Laminated body and method for separating laminated body

Patent metadata

Field	Value
Publication number	US-9682532-B2
Application number	US-201113880803-A
Country	US
Kind code	B2
Filing date	Oct 19, 2011
Priority date	Oct 29, 2010
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member.

First claim

What is claimed is:

1. A laminate comprising:
a supporting member which is light transmissive;
a supported substrate which is supported by the supporting member;
an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and
a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, wherein
a property of the polymer is changed when the polymer absorbs light irradiated via the supporting member,
the repeating unit, the polymer, or the structure is represented by one of the following formulas:

wherein 1 is an integer not less than 1; m is 0 or an integer of 1 to 2; X, in Formulas (a) through (e), (i) is one of the following Formulas (1), (3), (4) and (5) or (ii) is bound to one of the following Formulas (1), (3), (4) and (5) via a linkage constituted by a C1-C5 alkylene moiety, an ester bond, an ether bond, or a combination of the C1-C5 alkylene moiety, the ester bond, and the ether bond; X, in Formula (f), is one of the following Formulas (1), (2), (3), (4), and (5) or is absent;

each R is independently an alkyl group, an aryl group, a halogen, a hydroxyl group, a ketone group, a sulfoxide group, a sulfone group, or —N(R 1 )(R 2 ), where each of R 1 and R 2 is independently a hydrogen atom or a C1-C5 alkyl group; each of Y 1 and Y 2 is independently —CO— or —SO 2 —; Z is absent or is —CO—, —SO 2 —, or —SO—; and n is 0 or an integer of 1 through 5, the polymer containing the structure represented by the Formula (f) contains the structure in the main chain of the polymer, and with the proviso that in the repeating unit represented by the Formula (b),
(i) when X is the Formula (5),
(ia) each R is independently an aryl group, a halogen, a ketone group, a sulfoxide group, or a sulfone group; Z is absent or is —SO—; and n of (R) n in the left phenyl group of the Formula (5) is 5, or
(ib) each R is independently a halogen, a hydroxyl group, a ketone group, a sulfoxide group, a sulfone group, or —N(R 1 )(R 2 ); Z is —CO—, —SO 2 —, —SO—, or —NH—; and n is 1 or 4, or

(ii) when X is bound to the Formula (5) via a linkage constituted by an ester bond, an ether bond, or a combination of a C1-C5 alkylene moiety, the ester bond, and the ether bond, each R is independently a halogen, a hydroxyl group, a ketone group a sulfoxide group, a sulfone group, or —N(R 1 )(R 2 ); Z is —CO—, —SO 2 —, —SO—, or —NH—; and n is 1 or 4.

2. The laminate as set forth in claim 1 , wherein: the structure absorbs light of a wavelength in a range of 300 nm to 370 nm.

3. The laminate as set forth in claim 1 , wherein: the release layer is provided between the supporting member and the adhesive layer.

4. A method for separating the supporting member from the supported substrate of the laminate as set forth in claim 1 , comprising irradiating light to the release layer via the supporting member so as to change the property of the polymer.

Assignees

• Kubo Atsushi
• Imai Hirofumi
• Tamura Koki
• Yoshioka Takahiro
• Fujii Yasushi
• Inao Yoshihiro
• Tokyo Ohka Kogyo Co Ltd

Inventors

• Kubo Atsushi
• Imai Hirofumi
• Tamura Koki
• Yoshioka Takahiro
• Fujii Yasushi
• Inao Yoshihiro

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title