Method for producing a radiation-emitting semiconductor component

Patent metadata

Field	Value
Publication number	US-9680048-B2
Application number	US-201314378643-A
Country	US
Kind code	B2
Filing date	Jan 10, 2013
Priority date	Feb 15, 2012
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A method for producing a radiation-emitting semiconductor component is provided, comprising the following steps: —providing a growth substrate ( 1 ), —depositing a nucleation layer ( 2 ) on the growth substrate ( 1 ), —applying a structured dielectric layer ( 3 ) to the nucleation layer ( 2 ), —applying an epitaxial layer ( 4 ) by means of a FACELO process to the structured dielectric layer ( 3 ), —epitaxial growth of an epitaxial layer sequence ( 5 ) on the epitaxial layer ( 4 ), wherein the epitaxial layer sequence ( 5 ) comprises an active zone ( 6 ) that is suitable for producing electromagnetic radiation.

First claim

The invention claimed is:

1. A method for producing a radiation-emitting semiconductor component comprising the following steps:
providing a growth substrate;
depositing a nucleation layer formed from aluminum nitride on the growth substrate by sputtering;
applying a structured dielectric layer to the nucleation layer;
applying an epitaxial layer on the structured dielectric layer by means of a FACELO method; and
epitaxially growing an epitaxial layer sequence onto the epitaxial layer,
wherein the epitaxial layer sequence comprises an active zone suitable for generating electromagnetic radiation, and
wherein the structured dielectric layer serves as a hard mask in an etching process.

2. The method according to claim 1 , wherein applying the structured dielectric layer to the nucleation layer comprises the following steps:
depositing the dielectric layer over the whole area on the nucleation layer; and
structuring the dielectric layer by means of photolithography.

3. The method according to claim 1 , wherein the dielectric structured layer has openings in the structured layer as structure elements, the openings completely penetrating through the structured dielectric layer and the etching process etches a layer beneath the hard mask through the openings.

4. The method according to claim 3 , wherein the structure elements are embodied in circular, hexagonal, rectangular or dodecagonal fashion.

5. The method according to claim 1 , wherein the dielectric structured layer has islands as structure elements, the islands being arranged in a manner spaced apart from one another laterally.

6. The method according to claim 1 , wherein the structure elements have a diameter that is not greater than 5 μm.

7. The method according to claim 1 , wherein the structure elements are at a lateral distance from one another that is between 1 μm and 10 μm inclusive.

8. The method according to claim 1 , wherein the structure elements are arranged along a regular pattern.

9. The method according to claim 1 , wherein the structure elements are arranged in accordance with a two-dimensional hexagonal lattice.

10. The method according to claim 1 , wherein a carrier is applied to the epitaxial layer sequence, and wherein the growth substrate is subsequently removed.

11. The method according to claim 10 , wherein the nucleation layer is likewise removed again after the removal of the growth substrate or simultaneously with the growth substrate.

12. The method according to claim 1 , wherein during the etching process regular three-dimensional structures are produced as radiation coupling-out structures in the surface of the epitaxial semiconductor layer sequence.

13. The method according to claim 12 , wherein the three-dimensional structures have the shape of a pyramid or of a truncated pyramid.

14. The method according to claim 1 , wherein the structured dielectric layer is structured again before the etching process.

15. The method of claim 1 , wherein a carrier is applied to a top side of the epitaxial layer sequence that is opposite to the growth substrate, and the growth substrate and the nucleation layer are subsequently removed, wherein after removal of the growth substrate, the dielectric layer is freely accessible from an underside, lying opposite to the top side.

16. The method according to claim 1 , wherein the epitaxial layer and the epitaxial layer sequence comprise gallium nitride.

17. The method of claim 1 , wherein the dielectric layer is applied to the nucleation layer by sputtering.

18. The method according to claim 1 , wherein a carrier is applied to the epitaxial layer sequence, and the growth substrate is subsequently removed by a laser lift off process.

19. A method for producing a radiation-emitting semiconductor component comprising the following steps:
providing a growth substrate;
depositing a nucleation layer on the growth substrate;
applying a structured dielectric layer to the nucleation layer;
applying an epitaxial layer comprising gallium nitride on the structured dielectric layer by means of a FACELO method, such that the epitaxial layer forms a closed surface over the entire structured dielectric layer; and
epitaxially growing an epitaxial layer sequence onto the epitaxial layer,
wherein the epitaxial layer sequence comprises an active zone suitable for generating electromagnetic radiation,
wherein the structured dielectric layer serves as a hard mask in an etching process, and
wherein the structured dielectric layer serves as a hard mask in the FACELO method and in an etching process, the etching process etches a layer beneath the hard mask.

20. The method according to claim 19 , wherein a carrier is applied to the epitaxial layer sequence, and wherein the growth substrate is subsequently removed.

21. A method for producing a radiation-emitting semiconductor component comprising the following steps:
providing a growth substrate;
depositing a nucleation layer on the growth substrate;
applying a structured dielectric layer to the nucleation layer;
applying an epitaxial layer comprising gallium nitride on the structured dielectric layer by means of a FACELO method, such that the epitaxial layer forms a closed surface over the entire structured dielectric layer; and
epitaxially growing an epitaxial layer sequence onto the epitaxial layer,
wherein the epitaxial layer sequence comprises an active zone suitable for generating electromagnetic radiation,
wherein the structured dielectric layer serves as a hard mask in an etching process, and
wherein during the etching process, regular three-dimensional structures are produced as radiation coupling-out structures in the surface of the epitaxial layer sequence.

22. The method according to claim 21 , wherein at least a majority of the radiation coupling-out structures have the same height and the same base area within the scope of production and measurement tolerances.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Hertkorn Joachim
• Zini Lorenzo

Classifications

• H01L33/005 Primary

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic

• H01L33/0079

  Electricity · mapped topic

• H01L33/22

  Electricity · mapped topic