Package structures and methods for forming the same

Patent metadata

Field	Value
Publication number	US-9679836-B2
Application number	US-201113298102-A
Country	US
Kind code	B2
Filing date	Nov 16, 2011
Priority date	Nov 16, 2011
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A solder region is disposed in the polymer region and electrically coupled to the redistribution line. The solder region includes a second flat top surface not higher than the first flat top surface.

First claim

What is claimed is:

1. A device comprising:
a bottom package comprising:
a redistribution line forming a first recess and a second recess, with an entirety of the redistribution line formed of a non-solder conductive material, wherein the redistribution line comprises:
a first end portion comprising a portion underlying the first recess, and additional portions forming sidewalls of the first recess;
a second end portion higher than the first end portion; and

a polymer region molded over the redistribution line, wherein the polymer region comprises a flat top surface, and the polymer region extends into the second recess;
a device die molded in the polymer region, wherein the device die overlaps, and is bonded to, the second end portion of the redistribution line; and
a solder region comprising a portion in the polymer region, wherein the solder region extends into the first recess and is in contact with a bottom and sidewalls of the first end portion; and

a top package bonded to the bottom package through the solder region.

2. The device of claim 1 , wherein the top package comprises:
a package substrate; and
a device die bonded to the package substrate.

3. The device of claim 1 , wherein a top surface of the device die is lower than the flat top surface.

4. The device of claim 1 , wherein a back surface of the device die is coplanar with the flat top surface of the polymer region.

5. The device of claim 1 , wherein the redistribution line is in a top redistribution layer of a plurality of redistribution layers, and wherein the device further comprises a connector attached to a bottom layer of the plurality of redistribution layers.

6. The device of claim 1 , wherein the redistribution line further comprises:
an intermediate portion having a first end physically connected to the first end portion, and a second end physically connected to the second end portion, wherein an entire top surface of the intermediate portion of the redistribution line that continuously connects the first end portion to the second end portion of the redistribution line is in physical contact with the polymer region.

7. The device of claim 1 , wherein the polymer region comprises:
a first flat top surface;
a recess extending from the first flat top surface to a second flat top surface of the solder region; and
a curved sidewall surface in the recess, wherein the curved sidewall surface of the polymer region has a first end connected to the first flat top surface, and a second end connected to the second flat top surface.

8. A device comprising:
a bottom package comprising:
a redistribution line forming a first recess and a second recess, wherein the redistribution line comprises a first portion underlying the first recess, and second portions forming sidewalls of the first recess;
a molding compound molded over the redistribution line, wherein the molding compound comprises a flat top surface, and the molding compound extends into the second recess;
a solder region comprising:
a first portion in the molding compound, wherein the solder region extends into the first recess and is in contact with a top surface of the first portion and sidewall surfaces of the second portions of the first recess; and
a second portion over the flat top surface, wherein the first portion and the second portion of the solder region are continuously connected to each other, and the first portion of the solder region is in physical contact with the second portion of the solder region;

a die over and bonded to the redistribution line through flip-chip bonding, wherein the die is located in the molding compound, wherein a top surface of the die is not higher than the flat top surface; and

a top package bonded to the bottom package through the solder region.

9. The device of claim 8 , wherein the top surface of the die is lower than the flat top surface.

10. The device of claim 8 , wherein the top surface of the die is level with the flat top surface.

11. The device of claim 8 , wherein no non-solder region separates the first portion and the second portion of the solder region from each other.

12. The device of claim 8 , wherein the redistribution line comprises:
a first end portion overlapped by, and bonded to, the die;
a second end portion, with the first recess in the second end portion; and
an intermediate portion having a first end physically connected to the first end portion, and a second end physically connected to the second end portion, wherein an entire top surface of the intermediate portion of the redistribution line that continuously connects the first end portion to the second end portion of the redistribution line is in physical contact with the molding compound.

13. A device comprising:
a bottom package comprising:
a redistribution line forming a first recess and a second recess, with an entirety of the redistribution line formed of a non-solder conductive material, wherein the redistribution line comprises:
a first end portion comprising a portion underlying the first recess, and additional portions forming sidewalls of the first recess;
a second end portion higher than the first end portion; and

a polymer region molded over and in physical contact with the redistribution line, wherein the polymer region comprises a flat top surface, and the polymer region extends into the second recess;
a device die molded in the polymer region, wherein the device die overlaps, and is bonded to, the second end portion of the redistribution line, wherein the flat top surface of the polymer regions extends to opposite sides of the device die, and forms a continuous top surface with a top surface of the device die; and
a solder region comprising a portion in the polymer region, wherein the solder region extends into the first recess and is in contact with a bottom and sidewalls of the first end portion; and

a top package bonded to the bottom package through the solder region.

14. The device of claim 13 , wherein the top package comprises:
a package substrate; and
a device die bonded to the package substrate.

15. The device of claim 13 further comprising an additional solder region bonding the top package to the bottom package, wherein the polymer region is further in contact with the additional solder region.

16. The device of claim 13 , wherein the redistribution line is in a top redistribution layer of a plurality of redistribution layers, and wherein the device further comprises a connector attached to a bottom layer of the plurality of redistribution layers.

17. The device of claim 13 , wherein the redistribution line further comprises:
an intermediate portion having a first end physically connected to the first end portion, and a second end physically connected to the second end portion, wherein an entire top surface of the intermediate portion of the redistribution line that continuously connects the first end portion to the second end portion of the redistribution line is in physical contact with the polymer region.

18. The device of claim 13 , wherein the polymer region comprises:
a first flat top surface;
a recess extending from the first flat top surface to a second flat top surface of the solder region; and
a curved sidewall surface in the recess, wherein the curved sidewall surface of the polymer region has a first end connected to the first flat top surface, and a second end connected to the second flat top surface.

19. The device of claim 13 further comprising an additional solder region at a bottom of the bott

Assignees

• Hsiao Ching-Wen
• Cheng Ming-Da
• Lin Chih-Wei
• Chen Chen-Shien
• Chen Chih-Hua
• Kuo Chen-Cheng
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hsiao Ching-Wen
• Cheng Ming-Da
• Lin Chih-Wei
• Chen Chen-Shien
• Chen Chih-Hua
• Kuo Chen-Cheng

Classifications

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00

  Package configurations · CPC title