Fixation of heat sink on SFP/XFP cage

Patent metadata

Field	Value
Publication number	US-9681583-B2
Application number	US-201314387451-A
Country	US
Kind code	B2
Filing date	Sep 23, 2013
Priority date	Sep 23, 2013
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

First claim

The invention claimed is:

1. A heat sink assembly including:
a heat sink having a base and fins extending from the base; and
a spring clip disposed on the heat sink between the fins, the spring clip including (a) a first tab that forms a first angle with respect to the base of the heat sink, (b) a second tab that forms a second angle with respect to the base of the heat sink, and (c) a serpentine portion, interposed between the first tab and the second tab, and extending in its entirety in a plane that is substantially parallel to an upper surface of the base of the heat sink,
wherein the first tab and the second tab are respectively compressible in a direction toward the base of the heat sink.

2. The heat sink assembly according to claim 1 , wherein the heat sink includes a raised portion extending from a lower side of the base that is opposite from an upper side of the base from which the fins extend.

3. The heat sink assembly according to claim 2 , wherein the raised portion is off-center along the lower side of the base.

4. The heat sink assembly according to claim 2 , wherein the raised portion has a beveled front edge and a beveled rear edge.

5. The heat sink assembly according to claim 2 , wherein the raised portion is surrounded by a bezel.

6. The heat sink assembly according to claim 1 , wherein the spring clip is constructed to be compressed by deflecting the first tab by a first angular amount and by deflecting the second tab by a second angular amount such that a first torque exerted on the first tab and a second torque exerted on the second tab are substantially equal and opposite.

7. The heat sink assembly according to claim 1 , wherein the heat sink assembly is mountable on a cage, and
wherein the cage includes one of an SFP and an XFP cage.

8. The heat sink assembly according to claim 1 , wherein the heat sink has a retention slot formed between at least some of the fins which is constructed to receive at least a portion of a cover fixed to a circuit board.

9. A heat sink attachment system comprised of:
a circuit board having one or more cages mounted thereto, each cage having an upper surface formed with an opening therethrough; and
a heat sink assembly mountable on at least a respective one of the cages, the heat sink assembly including:
a heat sink having a base and fins extending from the base, and
a spring clip disposed on the heat sink between the fins, the spring clip including (a) a first tab that forms a first angle with respect to the base of the heat sink, (b) a second tab that forms a second angle with respect to the base of the heat sink, and (c) a serpentine portion, interposed between the first tab and the second tab, and extending in its entirety in a plane that is substantially parallel to an upper surface of the base of the heat sink,
wherein the first tab and the second tab are respectively compressible in a direction toward the base of the heat sink.

10. The heat sink attachment system according to claim 9 , wherein the circuit board includes a retaining member extending across a front edge of the circuit board, the retaining member retaining the first tab in a compressed state when the heat sink assembly is mounted on at least the respective one of the cages.

11. The heat sink attachment system according to claim 9 , wherein the circuit board includes an anchor constructed to retain the second tab in a compressed state when the heat sink assembly is mounted on the respective one of the cages.

12. The heat sink attachment system according to claim 9 , further comprising a cover having a wall insertable in a retention slot formed between at least some of the fins of the heat sink to limit movement of the heat sink with respect to the cage.

13. The heat sink attachment system according to claim 12 , wherein the cover has one or more ventilation openings formed therein.

14. The heat sink attachment system according to claim 10 , wherein the spring clip is constructed to be compressed by deflecting the first tab by a first angular amount and by deflecting the second tab by a second angular amount such that a first torque exerted on the first tab and a second torque exerted on the second tab are substantially equal and opposite.

15. The heat sink attachment system according to claim 14 , wherein the spring clip is constructed to force the heat sink into a seated position in an opening of a respective one of the cages when a module is not present in the cage and to force the heat sink into contact with the module when the module is present in the cage.

16. The heat sink attachment system according to claim 15 , wherein when the heat sink is in a seated position, at least one portion of the heat sink extends through the opening of the cage and into the cage.

17. A procedure for mounting a heat sink, the procedure comprising:
placing a heat sink assembly on a cage of a circuit board, the heat sink assembly including a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins, the spring clip including (a) a first tab that forms a first angle with respect to the base of the heat sink, (b) a second tab that forms a second angle with respect to the base of the heat sink, and (c) a serpentine portion, interposed between the first tab and the second tab, and extending in its entirety in a plane that is substantially parallel to an upper surface of the base of the heat sink, wherein the first tab and the second tab are respectively compressible in a direction toward the base of the heat sink; and
securing the first tab and the second tab to the circuit board.

18. The procedure according to claim 17 , further comprising:
inserting a cover into a retention slot formed between at least some of the fins of heat sink; and
coupling the cover to the circuit board.

Assignees

• Tellabs Operations Inc
• Coriant Operations Inc

Inventors

• Lei Zhen
• Ba Qinzhen
• Duan Zongxian
• Yu Huihui

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/641 Primary

  Snap-on arrangements, e.g. clips · CPC title

• H05K7/20409 Primary

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H01L23/3677

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic