Copper wire rod and magnet wire

US9679676B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9679676-B2
Application numberUS-201314419398-A
CountryUS
Kind codeB2
Filing dateAug 29, 2013
Priority dateAug 31, 2012
Publication dateJun 13, 2017
Grant dateJun 13, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A copper wire rod with an excellent surface quality and a magnet wire, in which the occurrence of blister defects is suppressed, are provided. The copper wire rod has a composition consisting of: more than 10 ppm by mass and 30 ppm by mass or less of P; 10 ppm by mass or less of O; 1 ppm by mass or less of H; and the balance Cu and inevitable impurities, wherein hydrogen concentration after performing a heat treatment at 500° for 30 minutes in vacuum is 0.2 ppm by mass or less. The magnet wire includes: a drawn wire material produced by using the copper wire rod; and an insulating film coating an outer periphery of the drawn wire material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A copper wire rod produced by continuous casting and rolling, the copper wire rod made of a composition consisting of: more than 10 ppm by mass and 30 ppm by mass or less of P; 10 ppm by mass or less of O; 1 ppm by mass or less of H; and the Cu balance and inevitable impurities, wherein when a heat treatment is performed on the copper wire rod at 500° C. for 30 minutes in vacuum, the concentration of the H (hydrogen) becomes 0.2 ppm by mass or less, an electrical conductivity of the copper wire rod is 100% IACS or more, and crystals, <111> orientations of which are oriented within a range of ±10° with respect to a drawing direction of the copper wire, are 30% or less of all crystals in a cross-section perpendicular to the drawing direction of the copper wire, the copper wire rod being fully softened by annealing after cold working with cross-section reduction rate of 20% or more. 2. The copper wire rod according to claim 1 , wherein crystals, <100> orientations of which are oriented within a range of ±10° with respect to the drawing direction of the copper wire, is 10% or more of all crystals; and crystals, <111> orientations or <112> orientations of which are oriented within a range of ±10° with respect to the drawing direction, are 30% or less of the all crystals. 3. A magnet wire comprising: a drawn wire material produced by using the copper wire rod according to claim 1 ; and an insulating film coating an outer peripheral of the drawn wire material.

Assignees

Inventors

Classifications

  • C22C9/00Primary

    Alloys based on copper · CPC title

  • for plastic shaping of strands (rolling mills B21B1/46) · CPC title

  • Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums · CPC title

  • C22F1/00Primary

    Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

  • H01B7/00Primary

    Insulated conductors or cables characterised by their form · CPC title

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What does patent US9679676B2 cover?
A copper wire rod with an excellent surface quality and a magnet wire, in which the occurrence of blister defects is suppressed, are provided. The copper wire rod has a composition consisting of: more than 10 ppm by mass and 30 ppm by mass or less of P; 10 ppm by mass or less of O; 1 ppm by mass or less of H; and the balance Cu and inevitable impurities, wherein hydrogen concentration after per…
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification C22C9/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 13 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).