Printed circuit board security using embedded photodetector circuit

Patent metadata

Field	Value
Publication number	US-9680477-B2
Application number	US-201414574510-A
Country	US
Kind code	B2
Filing date	Dec 18, 2014
Priority date	Dec 15, 2014
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

Systems and methods to obstruct analysis of a microchip may include an electrical component of a microchip and a photodetector positioned within the microchip. The photodetector may be configured to sense electromagnetic radiation. Circuitry in electrical communication with the photodetector may be configured to initiate an action to obstruct analysis of the electrical component in response to a change in a level of the electromagnetic radiation.

First claim

The invention claimed is:

1. An apparatus comprising:
an electrical component of a microchip;
a photodetector positioned within the microchip and configured to sense electromagnetic radiation comprising light radiated from one or more light sources;
a first light source of the one or more light sources, the first light source positioned within the microchip; and
circuitry in electrical communication with the photodetector and configured to initiate an action to obstruct analysis of the electrical component in response to a change in a level of the sensed electromagnetic radiation.

2. The apparatus of claim 1 , wherein the electromagnetic radiation comprises ambient light emanating from a second light source of the one or more light sources and positioned outside of the microchip.

3. The apparatus of claim 1 , wherein the photodetector comprises a layer of photosensitive material.

4. The apparatus of claim 1 , further comprising a light containment layer positioned between the photodetector and the first light source.

5. The apparatus of claim 1 , wherein the photodetector is sandwiched between first and second light containment layers.

6. The apparatus of claim 3 , further comprising an optically transparent laminate layer proximate to the first light source.

7. The apparatus of claim 1 , further comprising a layer of light waveguide material configured to guide the electromagnetic radiation to the photodetector.

8. The apparatus of claim 1 , wherein the electromagnetic radiation comprises light emanating from the first light source.

9. The apparatus of claim 1 , wherein the electromagnetic radiation comprises visible light.

10. The apparatus of claim 1 , wherein the electromagnetic radiation comprises ambient light emanating from outside of the microchip and light generated from within the microchip.

11. The apparatus of claim 1 , wherein the defensive action includes an operation selected from a group consisting of at least one of: a shutdown operation, a spoofing operation, and a self-destruct operation.

12. The apparatus of claim 1 , wherein a change in a level of the sensed electromagnetic radiation comprises determining that a second light level of the sensed electromagnetic radiation is different than a stored first light level.

13. The apparatus of claim 12 , wherein determining that a second light level of the sensed electromagnetic radiation is different than a stored first light level comprises determining that a difference between the second light level and the stored first light level exceeds a predetermined threshold.

14. An integrated circuit comprising:
an electrical component disposed at a first layer;
at least one photodetector configured to sense light radiated from one or more light sources;
a second layer disposed between the at least one photodetector and a first light source, the second layer comprising a light containment material; and
circuitry communicatively coupled with the at least one photodetector and configured to:
identify, responsive to at least a predetermined change in the sensed light, that an exploitation event has occurred, and
initiate, responsive to identifying that an exploitation event has occurred, a predefined action to obstruct analysis of the electrical component.

15. The integrated circuit of claim 14 , wherein identifying that an exploitation event has occurred comprises determining, using the at least one photodetector, that light from the first light source has broken through the second layer.

16. The integrated circuit of claim 14 , wherein the predefined action includes an operation selected from a group consisting of at least one of: a shutdown operation, a spoofing operation, and a self-destruct operation.

17. The integrated circuit of claim 14 , further comprising:
a third layer comprising the at least one photodetector.

18. The integrated circuit of claim 17 , wherein the first layer comprises an optically transparent laminate material, and wherein the first light source is disposed at the first layer.

19. The integrated circuit of claim 18 , further comprising:
a fourth layer disposed between the third layer and a second light source, the fourth layer comprising a light containment material.

20. The integrated circuit of claim 19 , wherein the second light source is external to the integrated circuit.

Assignees

• IBM

Inventors

• Bartley Gerald K
• Becker Darryl J
• Doyle Matthew S
• Maxson Mark O

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K1/0275

  Security details, e.g. tampering prevention or detection · CPC title

• H03K19/17768 Primary

  for security · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title