Header apparatus for providing electrical connection to a printed circuit board, and daughter card and circuit assembly incorporating the header apparatus

Patent metadata

Field	Value
Publication number	US-9680244-B1
Application number	US-201514848505-A
Country	US
Kind code	B1
Filing date	Sep 9, 2015
Priority date	Sep 9, 2014
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A header apparatus for providing electrical connection between a daughter card and a printed circuit board. The header apparatus may include a body having a base and a backing portion extending outwardly from the base portion. The header apparatus may include at least one pin extending through the base in a direction substantially parallel to the backing portion, and a gap formed between opposing surfaces of the backing portion and the at least one pin. The header apparatus may be configured to receive at least a portion of the daughter card at the gap to connect the header apparatus and the daughter card. The header apparatus may be connected to a daughter card and/or main printed circuit board, and may communicatively couple the daughter card and main printed circuit board.

First claim

What is claimed is:

1. A header apparatus for providing electrical connection between a daughter card and a printed circuit board, the header apparatus comprising:
a body comprising:
a base; and
a backing portion extending outwardly from the base;

at least one pin extending through the base in a direction substantially parallel to the backing portion;
a gap defined between opposing surfaces of the backing portion and the at least one pin, wherein the header is configured to receive at least a portion of the daughter card within the gap to connect the header and the daughter card; and
at least one shim extending outwardly from the backing portion towards the at least one pin, wherein the at least one shim is configured to cause at least a portion of the daughter card to be placed in contact with a surface of the at least one pin when the at least a portion of the daughter card is received by the header apparatus.

2. The header apparatus of claim 1 , wherein the at least one pin is configured to attach to the daughter card by a mounting process used to attach surface mount components of the daughter card to the daughter card.

3. The header apparatus of claim 2 , wherein the mounting process is includes a reflow soldering process.

4. The header apparatus of claim 1 , wherein the header apparatus is configured to attach to a main printed circuit board (PCB) at an opposing end of the at least one pin from the daughter card.

5. The header apparatus of claim 1 , wherein the header apparatus is configured to attach to a main printed circuit board (PCB) by inserting at least a portion of the at least one pin into a through-hole connector of the main PCB.

6. The header apparatus of claim 1 , wherein the header apparatus further comprises a keying post extending outwardly from the backing portion, the keying post being configured to correspond to a characteristic of the daughter card.

7. The header apparatus of claim 6 , wherein the keying post is configured to align the at least one pin with the daughter card for connecting to the header apparatus and the daughter card.

8. The header apparatus of claim 6 , wherein the characteristic of the daughter card is at least one of a size, a shape, and a location of an element of the daughter card corresponding to the keying post.

9. The header apparatus of claim 1 , wherein the at least one pin is configured to be inserted through a hole formed during a molding process of the header apparatus.

10. The header apparatus of claim 9 , wherein the at least one pin is configured to connect to the header apparatus according to a press fit method.

11. A daughter card having a header connected thereto, the daughter card being configured to connect to a main printed circuit board (PCB), the daughter card comprising:
the header comprising
a body comprising
a base, and
a backing portion extending outwardly from the base,

at least one pin extending through the base in a direction substantially parallel to the backing portion,
a gap defined between opposing surfaces of the backing portion and the at least one pin, wherein the header is configured to receive at least a portion of the daughter card within the gap to connect the header and the daughter card, and
at least one shim extending outwardly from the backing portion towards the at least one pin, wherein the at least one shim is configured to cause at least a portion of the daughter card to be placed in contact with a surface of the at least one pin when the at least a portion of the daughter card is received by the header; and

a circuit board comprising:
at least one component,
a bus, and

a connection interface communicatively coupled to the at least one component via the bus, wherein the connection interface is connected to the header.

12. The daughter card of claim 11 , wherein the at least one component is a surface mounted component, and wherein the at least one pin is configured to attach to the daughter card by a mounting process used to attach the at least one component to the daughter card.

13. The daughter card of claim 12 , wherein the mounting process is a reflow soldering process.

14. The daughter card of claim 11 , wherein after the header is attached to the daughter card, the header is configured to attach to the main PCB at an opposing end of the at least one pin from the daughter card to interconnect the daughter card and the main PCB.

15. The daughter card of claim 11 , wherein the header is configured to attach to the main PCB by inserting at least a portion of the at least one pin into a through-hole connector of the main PCB.

16. The daughter card of claim 11 , wherein the header further comprises a keying post configured to correspond to a characteristic of the circuit board.

17. The daughter card of claim 16 , wherein the keying post is configured to align the at least one pin with the daughter card for connecting to the header and the daughter card.

Assignees

• Universal Lighting Tech Inc
• Universal Lighting Tech Inc

Inventors

• Dernovsek John J
• Folker Donald
• Leblanc Mike

Classifications

• H01R2107/00

  Four or more poles · CPC title

• H01R12/716 Primary

  Coupling device provided on the PCB · CPC title

• H01R24/66

  with pins, blades or analogous contacts and secured to apparatus or structure, e.g. to a wall · CPC title

• H01R12/57 Primary

  surface mounting terminals · CPC title

• H01R12/7052

  characterised by the locating members · CPC title