• Kato Maki
• Saito Ichiro
• Misumi Yoshinori
• Matsui Takahiro
• Ishida Yuzuru
• Yoshinari Norihiro
• Goto Akio
• Koike Atsushi

Classifications

• B41J2/14056

  Plural heating elements per ink chamber · CPC title

• B41J2/14016

  Structure of bubble jet print heads · CPC title

• B41J2/14072

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2/14129 Primary

  Layer structure · CPC title

• B41J2/165

  Prevention {or detection} of nozzle clogging, e.g. cleaning, capping or moistening for nozzles · CPC title